CN1913137A - 散热模组 - Google Patents

散热模组 Download PDF

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Publication number
CN1913137A
CN1913137A CNA2005100365904A CN200510036590A CN1913137A CN 1913137 A CN1913137 A CN 1913137A CN A2005100365904 A CNA2005100365904 A CN A2005100365904A CN 200510036590 A CN200510036590 A CN 200510036590A CN 1913137 A CN1913137 A CN 1913137A
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heat radiation
radiation module
lid
capillary structure
base
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CN1913137B (zh
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李欣和
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200510036590A priority Critical patent/CN1913137B/zh
Priority to US11/416,555 priority patent/US20070034358A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明提供一种散热模组,其包括:一底座,所述底座包括一毛细结构层;以及一与所述底座相接合的盖体,所述盖体包括一隔板;所述底座及盖体形成由所述隔板隔离的回流腔及蒸发腔,所述回流腔及蒸发腔均与所述毛细结构层相连,且分别包括一通孔。

Description

散热模组
【技术领域】
本发明涉及一种散热模组,特别涉及一种利用相变方式散热的散热模组。
【背景技术】
近年来,随着半导体器件集成工艺快速发展以及对其轻、薄、短、小的需求,半导体器件的集成化程度越来越高,而器件体积却变得越来越小,为确保半导体器件正常工作,其散热成为一个越来越重要的问题,其对散热的要求也越来越高。为满足这些需要,各种散热方式被大量运用,如常见的利用风扇散热或采用水冷辅助散热以及热管散热等方式。其中,热管为依靠自身内部工作流体相变实现导热的导热组件,其具有高导热性、优良等温性等优良特性,导热效果好,应用广泛。
典型热管由管壳、毛细结构以及密封在管内的工作流体组成。热管的制作通常先将管内抽成真空后充以适当工作流体,使紧贴管壳内壁的毛细结构中充满工作流体后加以密封。热管一端为蒸发段(加热段),另一端为冷凝段(冷却段),根据应用需要可在所述蒸发段与冷凝段之间布置绝热段。当所述蒸发段受热时,所述毛细结构中的工作流体蒸发气化形成蒸汽;所述蒸汽在微小压力差作用下通过孔道流向所述冷凝段,放出热量后凝结成工作流体;所述工作流体再靠毛细作用沿所述毛细结构流回蒸发段。如此循环,热量由热管的蒸发段不断地传至冷凝段,并被冷凝段一端的冷源吸收。
现有技术中提供的热管散热装置中,通常是将热管的蒸发段设于一与热源相接触的散热片上,通过与所述散热片的结合来增加所述蒸发段的接触面积,以充分利用所述热管的导热性能。
然而,由于单个热管所能负载的热传量较小,为适应越来越高的散热需求,所述热管散热装置通常具有多个热管,其体积也随之增大,难以满足轻、薄、短、小的需求。另外,所述热管散热装置中,热管的蒸发段通过散热片与热源间接接触,因此所述热管与热源的热传递还受限于所述散热片的导热性能,其散热性能仍不理想。
有鉴于此,提供一种体积较小且能负载较大热传量的散热模组实为必要。
【发明内容】
以下,将以实施例说明一种散热模组。
为实现上述内容,提供一种散热模组,其包括:一底座;所述底座包括一毛细结构层;以及一与所述底座相接合的盖体,所述盖体包括一隔板;所述底座及盖体形成由所述隔板隔离的回流腔及蒸发腔,所述回流腔及蒸发腔均与所述毛细结构层相连,且分别包括一通孔。
所述蒸发腔包括一导流部及一集气室。
所述底座包括一位于所述导流部及集气室之间的凸条。
所述蒸发腔的导流部还包括多个导流件。
所述隔板及导流件与盖体为一体成型。
所述底座及盖体的材料包括铜、铁、铝或其合金。
所述毛细结构层包括烧结层或碳纳米管阵列。
所述烧结层由金属粉末烧结而成。
所述金属粉末包括铜粉、铝粉或铁粉。
与现有技术相比,本实施例提供的散热模组中,所述底座可直接与热源相连,接触热阻较小,且所述底座上具有毛细结构层,该毛细结构层可根据散热需要而设定大小,甚至完全覆盖所述底座,以使所述散热模组能负载较大热传量的同时仍能确保体积较小。
【附图说明】
图1为本发明实施例的散热模组的爆炸图。
图2为本发明实施例的散热模组的立体图。
图3为本发明实施例沿图2III-III方向的剖面示意图。
图4为本发明实施例使用状态的剖面示意图。
【具体实施方式】
下面将结合附图对本发明作进一步的详细说明。
请一并参阅图1及图2,本发明实施例提供的散热模组10,其包括一板状底座100,所述板状底座100的主体呈矩形且一侧延伸为弓形的形状,所述矩形与弓形交界处具有一凸条110;一设于所述板状底座100上,且与所述板状底座100主体的矩形结构相对应的毛细结构层200;以及一盖体300,所述盖体300包括与所述板状底座100主体形状相对应的顶部,在所述顶部外围垂直延伸的侧边,以及与所述侧边同向延伸于所述盖体300顶部的一隔板310及多个导流件338。所述隔板310将所述盖体300分隔为一回流腔320及一蒸发腔330,所述回流腔320及蒸发腔330均与所述毛细结构层200相连,且侧边分别包括通孔325、335。所述毛细结构层200包括烧结层或碳纳米管阵列。本实施例中,所述毛细结构层20采用烧结层,当然在其它实施例中,所述毛细结构层20还可采用碳纳米管阵列。
优选,所述隔板310及导流件338与盖体300为一体成型。
所述烧结层由金属粉末烧结而成。
所述金属粉末包括铜粉、铝粉或铁粉。
所述底座100及盖体300通过焊接或粘贴结合。
所述蒸发腔330包括一位于所述凸条110与隔板310之间的导流部及一位于所述弓形部分的集气室。
所述多个导流件338分布在所述导流部的盖体300顶部且相互平行。所述多个导流件338将所述导流部分隔为多个导流通道。所述多个导流通道一端与所述隔板310相连,另一端与所述蒸发腔330中通孔335附近的弓形集气室相连。
所述底座100及盖体300的材料包括铜、铁、铝等金属或其合金。
请一并参阅图1至图4,本实施例中,所述散热模组10处于使用状态时,所述底座100中位于蒸发腔330的部分与一热源20相连,所述散热模组10的两通孔325、335与一冷凝装置30相连。将工作流体通过通孔325注入所述回流腔320中,工作流体受毛细结构层200的毛细作用由所述回流腔320吸至所述毛细结构层200位于所述蒸发腔330的部份中。由于所述蒸发腔330与热源20相连,故底座100将热量迅速传递至所述毛细结构层200。所述毛细结构层200中的工作流体吸收热量后形成蒸气蒸发至所述多个导流件338形成的多个导流通道中,然后经所述导流通道流至所述集气室中,由所述集气室的通孔335流出至所述冷凝装置30。所述蒸气经所述冷凝装置30冷凝成工作流体后再由通孔325注入所述回流腔320中,如此循环,利用工作流体的相变冷却所述热源20。
综上所述,本实施例提供的散热模组10中,所述底座100可直接与热源20相连,接触热阻较小,且所述底座上具有毛细结构层200,该毛细结构层200可根据散热需要而设定大小,甚至完全覆盖所述底座100,以使所述散热模组10能负载较大热传量的同时仍能确保体积较小。所述散热模组10处于使用状态时,所述多个导流通道流出的蒸气经所述弓形集气室流出通孔335,可有效降低流阻。

Claims (10)

1.一种散热模组,其包括:一底座,所述底座包括一毛细结构层;以及一与所述底座相接合的盖体,所述盖体包括一隔板;所述底座及盖体形成由所述隔板隔离的回流腔及蒸发腔,所述回流腔及蒸发腔均与所述毛细结构层相连,且分别包括一通孔。
2.如权利要求1所述的散热模组,其特征在于,所述蒸发腔包括一导流部及一集气室。
3.如权利要求2所述的散热模组,其特征在于,所述蒸发腔的导流部包括多个导流件。
4.如权利要求3所述的散热模组,其特征在于,所述隔板及多个导流件与所述盖体一体成型。
5.如权利要求3所述的散热模组,其特征在于,所述多个导流件相互平行。
6.如权利要求2所述的散热模组,其特征在于,所述集气室为弓形。
7.如权利要求1所述的散热模组,其特征在于,所述底座及盖体的材料包括铜、铁、铝或其合金。
8.如权利要求1所述的散热模组,其特征在于,所述毛细结构层包括烧结层或碳纳米管阵列。
9.如权利要求8所述的散热模组,其特征在于,所述烧结层由金属粉末烧结而成。
10.如权利要求1至9中任意一项所述的散热模组,其特征在于,所述底座及盖体通过焊接或粘贴接合。
CN200510036590A 2005-08-12 2005-08-12 散热模组 Expired - Fee Related CN1913137B (zh)

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US11/416,555 US20070034358A1 (en) 2005-08-12 2006-05-03 Heat dissipation device

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WO2019071622A1 (zh) * 2017-10-13 2019-04-18 邹昊雄 一种散热装置
CN111354693A (zh) * 2020-03-12 2020-06-30 苏州永腾电子制品有限公司 一种薄板形结构散热模组

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CN111354693A (zh) * 2020-03-12 2020-06-30 苏州永腾电子制品有限公司 一种薄板形结构散热模组

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US20070034358A1 (en) 2007-02-15

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