US20070034358A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20070034358A1
US20070034358A1 US11416555 US41655506A US2007034358A1 US 20070034358 A1 US20070034358 A1 US 20070034358A1 US 11416555 US11416555 US 11416555 US 41655506 A US41655506 A US 41655506A US 2007034358 A1 US2007034358 A1 US 2007034358A1
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Prior art keywords
assembly
heat dissipation
dissipation device
accordance
portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11416555
Inventor
Hsin-Ho Lee
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Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a first assembly having a first shell portion and a wick layer formed thereon, a second assembly having a second shell portion and a clapboard formed thereon, and a circumfluence cavity and an evaporation cavity formed by coupling the first assembly and the second assembly together and separated by the clapboard. The circumfluence cavity and the evaporation cavity are communicated via the wick layer.

Description

    TECHNICAL FIELD
  • The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device which utilizes a phase change heat transfer.
  • BACKGROUND
  • Electronic components such as semiconductor chips are becoming progressively smaller, while at the same time heat dissipation requirements thereof are increasing. In many contemporary applications, a heat pipe is one of the most efficient systems in use for transmitting heat away from such components.
  • Numerous kinds of heat pipes have been developed for cooling electronic components. A typical heat pipe comprises an evaporator section to take in heat and a condenser section to pass out heat. Working fluid is contained in the heat pipe to transfer heat from the evaporator section to the condenser section. Heat entering the evaporator section of the heat pipe boils the fluid and turns it into a vapor. The vapor expands in volume and travels to the condenser section where it condenses to a liquid and releases its heat. The liquid is then returned to the evaporator section by gravity and/or a wick, whereupon the cycle starts again. However, the heat transfer rate of a single heat pipe is limited. Furthermore, when a heat pipe is directly connected with a heat source, the contact surface therebetween is small, and the thermal conduction performance of the heat pipes can not be fully used.
  • In order to satisfy the increasing heat dissipation requirements, a typical heat dissipation apparatus always employs a plurality of heat pipes, the evaporator sections of the heat pipes are combined with a heat sink and disposed in thermal communication with a heat source via the heat sink. Therefore, the contact surface of the evaporator sections is increased, and the thermal conduction performance of the heat pipes can be fully used. However, the size of the heat dissipation apparatus is thereby increased. Furthermore, the evaporator sections of the heat pipes are disposed in thermal communication with the heat source indirectly through the heat sink. That is to say, the heat transmission between the evaporator sections and the heat sink is further restricted by the thermal conductivity of the heat sink.
  • What is needed, therefore, is a heat dissipation device which provides high heat transfer rate with a small size.
  • SUMMARY
  • In a preferred embodiment, a heat dissipation device comprises a first assembly having a first shell portion and a wick layer formed thereon, a second assembly having a second shell portion and a clapboard formed thereon, and a circumfluence cavity and an evaporation cavity formed by coupling the first assembly and the second assembly together and separated by the clapboard. The circumfluence cavity and the evaporation cavity are communicated via the wick layer.
  • Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is a schematic, exploded view of a heat dissipation device in accordance with a preferred embodiment;
  • FIG. 2 is a schematic isometric of the heat dissipation device of FIG. 1;
  • FIG. 3 is a schematic cross-sectional view taken along line III-III of FIG. 2; and
  • FIG. 4 is a schematic, sectional view of the heat dissipation device of FIG. 1 employed in a heat dissipation apparatus.
  • The exemplifications set out herein illustrate at least one preferred embodiment of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • Embodiments of the present heat dissipation device will now be described in detail below and with reference to the drawings.
  • Referring to FIG. 1 to FIG. 3, a heat dissipation device 10 according to a preferred embodiment is provided. The heat dissipation device 10 comprises a first assembly 100 having a first shell portion 110 and a wick layer 120 formed thereon, and a second assembly 200 having a second shell portion 210 and a clapboard 220 formed thereon. The wick layer 120 and the clapboard 220 each has a top surface (not labeled). The first assembly 100 and second assembly 200 are coupled together by jointing or sticking, and the top surface of the wick layer 120 is substantially coplanar with the top surface of the clapboard 220, thereby a circumfluence cavity 11 and an evaporation cavity 12 separated by the clapboard 220 are thereby formed. The circumfluence cavity 11 and the evaporation cavity 12 are communicated via the wick layer 120. Two through holes 211 and 212 are defined in the second shell portion 210 and connected with the circumfluence cavity 11 and the evaporation cavity 12 respectively. Alternatively, the through holes 211 and 212 can be defined in the first shell portion 110, or be defined in the first shell portion 110 and the second shell portion 210 respectively.
  • The first shell portion 110 employs a base plate comprises a rectangular portion 111 and an arc-shaped portion 112 extending from one side of the rectangular portion 111. Preferably, the first shell portion 110 further comprises a narrow raised strip 115 protruded from the junction of the rectangular portion 111 and the arc-shaped portion 112 perpendicularly. The wick layer 120 is shaped in accordance with the rectangular portion 111 of the first shell portion 110 and formed thereon. The narrow raised strip 115 has a top surface substantially coplanar with the top surface of the wick layer 120. The wick layer 120 can be made from a sintered layer or a carbon nanotube layer. The sintered layer can be sintered with metal powder. The metal powder can be selected from the group comprising of copper (Cu) powder, aluminum (Al) powder, and iron (Fe) powder. In the preferred embodiment, the wick layer 120 employs a sintered layer of copper powder.
  • The second shell portion 210 of the second assembly 200 comprises a flat portion 213 in accordance with the first shell portion 110, and a side wall portion 215 extended from the edge of the flat portion 213 perpendicularly In the preferred embodiment, the second assembly 200 further comprises a plurality of guiding pieces 230 extended from the flat portion 213 of the second shell portion 210. The top surfaces of the guiding pieces 230 are substantially coplanar with the top surface of the clapboard 220. The side wall portion 215, the clapboard 220, and the guiding pieces 230 are extended from the flat portion 213 on the same side. Preferably, the second shell portion 210, the clapboard 220, and the guiding pieces 230 are integrally formed. More preferably, the guiding pieces 230 are substantially parallel to each other and orthogonal to the clapboard 220. Furthermore, one end of each guiding pieces 230 is coupled to the clapboard 220. The first shell portion 110 and the second assembly 200 can be made from material selected from the group comprising of copper, aluminum, iron, and any suitable alloy thereof.
  • The evaporation cavity 12 comprises a arc-shaped gas collecting chamber 121 in accordance with the arc-shaped portion 112 of the first shell portion 110, and a plurality guiding channels 122 defined by the guiding pieces 230 together with the flat portion 213 and the side wall portion 215. The through hole 212 is defined in the side wall portion 215 of the second shell portion 210 and positioned at the vertex of the arc-shaped gas collecting chamber. The through hole 211 is defined in the side wall portion 215 of the second shell portion 210 provided around the circumfluence cavity 11.
  • Referring to FIG. 1 to FIG. 4, the heat dissipation device 10 is employed in a heat dissipation apparatus 50 for cooling down a heat source 30. In the preferred embodiment, a section of evaporation cavity 12 is in thermal communication with the heat source 30, and the section is overlapped with the wick layer 120. In detail, the heat source 30 is connected with the first shell portion 110 directly. The two through holes 211 and 212 of the heat dissipation device 10 are connected with a condenser 20 via two pipes 21 and 22 of the condenser 20 respectively. During the cooling process, a liquid operating fluid (not shown) is injected into the circumfluence cavity 11 via the through hole 211. The operating fluid is moved from the circumfluence cavity 11 to the evaporation cavity 12 through the wick layer 120 by capillary action of the wick layer 120. When the heat of the heat source 30 is absorbed by the wick layer 120 via the first shell portion 110, and further absorbed by the operating fluid inside the wick layer 120, the operating fluid is then vaporized to steam. The steam is guided to the gas collecting chamber 121 via the guiding channels 122, and then flows to the condenser 20 via the through hole 212 and the pipe 22. The steam changes back to the liquid operating fluid in the condenser 20 and then flows back to the circumfluence cavity 11 via the through hole 211 and the pipe 21. The heat source 30 is then cooled down by phase change cycles of the operating fluid.
  • As stated above, the wick layer 120 is formed on the first shell portion 110, the size of the wick layer 120 can be adjusted according to different heat dissipation requirements, and the evaporation cavity 12 is in thermal communication with the heat source 30 directly, thereby high contact surface and low thermal contact resistance can be provided by the present heat dissipation device at the same time. Therefore, the present heat dissipation device can provide high heat transfer rate with a small size. Furthermore, the guiding channels 122 formed by the guiding pieces 230 lead to the arc-shaped gas collecting chamber 121, the flow resistance of the steam can be reduced.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (18)

  1. 1. A heat dissipation device comprising:
    a first assembly comprising a first shell portion and a wick layer formed thereon;
    a second assembly comprising a second shell portion and a clapboard formed thereon; and
    a circumfluence cavity and an evaporation cavity being formed by coupling the first assembly and the second assembly together and separated from each other by the clapboard;
    wherein, the circumfluence cavity and the evaporation cavity are communicated via the wick layer of the first assembly.
  2. 2. The heat dissipation device in accordance with claim 1, wherein the circumfluence cavity and the evaporation cavity each having a through hole defined in one of the shell portions.
  3. 3. The heat dissipation device in accordance with claim 1, wherein a top surface of the wick layer is coplanar with a top surface of the clapboard.
  4. 4. The heat dissipation device in accordance with claim 1, wherein the second shell portion comprises a flat portion in accordance with the first shell portion, and a side wall portion extending from the edge of the flat portion perpendicularly.
  5. 5. The heat dissipation device in accordance with claim 4, wherein the second assembly further comprises a plurality of guiding pieces extending from the second shell portion.
  6. 6. The heat dissipation device in accordance with claim 5, wherein the guiding pieces form top surfaces coplanar with a top surface of the clapboard.
  7. 7. The heat dissipation device in accordance with claim 5, wherein the guiding pieces are substantially parallel to each other and orthogonal to the clapboard.
  8. 8. The heat dissipation device in accordance with claim 5, wherein one end of each guiding pieces is coupled to the clapboard.
  9. 9. The heat dissipation device in accordance with claim 5, wherein the second shell portion, the clapboard, and the guiding pieces are integrally formed.
  10. 10. The heat dissipation device in accordance with claim 5, wherein the evaporation cavity comprises a gas collecting chamber and a plurality of guiding channels defined by the guiding pieces with the second shell portion.
  11. 11. The heat dissipation device in accordance with claim 10, wherein the gas collecting chamber is an arc-shaped gas collecting chamber.
  12. 12. The heat dissipation device in accordance with claim 1, wherein the first shell portion and the second assembly are made from material selected from the group comprising of copper, aluminum, iron, and any alloy thereof.
  13. 13. The heat dissipation device in accordance with claim 1, wherein the wick layer is made from a sintered layer.
  14. 14. The heat dissipation device in accordance with claim 13, wherein the sintered layer is sintered with material selected from the group comprising of copper powder, aluminum powder, and iron powder.
  15. 15. The heat dissipation device in accordance with claim 1, wherein the wick layer is made from a carbon nanotube layer.
  16. 16. The heat dissipation device in accordance with claim 1, wherein the first assembly and second assembly are coupled together by jointing.
  17. 17. The heat dissipation device in accordance with claim 1, wherein the first assembly and second assembly are coupled together by sticking.
  18. 18. A heat dissipation device comprising:
    a first assembly comprising a first shell portion and a wick layer formed thereon;
    a second assembly comprising a second shell portion and a clapboard formed thereon; and
    a cavity having a circumfluence portion and an evaporation portion formed by coupling the first assembly and the second assembly together;
    wherein, the circumfluence portion and the evaporation portion are separated by the clapboard of the second assembly and communicated with each other via the wick layer of the first assembly, each of the circumfluence portion and the evaporation portion having a through hole defined in one of the shell portions of the first assembly and the second assembly.
US11416555 2005-08-12 2006-05-03 Heat dissipation device Abandoned US20070034358A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200510036590 CN1913137B (en) 2005-08-12 2005-08-12 Cooling mould set
CN200510036590.4 2005-08-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US20100084113A1 (en) * 2006-10-11 2010-04-08 Jeong Hyun Lee Method for heat transfer and device therefor
US20120043060A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US20160131440A1 (en) * 2009-04-10 2016-05-12 Nexchip Technologies Method for heat transfer and device therefor

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004441A (en) * 1975-08-28 1977-01-25 Grumman Aerospace Corporation Process for modifying capillary grooves
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US4602679A (en) * 1982-03-22 1986-07-29 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6651735B2 (en) * 2001-05-15 2003-11-25 Samsung Electronics Co., Ltd. Evaporator of CPL cooling apparatus having fine wick structure
US6719039B2 (en) * 2000-11-21 2004-04-13 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US20050092467A1 (en) * 2003-10-31 2005-05-05 Hon Hai Precision Industry Co., Ltd. Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe
US6901994B1 (en) * 2004-01-05 2005-06-07 Industrial Technology Research Institute Flat heat pipe provided with means to enhance heat transfer thereof
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US20060137860A1 (en) * 2004-12-29 2006-06-29 Ravi Prasher Heat flux based microchannel heat exchanger architecture for two phase and single phase flows
US7262966B2 (en) * 2004-05-28 2007-08-28 Rhinol Tech Corp. Heat sink modules for light and thin electronic equipment

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004441A (en) * 1975-08-28 1977-01-25 Grumman Aerospace Corporation Process for modifying capillary grooves
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US4602679A (en) * 1982-03-22 1986-07-29 Grumman Aerospace Corporation Capillary-pumped heat transfer panel and system
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US6719039B2 (en) * 2000-11-21 2004-04-13 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6651735B2 (en) * 2001-05-15 2003-11-25 Samsung Electronics Co., Ltd. Evaporator of CPL cooling apparatus having fine wick structure
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US20050092467A1 (en) * 2003-10-31 2005-05-05 Hon Hai Precision Industry Co., Ltd. Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe
US6901994B1 (en) * 2004-01-05 2005-06-07 Industrial Technology Research Institute Flat heat pipe provided with means to enhance heat transfer thereof
US7262966B2 (en) * 2004-05-28 2007-08-28 Rhinol Tech Corp. Heat sink modules for light and thin electronic equipment
US20060137860A1 (en) * 2004-12-29 2006-06-29 Ravi Prasher Heat flux based microchannel heat exchanger architecture for two phase and single phase flows

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100084113A1 (en) * 2006-10-11 2010-04-08 Jeong Hyun Lee Method for heat transfer and device therefor
US9250025B2 (en) * 2006-10-11 2016-02-02 Nexchip Technologies Method for heat transfer and device therefor
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US8016024B2 (en) * 2007-01-09 2011-09-13 Tamkang University Loop heat pipe with flat evaportor having a wick with an internal chamber
US20160131440A1 (en) * 2009-04-10 2016-05-12 Nexchip Technologies Method for heat transfer and device therefor
US20120043060A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US8622118B2 (en) * 2010-08-20 2014-01-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Loop heat pipe

Also Published As

Publication number Publication date Type
CN1913137A (en) 2007-02-14 application
CN1913137B (en) 2010-05-26 grant

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Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LEE, HSIN-HO;REEL/FRAME:017872/0268

Effective date: 20060425