CN100543640C - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN100543640C
CN100543640C CN200610033242.6A CN200610033242A CN100543640C CN 100543640 C CN100543640 C CN 100543640C CN 200610033242 A CN200610033242 A CN 200610033242A CN 100543640 C CN100543640 C CN 100543640C
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China
Prior art keywords
heat
radiator
heat pipe
pedestal
heating
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Expired - Fee Related
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CN200610033242.6A
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CN101004627A (zh
Inventor
邓根平
吴宜强
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200610033242.6A priority Critical patent/CN100543640C/zh
Priority to US11/308,852 priority patent/US20070169919A1/en
Publication of CN101004627A publication Critical patent/CN101004627A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

本发明的散热器包括一导热板、二对散热体及一热管,该每一散热体具有一基座及自该基座的一侧延伸而出的多数散热片,该热管具有一与导热板连接的吸热部及由吸热部相对两端弯折延伸而出并与散热体连接的二放热部,该热管的每一放热部被夹置于一对散热体的基座之间,且该热管的一放热部与吸热部连接处夹角大于90°。每一对散热体夹持一放热部,使放热部的热量通过散热体快速散发,从而使散热器具有良好的散热性能。

Description

散热器
【技术领域】
本发明涉及一种散热器,特别是指一种热管散热器。
【背景技术】
为有效地散发电子元件如中央处理器(CPU),在运行过程中产生的热量,业界通常在发热电子元件表面加装一散热器辅助其散热,从而使电子元件自身温度保持在正常运行范围内。
对于散热器,目前业界越来越多地使用热管,中国专利申请公开第200420045284.8号揭示一种使用热管的散热器,该散热器包括一散热体和至少一热管,该散热体包括一本体,本体包括一导热板和设置于该导热板上的柱体,柱体至少一表面延伸有多数散热片,为使得所述散热体具有更强的散热能力,该柱体多个表面均设有散热片,因柱体结构曲折,使得所述本体的制程复杂;所述热管的吸热部与放热部呈90°夹角,热管内工作介质流经该热管夹角处受阻而导致传热速度下降;另有一种散热器结构,如美国专利公开第2001/0018967A1号所示,该散热器的散热片上开设有通孔,使得热管可以贯穿其中,但此种结构制程较为复杂。
【发明内容】
有鉴于此,有必要提供一种能有效利用热管且制程简单的热管散热器。
本发明的散热器包括一导热板、二对散热体及一热管,该每一散热体具有一基座及自该基座的一侧延伸而出的多数散热片,该热管具有一与导热板连接的吸热部及由吸热部相对两端弯折延伸而出并与散热体连接的二放热部,该热管的每一放热部被夹置于一对散热体的基座之间,且该热管的一放热部与吸热部连接处夹角大于90°。
每一对散热体夹持一放热部,使放热部的热量通过散热体快速散发,从而使散热器具有良好的散热性能。
下面参照附图结合实施例对本发明作进一步描述。
【附图说明】
图1是本发明散热器第一实施例的立体分解示意图。
图2是图1的立体组合示意图。
图3是本发明散热器第二实施例的立体分解示意图。
图4是图3的立体组合示意图。
图5是本发明散热器第三实施例的立体分解示意图。
【具体实施方式】
图1及图2示出了本发明第一实施例的散热器40,该散热器40被置于一发热电子元件(图未示)上并对其散热。
该散热器40包括一导热板10、二V形热管20及四散热体31、32、33、34。导热板10具有一顶面12及与顶面12相对的底面16,顶面12上设有凹槽14,底面16用以与发热电子元件接触。
该热管20包括一吸热部24及从吸热部24两端弯折延伸而成的两放热部22,其中吸热部24与放热部22均为直线形,热管20所在平面与导热板10的顶面12垂直,吸热部24与放热部22间内夹角大于90°,使得热管20成V形。
四散热体31、32、33、34具有相似的结构及功能特征,以散热体32为例:其包括一平板状基座320,该基座320具有一受热面326及相反侧的一导热面324,受热面326上设有凹槽322,用以容置热管20的放热部22,而导热面324上垂直延伸出多数相互平行的散热片328,用以散发热量。
该散热器40装配时,导热板10顶面凹槽14容置热管20的吸热部24;四散热体中每两散热体(31与34、32与33)相互以其受热面相对夹置热管20放热部22。装配完毕后,导热板10位于热管20下方,而两散热体31、32对称位于热管20内夹角侧,另两散热体33、34对称位于热管20外夹角侧。上述各元件间结合处可以采用焊接方式连接。
该散热器40应用时,导热板10以其底面16与发热电子元件接触,吸收电子元件产生的热量后将热量传递给热管20的吸热部24,该吸热部24内工作液体吸热变成汽态后流向热管20的两放热部22,工作液体在放热部22处冷凝变成液态释放出热量,其中大部分热量将传递到各散热体,并通过各散热体基座上的散热片散发出去。
图3和图4为本发明的第二实施例的散热器50,该散热器50包括一导热板10′,二热管20′及两散热体31、34,从图中可以看出,散热器50实际上是实施例一中散热器40的一半部分,散热体31、34和导热板10′的结构功能特征及安装位置与散热器40中对应元件相同,所不同的是,所述热管20′只有一放热部22′及一吸热部24′,该放热部22′与吸热部24′间内夹角大于90°。
图5为本发明的第三实施例的散热器60,该散热器60包括一导热板10、一V形热管20及三散热体33、34、35。与实施例一中散热器40所不同的是,原来位于热管20内侧的两散热体被合并成一散热体35,该散热体35具有二基座350,该基座350的受热面356上设有凹槽352,用以容置热管放热部22,该基座350的二导热面354间延伸出多数相互平行的散热片358。散热器60其余元件结构功能特征及安装位置均与实施一例中散热器40对应元件相同。

Claims (6)

1.一种散热器,包括一导热板、二对散热体及一热管,该每一散热体具有一基座及自该基座的一侧延伸而出的多数散热片,该热管具有一与导热板连接的吸热部及由吸热部相对两端弯折延伸而出并与散热体连接的二放热部,其特征在于:该热管的一放热部被夹置于一对散热体的基座之间,另一放热部被夹置于另一对散热体的基座之间,且该热管的一放热部与吸热部连接处夹角大于90°。
2.根据权利要求1所述的散热器,其特征在于:所述热管的另一放热部与吸热部连接处夹角大于90°。
3.根据权利要求1所述的散热器,其特征在于:所述导热板位于该散热器的底部,该导热板的顶面设有凹槽容置热管的吸热部。
4.根据权利要求1所述的散热器,其特征在于:所述热管呈V形,该热管的两放热部分别自该吸热部的两端斜向上延伸。
5.根据权利要求4所述的散热器,其特征在于:所述二对散热体中二散热体对称位于热管内夹角侧,另二散热体对称位于热管外夹角侧,该热管的每一放热部被相邻的位于外夹角侧的一散热体和位于内夹角侧的一散热体夹持其间。
6.根据权利要求1至4任意一项所述的散热器,其特征在于:每一散热体的基座包括一受热面及相反侧的一导热面,该多数散热片位于该基座的导热面上,该基座的受热面设有凹槽用以收容所述热管的放热部,从而将热管的放热部夹持在相邻的两个基座之间。
CN200610033242.6A 2006-01-21 2006-01-21 散热器 Expired - Fee Related CN100543640C (zh)

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CN200610033242.6A CN100543640C (zh) 2006-01-21 2006-01-21 散热器
US11/308,852 US20070169919A1 (en) 2006-01-21 2006-05-15 Heat pipe type heat dissipation device

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