CN2681342Y - 热管散热装置 - Google Patents

热管散热装置 Download PDF

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Publication number
CN2681342Y
CN2681342Y CNU2003201197809U CN200320119780U CN2681342Y CN 2681342 Y CN2681342 Y CN 2681342Y CN U2003201197809 U CNU2003201197809 U CN U2003201197809U CN 200320119780 U CN200320119780 U CN 200320119780U CN 2681342 Y CN2681342 Y CN 2681342Y
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heat
pipe
radiating
heat pipe
mentioned
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罗伟达
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNU2003201197809U priority Critical patent/CN2681342Y/zh
Priority to US10/948,519 priority patent/US7401642B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种热管散热装置，包括基座、热管及散热部。上述基座贴设在发热电子元件上。上述散热部包含两侧板和夹设在该两侧板之间的若干散热鳍片。上述热管的蒸发部与上述基座热性接合，上述热管的冷凝部与散热部的两侧板热性接合，从而将上述基座的热量传递到上述两侧板上。本实用新型传热速度快且均匀。

Description

热管散热装置
【技术领域】
本实用新型是关于一种散热装置，特别是一种可有效冷却电子元件的高效率热管散热装置。
【背景技术】
随着电子信息业不断发展，电子元件(尤为中央处理器)运行频率和速度在不断提升。但是，高频高速将使电子元件产生的热量随之增多，使得其温度不断升高，严重威胁着电子元件运行时的性能，为确保电子元件能正常运作，必须及时排出电子元件所产生的大量热量。
为此，业界通常使用如台湾专利申请第89214786、89213022号等所揭露的散热装置进行散热，这些现有散热装置均包括一散热体，该散热体包含一散热底座和设在底座上的若干散热鳍片，该散热底座底面为平滑的实体金属，是供贴设在中央处理器表面。而随着中央处理器体积越来越小，其发热也更加集中，因局限于金属的传热性能，散热底座中心处的热量往往过于集中，而无法有效传递到散热装置的四周，从而严重影响整体散热效果，使得中央处理器的性能下降，无法有效运算，甚至烧毁。
为克服上述问题，另有业者使用的散热装置如图1所示。该散热装置包括一基座100、竖立在基座100上的二U形热管200以及套设在二热管200两端部的若干平行散热鳍片300。该基座100底面与电子元件表面贴合，其上表面开设二凹槽102，该热管200底部是通过导热胶黏合或焊接在上述基座100凹槽102中。这些散热鳍片300上开设穿孔，供套设于热管200两端部上。电子元件产生的热量传递到基座100，然后通过热管200将热量传递到两端部的散热鳍片300上，最后通过散热鳍片300将热量散发到周围空气中，达到冷却电子元件的目的。但是，因通常使用的热管200直径较小，热管200穿设于散热鳍片300穿孔时与散热鳍片300接合紧密程度不均匀，且散热鳍片300较单薄，使得其与热管200接合处热传速度比较慢且不均匀，影响散热装置整体散热效果。
【发明内容】
本实用新型的目的在于提供一种散热效率高的热管散热装置。
本实用新型的目的是通过以下技术方案实现的：
本实用新型的热管散热装置，包括基座、热管及散热部。上述基座贴设在发热电子元件上。上述散热部包含两侧板和夹设在该两侧板之间的若干散热鳍片。上述热管的蒸发部与上述基座热性接合，上述热管的冷凝部与散热部的两侧板热性接合，从而将上述基座的热量传递到上述两侧板上。
本实用新型与先前技术相比具有如下优点：热管冷凝部热性接合在散热部的两侧板，由于热管的冷凝部直接与较厚的板体紧密接合，使得热管与板体之间的传热速度比较快且均匀，两侧板再通过若干散热鳍片将热量发散至周围，使得热管冷凝部的热量能够及时充分散发除去，提高了散热装置整体散热效率。
下面参照附图，结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是现有技术中一散热装置的立体图。
图2是本实用新型热管散热装置的立体图。
图3是本实用新型热管散热装置第一实施例的立体分解图。
图4是本实用新型热管散热装置第二实施例的立体分解图。
【具体实施方式】
请参阅图2及图3，本实用新型热管散热装置是用来安装在中央处理器(图未示)等发热电子元件上对其进行散热。该热管散热装置包括一基座10、一对与该基座10接触的U形热管20以及一与该对热管20接合的散热部30。
上述基座10一表面与中央处理器表面相贴合，其相对的另一表面上开设有半圆形凹槽12。每一热管20具有一水平底部22和两个竖直端部24，该热管20的底部22可通过导热胶粘接或锡膏焊接等方式贴合在该基座10的凹槽12内。该热管20内的工作流体在底部22受热蒸发，在端部24被冷凝，因此该底部22和端部24分别为热管20的蒸发部和冷凝部。
上述散热部30包含两侧板40以及设置在两侧板40之间的若干散热鳍片50，每一侧板40适当位置纵向开设一对穿孔42，上述每一热管20的两端部24可通过导热胶粘接或锡膏焊接等方式分别紧密容置在上述两侧板40的对应穿孔42中，每一侧板40外侧进一步设有一承载部44，用以承托扣具(图未示)，以将整个热管散热装置紧贴在电子元件表面。该承载部44外缘向上弯折出一挡片46，以防止扣具滑脱。上述每一散热鳍片50两端弯折形成一折边52，每一散热鳍片50两折边52分别贴合在两侧板40内表面，相邻两散热鳍片50间隔一段距离形成气流通道。
上述散热部30一侧可安装一散热风扇，以提高散热鳍片50与周围空气的热对流速度。
中央处理器工作时，其产生的热量传递到基座10，然后通过热管20将热量迅速传递到侧板40，最后若干散热鳍片50将热量散发到四周。
在上述实施例中，本实用新型热管散热装置的热管20为U形，其具有一蒸发部以及二冷凝部。请参阅图4，本实用新型热管散热装置的每一U形热管20也可用二L形的热管20’予以取代。每一热管20’具有一水平底部22’，即蒸发部，以及一竖直端部24’，即冷凝部。该底部22’贴合在上述基座10的凹槽12内，该端部24’穿设上述散热部30的侧板40穿孔42内。每一L形的热管20’可将基座10上的热量迅速传递到散热部30一侧板40，则本实用新型至少需要两个L形的热管20’。

Claims (7)

1.一种热管散热装置，包括基座、热管及散热部，其特征在于：上述散热部包括两侧板和夹设在该两侧板之间的若干散热鳍片，上述热管的蒸发部与上述基座热性接合，上述热管的冷凝部与散热部的两侧板热性接合，从而将上述基座的热量传递到该散热部两侧板上。
2.如权利要求1所述的热管散热装置，其特征在于：上述侧板适当位置开设有收容上述热管冷凝部的穿孔。
3.如权利要求1所述的热管散热装置，其特征在于：上述热管为至少一呈U形的热管，其具有一底部和二与底部垂直的端部，该底部和端部分别为热管的蒸发部和冷凝部。
4.如权利要求1所述的热管散热装置，其特征在于：上述热管为至少一对呈L形的热管，每一热管具有一底部和一与底部垂直的端部，该底部和端部分别为热管的蒸发部和冷凝部。
5.如权利要求1所述的热管散热装置，其特征在于：上述基座上开设至少一供热管蒸发部贴设的凹槽。
6.如权利要求1所述的热管散热装置，其特征在于：上述侧板向外设有承载部，该承载部向上弯折出一挡片。
7.如权利要求1所述的热管散热装置，其特征在于：上述散热部进一步包括一安装在散热鳍片一侧用于辅助散热的风扇。
CNU2003201197809U 2003-12-19 2003-12-19 热管散热装置 Expired - Lifetime CN2681342Y (zh)

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CNU2003201197809U CN2681342Y (zh) 2003-12-19 2003-12-19 热管散热装置
US10/948,519 US7401642B2 (en) 2003-12-19 2004-09-22 Heat sink with heat pipes

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100456461C (zh) * 2005-06-04 2009-01-28 富准精密工业(深圳)有限公司 热管散热装置
CN102237322A (zh) * 2010-04-29 2011-11-09 Abb公司 安装基座

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
TWI266596B (en) * 2005-09-15 2006-11-11 Via Tech Inc Electronic apparatus and thermal dissipating module thereof
US7298620B2 (en) * 2005-12-08 2007-11-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7597133B2 (en) * 2005-12-25 2009-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM312705U (en) * 2006-11-09 2007-05-21 Golden Sun News Tech Co Ltd Assembly structure of fixing seat and heat pipe
TWM354101U (en) * 2008-08-15 2009-04-01 Asia Vital Components Co Ltd Unit of strengthening structure of heat sink module
US7967059B2 (en) * 2008-09-30 2011-06-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
CN102411413A (zh) * 2010-09-21 2012-04-11 鸿富锦精密工业（深圳）有限公司 散热装置
WO2014181221A2 (en) * 2013-05-08 2014-11-13 Ashwin Bharadwaj Heat sink

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
TW467312U (en) 2000-07-28 2001-12-01 Geng-Min Jou Structure improvement of heat sink for central processor
TW474558U (en) 2000-08-25 2002-01-21 Wen-Jen Wei Heat sink structure
CN2514400Y (zh) 2001-11-26 2002-10-02 宗敏 计算机散热装置
US6959755B2 (en) * 2002-01-30 2005-11-01 Kuo Jui Chen Tube-style radiator structure for computer
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
TWM241964U (en) * 2003-05-14 2004-08-21 Tai Sol Electronics Co Ltd Heat sink module
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
CN2657082Y (zh) * 2003-10-18 2004-11-17 鸿富锦精密工业（深圳）有限公司 热管散热装置
US7021368B2 (en) * 2003-11-12 2006-04-04 Cpumate Inc. Heat dissipating device with uniform heat points

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100456461C (zh) * 2005-06-04 2009-01-28 富准精密工业(深圳)有限公司 热管散热装置
CN102237322A (zh) * 2010-04-29 2011-11-09 Abb公司 安装基座

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Granted publication date: 20050223