JP6810256B2 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6810256B2 JP6810256B2 JP2019520163A JP2019520163A JP6810256B2 JP 6810256 B2 JP6810256 B2 JP 6810256B2 JP 2019520163 A JP2019520163 A JP 2019520163A JP 2019520163 A JP2019520163 A JP 2019520163A JP 6810256 B2 JP6810256 B2 JP 6810256B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- heating element
- pipe
- pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 claims description 73
- 238000001816 cooling Methods 0.000 claims description 66
- 230000020169 heat generation Effects 0.000 claims description 16
- 238000001704 evaporation Methods 0.000 description 36
- 230000008020 evaporation Effects 0.000 description 26
- 230000005855 radiation Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- -1 copper Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
11 ヒートパイプ
11−1 第1ヒートパイプ
11−2 第2ヒートパイプ
13 一方の端部
14 他方の端部
16 交差部
17 中央部
20 放熱部
Claims (4)
- 発熱体と熱的に接続される受熱部と、該受熱部と所定の部位にて熱的に接続された、並列配置された複数のヒートパイプを有するヒートパイプ群と、該ヒートパイプ群の該所定の部位とは異なる他の部位と熱的に接続された放熱部と、を備え、
前記ヒートパイプ群のうち、前記所定の部位の少なくとも一部分または前記所定の部位の端部から該所定の部位の伸延方向に沿って延出させた仮想直線が前記発熱体の発熱密度の高い部分と平面視において重なり合う第1ヒートパイプの、前記他の部位が、前記所定の部位または前記所定の部位の端部から該所定の部位の伸延方向に沿って延出させた仮想直線が前記発熱体の発熱密度の高い部分と平面視において重なり合わない第2ヒートパイプの、前記他の部位よりも、前記ヒートパイプ群の冷却風の風上側に設けられ、
前記第1ヒートパイプの、前記所定の部位と前記他の部位との間に位置する中間部と、前記第2ヒートパイプの、前記所定の部位と前記他の部位との間に位置する中間部とが、平面視において交差している交差部を備えることで、前記他の部位における前記第1ヒートパイプと前記第2ヒートパイプの隣接する側部での対向関係が、前記所定の部位における前記第1ヒートパイプと前記第2ヒートパイプの隣接する側部での対向関係と逆になる部位を有し、前記対向関係が逆になる部位を有することで、前記第1ヒートパイプの前記他の部位が前記第2ヒートパイプの前記他の部位よりも、前記ヒートパイプ群の冷却風の風上側に設けられ、
前記第1ヒートパイプと前記第2ヒートパイプは、発熱密度の高い部分を有する同一の受熱部材と熱的に接続されているヒートシンク。 - 前記交差部において、前記第1ヒートパイプ及び/または前記第2ヒートパイプが扁平加工されている請求項1に記載のヒートシンク。
- 前記所定の部位が、前記ヒートパイプの長手方向における一方の端部であり、前記他の部位が、前記ヒートパイプの長手方向における他方の端部である請求項1または2に記載のヒートシンク。
- 前記所定の部位が、前記ヒートパイプの長手方向における中央部であり、前記他の部位が、前記ヒートパイプの長手方向における一方の端部及び他方の端部である請求項1または2に記載のヒートシンク。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018036148 | 2018-03-01 | ||
JP2018036148 | 2018-03-01 | ||
PCT/JP2019/008030 WO2019168146A1 (ja) | 2018-03-01 | 2019-03-01 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019168146A1 JPWO2019168146A1 (ja) | 2020-04-16 |
JP6810256B2 true JP6810256B2 (ja) | 2021-01-06 |
Family
ID=67806194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019520163A Active JP6810256B2 (ja) | 2018-03-01 | 2019-03-01 | ヒートシンク |
Country Status (4)
Country | Link |
---|---|
US (1) | US20200390003A1 (ja) |
JP (1) | JP6810256B2 (ja) |
CN (1) | CN214502173U (ja) |
WO (1) | WO2019168146A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210059073A1 (en) * | 2020-11-05 | 2021-02-25 | Intel Corporation | Heterogeneous heat pipes |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62117352A (ja) * | 1985-11-18 | 1987-05-28 | Toshiba Corp | 電力用半導体素子冷却器 |
JP2003336976A (ja) * | 2002-05-17 | 2003-11-28 | Furukawa Electric Co Ltd:The | ヒートシンクおよびその実装構造 |
US20070234741A1 (en) * | 2006-04-11 | 2007-10-11 | Tsung-Chu Lee | Heat radiator having a thermo-electric cooler and multiple heat radiation modules and the method of the same |
CN101370371B (zh) * | 2007-08-17 | 2011-06-08 | 富准精密工业(深圳)有限公司 | 散热模组及用于该散热模组的散热器 |
JP4357569B2 (ja) * | 2008-01-31 | 2009-11-04 | 株式会社東芝 | 電子機器 |
JP4693924B2 (ja) * | 2009-09-30 | 2011-06-01 | 株式会社東芝 | 電子機器 |
-
2019
- 2019-03-01 WO PCT/JP2019/008030 patent/WO2019168146A1/ja active Application Filing
- 2019-03-01 JP JP2019520163A patent/JP6810256B2/ja active Active
- 2019-03-01 CN CN201990000463.4U patent/CN214502173U/zh active Active
-
2020
- 2020-08-25 US US17/002,602 patent/US20200390003A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JPWO2019168146A1 (ja) | 2020-04-16 |
CN214502173U (zh) | 2021-10-26 |
US20200390003A1 (en) | 2020-12-10 |
WO2019168146A1 (ja) | 2019-09-06 |
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