US20030183373A1

US20030183373A1 - Video game console cooler

Info

Publication number: US20030183373A1
Application number: US10/109,024
Authority: US
Inventors: David Sarraf; Robert DeHoff; Arthur Good; Leland James
Original assignee: Individual
Current assignee: Aavid Thermal Corp
Priority date: 2002-03-28
Filing date: 2002-03-28
Publication date: 2003-10-02

Abstract

A heat dissipation structure for electronics including a first heat sink for dissipating heat produced by a first processing unit (e.g., a Central Processing Unit (CPU)), a second heat sink for dissipating heat produced by a second processing unit (e.g., a Graphics Processing Unit (GPU)) and, a heat pipe interconnecting the first and second heat sinks. By connecting the CPU and GPU heat sinks, heat generated by the GPU can be transferred to the CPU where it can be more effectively cooled.

Description

FIELD OF THE INVENTION

The present invention relates to a method and apparatus for cooling an electronic unit, and in particular, a method and apparatus for cooling a video game console.

DESCRIPTION OF THE RELATED ART

A basic heat pipe comprises a closed or sealed envelope or a chamber containing an isotropic liquid-transporting wick and a working fluid capable of having both a liquid phase and a vapor phase within a desired range of operating temperatures. When one portion of the chamber is exposed to relatively high temperature it functions as an evaporator section. The working fluid is vaporized in the evaporator section causing a slight pressure increase forcing the vapor to a relatively lower temperature section of the chamber defined as a condenser section. The vapor is condensed in the condenser section and returned through the liquid-transporting wick to the evaporator section by capillary pumping action.

Because it operates on the principle of phase changes rather than on the principles of conduction or convection, a heat pipe is theoretically capable of transferring heat at a much higher rate than conventional heat transfer systems. Consequently, heat pipes have been utilized to cool various types of high heat-producing apparatus, such as electronic equipment (See, e.g., U.S. Pat. Nos. 5,884,693, 5,890,371, and 6,076,595).

However, there is presently no available heat pipe system, for efficiently cooling a video game console. Due to the demand for superior graphics, most modern video game consoles include both a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). Video game manufacturers (e.g., Sony, Sega, Nintendo) are constantly improving their hardware (e.g., Playstation II, Dreamcast, N64) to improve performance and graphics quality. Often times, and increase in performance results in increased heat loads (from the CPU and GPU). With video game consoles, heat dissipation is made more difficult by aesthetic concerns such as making the console housing smaller, the need to limit noise (such as cooling fans), and the need to operate in high temperature environments (such as an enclosed home entertainment center).

For example, FIG. 1 shows a top plan view of a

circuit board

10 of a conventional video game console. The circuit board 10 includes, among other circuits and elements, a CPU 20 and a GPU 30. Due to manufacturing and aesthetic constraints, the CPU 20 is fan-cooled by a fan mechanism 40, however, the GPU 30 is not fan-cooled. Although not explicitly shown in FIG. 1, both the CPU and GPU may have heat sinks including fins disposed thereon for increasing heat dissipation. Presuming that the CPU 20 continually generates 20 Watts of power, and the GPU 30 continually generates 15 Watts of power, the CPU is always kept cooler due to the passage of air generated by the fan 40. Thus, operating the GPU 30 at higher processing speeds (generating higher power outputs) may not be possible due to the fact that the GPU cannot be effectively cooled. This inability to operate the GPU at higher processing speeds severely limits the overall performance of the console. One solution might be to move the GPU 30 to a position in front of the fan, however, this solution is not possible while maintaining the overall aesthetic of the console.

Therefore, there is currently a need for a heat pipe system for effectively keeping cool, and cooling, both the CPU and the GPU of a video game console.

SUMMARY OF THE INVENTION

The present invention is a heat dissipation structure for electronics comprising a first heat sink for dissipating heat produced by a first processing unit, a second heat sink for dissipating heat produced by a second processing unit and, a heat pipe interconnecting the first and second heat sinks.

The above and other advantages and features of the present invention will be better understood from the following detailed description of the exemplary embodiments of the invention which is provided in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a top plan view of a circuit board of a conventional video game console. [0009]
FIG. 2 is an overhead isometric view of a heat dissipation structure according to an exemplary embodiment of the present invention. [0010]
FIG. 3 shows a top plan view of a circuit board of a video game console according to an exemplary embodiment of the present invention, and including the heat dissipation structure shown in FIG. 2.[0011]

DETAILED DESCRIPTION

Referring to FIG. 2, there is shown a [0012] heat dissipation structure 100 according to an exemplary embodiment of the present invention. The heat dissipation structure 100 includes a first heat sink 110 (hereinafter referred to as Central Processing Unit (CPU) heat sink 110), a second heat sink 120 (hereinafter referred to as Graphics Processing Unit (CPU) heat sink 120), and a heat pipe 130 interconnecting the CPU and GPU heat sinks. The CPU heat sink 110 comprises a main body 111 with a plurality of fins 112 and a connection area 113. The CPU heat sink is preferably made of metal such as Copper (Cu), but may be made of any suitable heat-conducting material. The GPU heat sink 120 also comprises a main body 121 with a plurality of fins 122 and a connection area 123. As with the CPU heat sink 110, the GPU heat sink is preferably made of metal such as Copper (Cu), but may be made of any suitable heat-conducting material. It will be noted that the GPU heat sink 120 has substantially similar structure to the CPU heat sink 110, except that it includes fewer fins.
Although both the CPU and [0013] GPU heat sinks 110, 120 are shown in the exemplary embodiment including a plurality of fins 112, 122, these fins are optional, and not necessary to the proper operation of the present invention. As is well known in the art, fins provide for increased heat dissipation by increasing the surface area of the heat sink. Accordingly, it is preferable in most cases to utilize heat sinks which include fins (to increase heat dissipation), however, such a construction is not necessary to the present invention.
The [0014] connection areas 113 and 123 of the CPU and GPU heat sinks 110, 120 include channels 115, 125 for accepting the heat pipe 130. Once the heat pipe 130 is placed in each of the channels 115, 125, the channels may be crimped (by pliers or otherwise) to tightly hold the heat pipe.
The [0015] heat pipe 130 is comprised of a tubular body member 131 which extends between the CPU and GPU heat sinks 110, 120. In the preferred embodiment the tubular member 131 is U-shaped so as to connect a CPU heat sink 110 and a GPU heat sink 120 which are situated side by side, however, if the CPU and GPU heat sinks were oriented differently, those of ordinary skill in the art will realize that the configuration of the tubular member may be altered accordingly (e.g., to be straight, S-shaped, etc.).
The [0016] heat pipe 130 includes an evaporator section 132 disposed at a first end of the tubular member 131. The evaporator section 132 serves to evaporate a working liquid (e.g., Water, etc.) disposed inside the heat pipe 130, as is well known. The heat pipe 130 also includes a condenser section 134 disposed at a second end thereof. Liquid vapor generated in the evaporator sections 132 traverses the tubular member 131 to the condenser section 134, where it again condenses to liquid form.
It will be noted that the evaporator end of the [0017] heat pipe 130 is disposed at the GPU heat sink 120 so that heat generated by a GPU coupled to the GPU heat sink can be efficiently moved to the condenser end of the heat pipe (disposed at the CPU heat sink 110), where the heat is fan-cooled as explained below.
FIG. 3 shows a top plan view of a [0018] circuit board 200 of a video game console according to an exemplary embodiment of the present invention, including the above-described heat dissipation structure 100. As will be understood by those skilled in the art, the heat dissipation structure 100 contacts and overlies the CPU 20 and GPU 30. By connecting the GPU 30 to the fan-cooled CPU 20, the GPU can be efficiently cooled without changing its relative position on the circuit board.
Thus, the above-described [0019] heat dissipation structure 100 permits the efficient cooling of two pieces of electronic equipment (e.g., a CPU and GPU), where only one of the pieces of electronic equipment is otherwise cooled, such as by a fan. By coupling the CPU and the GPU to one another, heat generated by the not otherwise cooled GPU is transferred to the CPU which is fan-cooled. This heat dissipation structure is particularly useful for a video game console, as it allows the basic arrangement of the console to remain the same, thereby maintaining the console's aesthetic appearance, while still permitting significant heat reduction.
Although the above discussion is directed toward a [0020] heat dissipation structure 100 for cooling a CPU and a GPU of a video game console, it will be noted that the heat dissipation structure may be utilized to cool any two electronics units (e.g., two CPUs, etc.) of any electronics console (e.g., laptop computer console, etc.) Additionally, the principles of the present invention taught above may be used to manufacture a heat dissipation structure which includes more than two interconnected heat sinks (i.e., three or more heat sinks interconnected by a heat pipe or heat pipes is within the scope of the present invention).
Although the invention has been described in terms of exemplary embodiments, it is not limited thereto. Rather, the appended claims should be construed broadly, to include other variants and embodiments of the invention which may be made by those skilled in the art without departing from the scope and range of equivalents of the invention. [0021]

Claims

What is claimed is:

1. A heat dissipation structure for electronics comprising:

a first heat sink for dissipating heat produced by a first processing unit;

a second heat sink for dissipating heat produced by a second processing unit; and,

a heat pipe interconnecting the first and second heat sinks.

2. The heat dissipation structure of claim 1, wherein the first processing unit comprises a central processing unit.

3. The heat dissipation structure of claim 2, wherein the second processing unit comprises a graphics processing unit.

4. The heat dissipation structure of claim 1, wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

5. The heat dissipation structure of claim 1, wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

6. The heat dissipation structure of claim 4, wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

7. The heat dissipation structure of claim 5, wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

8. A electronics console comprising:

a first processing unit;

a second processing unit;

a first heat sink for dissipating heat produced by the first processing unit;

a second heat sink for dissipating heat produced by the second processing unit; and,

a heat pipe interconnecting the first and second heat sinks.

9. The electronics console of claim 8, wherein the first processing unit comprises a central processing unit.

10. The electronics console of claim 9, wherein the second processing unit comprises a graphics processing unit.

11. The electronics console of claim 8, wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

12. The electronics console of claim 8, wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

13. The electronics console of claim 11, wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

14. The electronics console of claim 12, wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

15. The electronics console of claim 8, wherein said first heat sink is disposed on a face of said first processing unit.

16. The electronics console of claim 15, wherein said second heat sink is disposed on a face of said second processing unit.

17. The electronics console of claim 8, further comprising:

a fan disposed in proximity to said first processing unit and said first heat sink, wherein said first processing unit and said first heat sink are in an air path of said fan and are cooled thereby.

18. A method for cooling an electronics console, comprising the steps of:

connecting a heat pipe between first and second heat sinks of the electronics console.

19. The method of claim 18, comprising the further steps of:

disposing a fan in proximity to said first heat sink, wherein said fan provides a cooling airflow to said first heat sink.

20. A video game console, comprising:

a first processing unit;

a second processing unit;

a first heat sink for dissipating heat produced by the first processing unit;

a heat pipe interconnecting the first and second heat sinks.