CN1901174A - 热管散热装置 - Google Patents
热管散热装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
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- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
一种热管散热装置用于散发电子元件产生的热量,该热管散热装置包括一导热板、若干散热鳍片及与该导热板和该散热鳍片一端热接触的至少一热管,该热管呈弯曲形,该散热鳍片的中部设有一通孔,该热管包括一弯曲部,该弯曲部结合至该通孔且与该鳍片接触。本发明热管散热装置的热管与鳍片的边部和中部热接触,而将电子元件产生的热量均匀地分布于鳍片上,使该散热装置的散热能力得以提升。
Description
【技术领域】
本发明涉及一种散热装置,特别是指一种冷却电子元件的热管散热装置。
【背景技术】
随着电子产业不断发展,中央处理器等电子元件的运行速度和整体性能不断提升,其发热量随之增加,另一方面,电子元件的集成度日益深化,体积越来越小,故其发热问题也就更加突出,使得业界单纯使用金属实体散热的散热装置无法满足高端电子元件的散热需求。
为此,业界开始使用带有热管的散热装置。热管是主要由真空密封的管形壳体、壳体内壁上设置的毛细结构(如粉末烧结物、沟槽结构、丝网结构等)及其装入壳体内的适量工作液体(如水、酒精、丙酮等)组成。热管是通过工作液体受热、冷却进行气、液两相变化而吸、放热量而达到传热目的,由于热管的传热速度快且传热距离长而得到广泛应用。
通常,业界广泛使用如下所述的一种热管散热装置。该热管散热装置包括一导热板、设于该导热板上的若干鳍片及连接该导热板和该鳍片的二热管,每一热管呈“U”形,包括一蒸发段、一与该蒸发段平行的冷凝段及一连接该蒸发段和冷凝段的连接段,该蒸发段结合至导热板上,该冷凝段结合至鳍片的上边部。使用时,该导热板贴合至发热电子元件上,电子元件产生的热量由该导热板吸收,并通过该导热板传至热管的蒸发部和鳍片的下边部,热管的蒸发部所吸收的热量经由连接段及冷凝段到达鳍片的上边部而散发至周围空间。然而,热管仅有冷凝部接触鳍片的上边部,电子元件产生的热量由导热板和该冷凝部传至鳍片的上、下边部,由于鳍片材料热阻因素的影响,鳍片上、下端部的热量扩散至其它部位较为滞后,而使热量积聚于鳍片的上、下边部,导致鳍片上的热量分布不均匀,造成鳍片的利用率不高,散热装置的散热效果不理想。故该热管散热装置需进一步改进。
【发明内容】
以下通过实施例对本发明予以说明:
本发明一实施例中的热管散热装置用于散发电子元件产生的热量,该热管散热装置包括一导热板、若干散热鳍片及与该导热板和该散热鳍片一端热接触的至少一热管,该热管呈弯曲形,该散热鳍片的中部设有一开孔,该热管包括一弯曲部,该弯曲部结合至该开孔内且与该鳍片接触。
与现有技术相比,热管与鳍片的边部和中部热接触,而将电子元件产生的热量均匀地分布于鳍片上,使该热管散热装置的散热能力得以提升。
下面参照附图,结合实施例对本发明作进一步的描述。
【附图说明】
图1是本发明热管散热装置一实施例的立体分解图。
图2是图1的组装图。
图3是本发明热管散热装置另一实施例的立体分解图。
图4是图3的倒置组装图。
图5是本发明热管散热装置又一实施例的立体分解图。
图6是图5的倒置组装图。
【具体实施方式】
请参阅图1,该热管散热装置用来安装在电路板(图未示)上以对其上的中央处理器(图未示)等发热电子元件上进行散热。该热管散热装置包括二导热板10、设于该二导热板10之间的若干鳍片30及连接该二导热板10和鳍片30的三热管50。
该导热板10为一高导热性的金属板体,其大致为方形。该导热板10具有用于接触电子元件的下表面及与该下表面相对的上表面,该上表面均匀设有以结合热管50的横切面均为半圆形的三平行沟槽110。
每一鳍片30由金属薄片制成,其大致呈方形。每一鳍片30包括一本体310及由该本体310的上、下端缘垂直弯折延伸出的二折边320。该本体310的中部均匀设有并行的三纵长开孔,每一开孔的周向设有与折边320同向的环形折边,每一折边320于对应导热板10的沟槽110处形成三凹陷部。该若干鳍片30相互平行并垂直设于上述导热板10的上表面,其中,每一鳍片30的折边320抵接相邻鳍片30的本体310,本体310上相应的开孔形成结合热管50的通孔330,折边320上相应的凹陷部形成结合热管的凹槽340。
每一热管50呈弯曲形,包括位于两侧的二第一传热部和位于该二第一传热部之间的第二传热部。每一第一传热部呈“L”形,包括一第一传热段510和一第一连接段550。该第二传热部呈“U”形,包括二平行的第二传热段530和位于该二第二传热段530之间的第二连接段570。该第一传热段510、第二传热段530大致平行。第一连接段550从第一传热段510的端部垂直延伸而出而连接第一传热段510和第二传热段530。该第二连接部570从第二传热段530的端部垂直延伸而出而连接该二第二传热段530。热管50每一段的连接处大致呈弧形。
请参阅图2,每一热管50的二第一传热部的第一传热段510结合至导热板10的沟槽110和鳍片30的凹槽340内,且该第一传热段510的自由端突伸出该导热板10,第一连接段550位于鳍片30的一侧,从而该二第一传热部的第一传热段结合至鳍片30的两端部。每一热管50的第二传热部收容于鳍片30相对应的通孔330内,该第二连接段570突伸出该通孔330而位于鳍片30的另一侧,且二第二传热段530分别于该通孔330的上、下二端缘与每一鳍片30热接触。
工作时,其中一导热板10贴合至发热电子元件上,电子元件产生的热量由该导热板10吸收。部分热量由该导热板10直接传至鳍片30的下边部而散发至周围空间,部分热量由结合至该导热板10的热管50的第一传热段510吸收,继而通过第一连接段550传递至第二传热段530而到达鳍片30的中部而散发,未能与鳍片30充分进行热交换的热量进一步通过另一第一连接段550到达另一第一传热段510进而传至另一导热板10和鳍片30的上边部而散发至周围空间。
与现有技术相比,本实施例中,热管50的二第一传热段510、二第二传热段530分别接触鳍片30的上、下边部及中部,从而将电子元件产生的热量快速地传递至鳍片30的上、中、下不同部位,使热量均匀的分布于该鳍片30上,使该热管散热装置的散热能力得以较大提升。
请参阅图3和图4,其为本发明的另一实施例,该实施例与上述实施例的不同之处在于本实施例的热管散热装置还包括一导热板70,该导热板70的一表面均匀设有三平行沟槽710,三热管50的第二连接段570结合至该导热板70的沟槽710内。使用时,该导热板70贴合至发热电子元件上,电子元件产生的热量由该导热板70、热管50的第二连接段570吸收,进而通过第二传热段530、第一连接段550和第一传热段510传至鳍片30的中部、两边部而散发至周围空间。
请参阅图5和图6,其为本发明的又一实施例,该实施例与第一实施例不同之处在于本实施例的热管散热装置还包括二导热板90,每一导热板90一表面均匀设有三平行沟槽910,三热管50的第一连接段550对应结合至二导热板90的沟槽910内。使用时,该二导热板90贴合至二发热电子元件上,电子元件产生的热量由该二导热板90、热管50的第一连接段550吸收,进而通过第一传热段510、第二传热段530传至鳍片30的两边部、中部而散发至周围空间。
Claims (10)
1.一种热管散热装置,包括一导热板、若干散热鳍片及与该导热板和该散热鳍片一端接触的至少一热管,该热管呈弯曲形,其特征在于:该散热鳍片的中部设有一通孔,该热管包括一弯曲部,该弯曲部结合至该通孔且与该鳍片接触。
2.如权利要求1所述的热管散热装置,其特征在于:上述热管包括一结合于上述鳍片一端的第一传热段。
3.如权利要求2所述的热管散热装置,其特征在于:上述热管还包括一连接上述第一传热段和上述弯曲部的第一连接段,该第一连接段位于上述鳍片的一侧。
4.如权利要求3所述的热管散热装置,其特征在于:上述热管的弯曲部包括与上述鳍片热接触的二第二传热段和连接该二第二传热段的第二连接段。
5.如权利要求2、3或4所述的热管散热装置,其特征在于:上述导热板结合至鳍片的一端,上述第一传热段结合至该导热板上。
6.如权利要求5所述的热管散热装置,其特征在于:上述热管散热装置还包括一结合至上述鳍片的另一端的导热板,上述热管还包括一结合至该导热板的第一传热段,上述弯曲部位于该二第一传热段之间。
7.如权利要求4所述的热管散热装置,其特征在于:上述导热板结合至上述热管的第一连接段。
8.如权利要求7所述的热管散热装置,其特征在于:上述热管还包括一位于上述鳍片另一端的第一传热段及连接该第一传热段和相邻第二传热段的另一第一连接段,该热管散热装置还包括一结合至该第一连接段的导热板。
9.如权利要求4所述的热管散热装置,其特征在于:上述热管的第二连接段位于鳍片的另一侧,上述导热板结合至该第二连接段。
10.如权利要求7、8或9所述的热管散热装置,其特征在于:上述热管散热装置还包括分别结合至上述鳍片两端的二导热板,该热管还包括一第一传热段,该二第一传热段分别结合至该二导热板上。
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US11/164,458 US7331379B2 (en) | 2005-07-18 | 2005-11-23 | Heat dissipation device with heat pipe |
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CN101212885B (zh) * | 2006-12-27 | 2011-08-31 | 富准精密工业(深圳)有限公司 | 散热模组 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101291570B (zh) * | 2007-04-20 | 2011-06-29 | 富准精密工业(深圳)有限公司 | 热管散热装置及其制作方法 |
CN101304649B (zh) * | 2007-05-09 | 2010-10-06 | 富准精密工业(深圳)有限公司 | 散热装置及其风扇固定架 |
CN101662920B (zh) * | 2008-08-28 | 2012-06-13 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102074532A (zh) * | 2009-11-11 | 2011-05-25 | 富士通株式会社 | 热沉 |
CN107124850A (zh) * | 2016-02-25 | 2017-09-01 | 台达电子工业股份有限公司 | 射频放大系统及其散热装置 |
CN107124850B (zh) * | 2016-02-25 | 2019-11-29 | 台达电子工业股份有限公司 | 射频放大系统及其散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US7331379B2 (en) | 2008-02-19 |
CN100428450C (zh) | 2008-10-22 |
US20070012428A1 (en) | 2007-01-18 |
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