CN1979829A - 带载封装及搭载有该带载封装的显示装置 - Google Patents
带载封装及搭载有该带载封装的显示装置 Download PDFInfo
- Publication number
- CN1979829A CN1979829A CNA2006101640335A CN200610164033A CN1979829A CN 1979829 A CN1979829 A CN 1979829A CN A2006101640335 A CNA2006101640335 A CN A2006101640335A CN 200610164033 A CN200610164033 A CN 200610164033A CN 1979829 A CN1979829 A CN 1979829A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- pattern
- electrode pattern
- radiating
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005350835 | 2005-12-05 | ||
JP2005350835A JP4781097B2 (ja) | 2005-12-05 | 2005-12-05 | テープキャリアパッケージ及びそれを搭載した表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1979829A true CN1979829A (zh) | 2007-06-13 |
CN100570867C CN100570867C (zh) | 2009-12-16 |
Family
ID=38130929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101640335A Active CN100570867C (zh) | 2005-12-05 | 2006-12-05 | 带载封装及搭载有该带载封装的显示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7821115B2 (zh) |
JP (1) | JP4781097B2 (zh) |
KR (1) | KR100859297B1 (zh) |
CN (1) | CN100570867C (zh) |
TW (1) | TWI376025B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101958295A (zh) * | 2009-07-15 | 2011-01-26 | 瑞萨电子株式会社 | 半导体装置 |
CN101878524B (zh) * | 2007-11-30 | 2012-10-03 | 夏普株式会社 | 源极驱动器、源极驱动器的制造方法和液晶模块 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5273333B2 (ja) * | 2006-12-28 | 2013-08-28 | 株式会社ジャパンディスプレイ | 表示装置 |
US20090020316A1 (en) * | 2007-07-19 | 2009-01-22 | Chia-Hui Wu | Method of manufacturing chip on film and structure thereof |
US20090040169A1 (en) * | 2007-08-07 | 2009-02-12 | Yu-Jui Chang | Driving module for driving lcd panel and method of forming lcd device |
KR101641354B1 (ko) * | 2009-07-09 | 2016-07-20 | 엘지디스플레이 주식회사 | 액정표시장치 |
KR101680115B1 (ko) * | 2010-02-26 | 2016-11-29 | 삼성전자 주식회사 | 반도체칩, 필름 및 그를 포함하는 탭 패키지 |
KR101026941B1 (ko) * | 2010-04-07 | 2011-04-04 | 엘지이노텍 주식회사 | 인쇄회로 기판 |
WO2014136735A1 (ja) * | 2013-03-04 | 2014-09-12 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置 |
CN104112724A (zh) * | 2013-04-22 | 2014-10-22 | 华硕电脑股份有限公司 | 散热元件 |
JP5657767B2 (ja) * | 2013-10-30 | 2015-01-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5878611B2 (ja) * | 2014-11-26 | 2016-03-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR102662960B1 (ko) * | 2016-06-30 | 2024-05-02 | 엘지디스플레이 주식회사 | 면적이 감소된 연성필름 및 이를 구비한 표시장치 |
CN107333441A (zh) * | 2017-07-24 | 2017-11-07 | 苏州天脉导热科技有限公司 | 脉络均热板及使用该均热板的电视机 |
KR102578051B1 (ko) * | 2018-06-01 | 2023-09-14 | 삼성전자주식회사 | 필름형 패키지 및 이를 구비한 디스플레이 장치 |
JP2020004885A (ja) * | 2018-06-29 | 2020-01-09 | 太陽誘電株式会社 | 半導体モジュール |
KR102603403B1 (ko) | 2018-08-09 | 2023-11-17 | 삼성디스플레이 주식회사 | 표시 장치 |
JP7318055B2 (ja) * | 2019-08-27 | 2023-07-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6870043B2 (ja) * | 2019-08-27 | 2021-05-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223088Y2 (zh) * | 1980-07-22 | 1987-06-12 | ||
JPS595982Y2 (ja) * | 1980-12-01 | 1984-02-23 | 日本電気株式会社 | 半導体装置 |
JP2737963B2 (ja) | 1988-12-07 | 1998-04-08 | 日本電気株式会社 | Tabの構造 |
JPH0357248A (ja) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | テープキャリア方式による樹脂封止型半導体装置 |
JP3207743B2 (ja) * | 1996-03-22 | 2001-09-10 | シャープ株式会社 | フレキシブル配線基板の端子構造およびそれを用いたicチップの実装構造 |
JP3524549B1 (ja) | 1996-03-26 | 2004-05-10 | キヤノン株式会社 | 接続構造体及び表示装置 |
JPH1032229A (ja) | 1996-03-26 | 1998-02-03 | Canon Inc | Tcp構造体、回路接続構造及び表示装置 |
TW462120B (en) * | 2000-11-10 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Tape carrier type semiconductor package structure |
JP4176979B2 (ja) * | 2001-09-27 | 2008-11-05 | パイオニア株式会社 | フラットパネル型表示装置 |
-
2005
- 2005-12-05 JP JP2005350835A patent/JP4781097B2/ja active Active
-
2006
- 2006-12-01 KR KR1020060120401A patent/KR100859297B1/ko active IP Right Grant
- 2006-12-04 TW TW095145045A patent/TWI376025B/zh active
- 2006-12-05 US US11/566,892 patent/US7821115B2/en active Active
- 2006-12-05 CN CNB2006101640335A patent/CN100570867C/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101878524B (zh) * | 2007-11-30 | 2012-10-03 | 夏普株式会社 | 源极驱动器、源极驱动器的制造方法和液晶模块 |
CN101958295A (zh) * | 2009-07-15 | 2011-01-26 | 瑞萨电子株式会社 | 半导体装置 |
US8686574B2 (en) | 2009-07-15 | 2014-04-01 | Renesas Electronics Corporation | Semiconductor device |
CN101958295B (zh) * | 2009-07-15 | 2014-10-01 | 瑞萨电子株式会社 | 半导体装置 |
US8975762B2 (en) | 2009-07-15 | 2015-03-10 | Renesas Electronics Corporation | Semiconductor device |
US11244883B2 (en) | 2009-07-15 | 2022-02-08 | Renesas Electronics Corporation | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TW200739867A (en) | 2007-10-16 |
CN100570867C (zh) | 2009-12-16 |
US20070126090A1 (en) | 2007-06-07 |
KR100859297B1 (ko) | 2008-09-19 |
JP4781097B2 (ja) | 2011-09-28 |
KR20070058972A (ko) | 2007-06-11 |
US7821115B2 (en) | 2010-10-26 |
JP2007158001A (ja) | 2007-06-21 |
TWI376025B (en) | 2012-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: RENESAS ELECTRONICS CO., LTD. Free format text: FORMER NAME: NEC CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Kanagawa, Japan Patentee before: NEC Corp. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Patentee after: Renesas Electronics Corporation Address before: Kanagawa, Japan Patentee before: Renesas Electronics Corporation |