CN101212885B - 散热模组 - Google Patents

散热模组 Download PDF

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CN101212885B
CN101212885B CN2006101577632A CN200610157763A CN101212885B CN 101212885 B CN101212885 B CN 101212885B CN 2006101577632 A CN2006101577632 A CN 2006101577632A CN 200610157763 A CN200610157763 A CN 200610157763A CN 101212885 B CN101212885 B CN 101212885B
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heat
heat pipe
centrifugal fan
radiation module
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CN101212885A (zh
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黄清白
张�杰
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract

一种散热模组,包括一离心风扇、一热管及一鳍片组,该离心风扇包括一转子,该离心风扇设有一出风口,该鳍片组设于该出风口处且包括若干散热片,该热管包括一冷凝段,其中这些散热片沿与离心风扇的转子的轴线平行的方向上下堆叠排列,且这些散热片上开设有大致呈方形的收容孔,该热管为扁平状且在靠近冷凝段的末端弯折形成一折弯部,该热管的冷凝段贴设于该鳍片组最外面的一散热片上,该折弯部收容于散热片上所设的收容孔内。该散热模组可降低噪音的同时具较佳的散热性能。

Description

散热模组
技术领域
本发明涉及一种散热模组,尤其涉及一种适合用于便携式电子装置内对电子元件散热的散热模组。
背景技术
随着中央处理器(central processing unit,CPU)等电子元件功率的不断提高,散热问题越来越受到人们的重视,在各类便携式电子装置比如笔记本电脑中更是如此。为了在有限的空间里高效地带走系统产生的热量,目前业界主要采用由散热片、热管及散热风扇所组成的散热模组来对CPU等电子元件进行散热。该方式的热传导路径为:CPU产生的热量经热管传到散热片,再由散热风扇产生的气流将传至散热片的热量带走。
如图1A及图1B所示为一传统的用于笔记本电脑散热的散热模组,该散热模组包括一集热块110、一热管120、一风扇130及若干散热片140。CPU所产生的热量由集热块110所收集后,经由热管120传送至散热片140,再由风扇130所产生的气流与散热片140发生热交换以将热量散发到外界环境中去。图1B中箭头150代表风扇130中气流的方向,箭头160代表气流经过散热片140后流出的方向。从图1B中可以看出,随着散热片140与风扇130的叶片的相对位置的不同,风扇130所产生的气流的方向与散热片140之间的夹角也不相同。夹角越大时,气流与散热片140之间的撞击越严重,将在散热片140之间形成涡流现象,且风扇130会因此而产生较大的噪音。同时气流与散热片140碰撞时会有一定的动能损失,气流的速度会大幅降低,这样会降低散热片140与气流之间的热交换效率,从而降低散热模组的散热性能。
发明内容
有鉴于此,有必要提供一种可降低噪音的同时又具有较佳散热性能的散热模组。
一种散热模组,包括一离心风扇、一热管及一鳍片组,该离心风扇包括一转子,该离心风扇设有一出风口,该鳍片组设于该出风口处且包括若干散热片,该热管包括一冷凝段,其中这些散热片沿与离心风扇的转子的轴线平行的方向上下堆叠排列,且这些散热片上开设有大致呈方形的收容孔,该热管为扁平状且在靠近冷凝段的末端弯折形成一折弯部,该热管的冷凝段贴设于该鳍片组最外面的一散热片上,该折弯部收容于散热片上所设的收容孔内。
一种散热模组,包括一离心风扇、一集热块、一热管及一鳍片组,该离心风扇包括一转子,该离心风扇于一侧设有一出风口,该出风口具有一近风侧及一远风侧,该离心风扇所产生的气流先到达近风侧,再到达远风侧,该热管包括一蒸发段及一冷凝段,该蒸发段连接在集热块上,该鳍片组包括若干堆叠设置的散热片,其中该鳍片组的散热片沿与离心风扇的转子的轴线平行的方向上下堆叠排列于该出风口处,且于靠近近风侧的一端设有大致呈方形的收容孔,该热管为扁平状且在靠近冷凝段的末端弯折形成一折弯部,该折弯部收容于所述收容孔内。
与现有技术相比,由于该散热模组中散热片的堆叠排列方向与离心风扇的转子的轴线平行,离心风扇所产生的气流可以较顺畅地流过散热片,可有效降低离心风扇在运行时因气流与散热片发生碰撞而产生的噪音。同时,该扁平状的热管的冷凝段贴设于鳍片组的最外面的散热片上,热管与散热片的接触面积较大,且热管在靠近冷凝段的末端形成有一弯折段,该弯折段收容于散热片上所设的收容孔中,这样设置可增加热管与散热片之间的接触面积,热管与散热片之间的换热效率得到提高,提升散热模组的散热性能。另外,热管为扁平状且散热片上用于收容折弯部的收容孔为大致呈方形,使得两者之间的安装较方便。
附图说明
下面参照附图,结合实施例对本发明作进一步描述。
图1A为一传统的散热装置的立体示意图。
图1B为图1A中的散热装置的流场示意图。
图2为本发明散热模组其中一较佳实施例的分解示意图。
图3是图2所示散热模组的组装示意图。
图4是本发明散热模组的另一实施例的组装示意图。
具体实施方式
图2所示为本发明散热模组200其中一较佳实施例,该散热模组200用于安装在笔记本电脑等便携式电子装置中,以用来对其内部的发热电子元件如中央处理器、显卡芯片等散热。该散热模组200包括一离心风扇20、一鳍片组30、一热管40及一集热块50。
该离心风扇20包括一壳体21及设于该壳体21内的一转子22,该转子22可以绕着其轴线A做顺时针转动。该壳体21的顶端开设有一圆形的进风口23,以供外界空气进入到离心风扇20内。该壳体21的侧向开设有一直线形的出风口24,该出风口24具有一近风侧24a及一远风侧24b。离心风扇20运转时,转子22绕轴线A做顺时针转动,离心风扇20所产生的气流经出风口24向外流出时,气流先到达出风口24的近风侧24a,再到达出风口24的远风侧24b,且近风侧24a所在区域的气流的流量要较远风侧24b所在区域的气流的流量大。
该鳍片组30设于离心风扇20的出风口24处,其包括若干平行排列的散热片31,这些散热片31沿着与离心风扇20的转子22的轴线A平行的方向上下堆叠排列。每一散热片31包括一矩形的本体311,该本体311的两端分别向本体311的下侧弯折形成一折边312,后一散热片31的折边312与前一散热片31的折边312相互抵接,并在每两相邻的散热片31之间形成一供气流通过的气流通道313。这些散热片31可以通过焊接的方式固定在一起,也可以在折边312上设置扣合结构,再由扣接的方式将散热片31固定在一起。每一散热片31在靠近出风口24的近风侧24a的一端设有一大致呈方形的收容孔314以用来收容热管40的一部分。所述散热片31自收容孔314的孔壁边缘向本体311的下侧延伸有一接触部315,用来增加散热片31与热管40的接触面积。
该热管40为扁平状,其包括一蒸发段41及一冷凝段42。热管40的蒸发段41与集热块50热连接,其冷凝段42贴设于鳍片组30的上表面,并与位于鳍片组30最上面的散热片31通过锡焊的方式固定在一起。该热管40在靠近冷凝段42的末端处向热管40的下侧大致弯折90°,从而形成一具有较小长度的折弯部43,该折弯部43的长度大致与鳍片组30的高度相当。
该集热块50大致呈矩形,其由具高导热系数的金属材料制成。本实施例中,集热块50由铜制成。该集热块50大致沿对角方向设有一狭长的开槽51以收容热管40的蒸发段41。该开槽51的中间为一贯穿的通孔52,透过该通孔52可使热管40的蒸发段41与设于集热块50下方的电子元件(图未示)相接触,以提高两者之间的换热效率,更利于电子元件产生的热量通过热管40快速地传至鳍片组30。
请同时参照图3,该散热模组200组装时,鳍片组30设于离心风扇20的出风口24处,热管40的蒸发段41收容于集热块50的开槽51内,并通过导热胶或锡焊的方式将热管40的蒸发段41与集热块50连接在一起。热管40的冷凝段42的折弯部43收容于散热片31上所设的收容孔314内,并在收容孔314内填充有焊锡等粘接剂,以使热管40的折弯部43与收容孔314的孔壁及接触部315之间接触良好。同时,将热管40的冷凝段42贴设于鳍片组30的上表面,并通过导热胶或锡焊的方式将热管40的冷凝段42与位于鳍片组30最上面的散热片31固定在一起。
该散热模组200用于笔记本电脑等电子装置中散热时,集热块50贴设于电子元件上,电子元件所产生的热量通过集热块50传给热管40或直接传给热管40,再由热管40将热量传至鳍片组30的各散热片31,最后由离心风扇20产生的气流吹拂各散热片31并与散热片31之间发生热交换,以最终将热量散发到外界。
该散热模组200中,由于鳍片组30的各散热片31沿平行于离心风扇20的转子22的轴线A排列于离心风扇20的出风口24处,离心风扇20所产生的气流流经散热片31之间的气流通道313时,气流与散热片31之间的碰撞较少,由此而产生的噪音减小。该热管40的冷凝段42贴设于鳍片组30的上表面,同时该冷凝段42末端的折弯部43穿设于散热片31的收容孔314中,使热管40的冷凝段42与散热片31之间的接触面积增加,从而提高热管40与散热片31之间的换热效率,提升散热模组200的散热性能。该散热模组200中,热管40为扁平状,同时热管40的冷凝段42与鳍片组30最上端的散热片31之间采用导热胶或锡焊的方式连接在一起,因此热管40的冷凝段42与散热片31之间的接触面积大且接触良好,两者之间的传热效率高,进一步提升散热模组200的散热性能。散热片31上用于收容冷凝段42的折弯部43的收容孔314为大致呈方形,在将热管40与散热片31通过导热胶或锡焊的方式固定在一起时,热管40的折弯部43在收容孔314内不会发生转动,因此制造安装较方便。散热片31上所设收容孔314的接触部315,进一步增加散热片31与冷凝段42的折弯部43之间的接触面积。
该散热模组200中,散热片31上的收容孔314设于散热片31靠近出风口24的近风侧24a的一端,热管40将热量传至散热片31上时,散热片31靠近出风口24的近风侧24a的一端的温度要较散热片31的另一端的温度高。同时,离心风扇20的出风口24的近风侧24a区域的流量较远风侧24b区域的流量大,因此这样设置可使离心风扇20所产生的气流得到充分的利用。
该散热模组200中,散热片31上的收容孔314也还可设于散热片31上的其它位置。如图4所示为本发明另一实施例的散热模组200a的组装示意图,该散热模组200a中,散热片31a上的收容孔居中设置,热管40a的冷凝段42a的折弯部43a收容于散热片31a的收容孔内。冷凝段42a的折弯部43a与散热片31a发生热交换时,热量可以由散热片31a的中间同时向两端传送,传热效果也较好。

Claims (9)

1.一种散热模组,包括一离心风扇、一热管及一鳍片组,该离心风扇包括一转子,该离心风扇设有一出风口,该鳍片组设于该出风口处且包括若干散热片,该热管包括一冷凝段,其特征在于:这些散热片沿与离心风扇的转子的轴线平行的方向上下堆叠排列,且这些散热片上开设有大致呈方形的收容孔,该热管为扁平状且在靠近冷凝段的末端弯折形成一折弯部,该热管的冷凝段部分地贴设于该鳍片组最外面的一散热片上,该折弯部收容于这些散热片上所设的收容孔内。
2.如权利要求1所述的散热模组,其特征在于:该离心风扇的出风口具有一近风侧及一远风侧,该近风侧所在区域的流量较远风侧所在区域的流量大,所述散热片上的收容孔设于散热片靠近近风侧的一端。
3.如权利要求1所述的散热模组,其特征在于:所述散热片上的收容孔在散热片上居中设置。
4.如权利要求1所述的散热模组,其特征在于:该热管的冷凝段与鳍片组最外面的散热片通过焊接的方式固定在一起。
5.如权利要求1所述的散热模组,其特征在于:所述散热片的收容孔的孔壁向散热片的一侧延伸设有与热管的冷凝段的折弯部相接触的一接触部。
6.如权利要求5所述的散热模组,其特征在于:所述热管与散热片的接触部通过焊接的方式固定在一起。
7.如权利要求1所述的散热模组,其特征在于:该散热模组还包括一集热块,该热管还包括一蒸发段,该热管的蒸发段与该集热块连接。
8.如权利要求7所述的散热模组,其特征在于:该集热块上沿其对角开设有一狭长形的开槽,该热管的蒸发段收容于该开槽内。
9.一种散热模组,包括一离心风扇、一集热块、一热管及一鳍片组,该离心风扇包括一转子,该离心风扇于一侧设有一出风口,该出风口具有一近风侧及一远风侧,该离心风扇所产生的气流先到达近风侧,再到达远风侧,该热管包括一蒸发段及一冷凝段,该蒸发段连接在集热块上,该鳍片组包括若干堆叠设置的散热片,其特征在于:该鳍片组的散热片沿与离心风扇的转子的轴线平行的方向上下堆叠排列于该出风口处,且于靠近近风侧的一端设有大致呈方形的收容孔,该热管为扁平状且在靠近冷凝段的末端弯折形成一折弯部,该热管的冷凝段部分地贴设于该鳍片组最外面的一散热片上,该折弯部收容于所述收容孔内。
CN2006101577632A 2006-12-27 2006-12-27 散热模组 Expired - Fee Related CN101212885B (zh)

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