CN1938380A - 热固性树脂组合物和使用该组合物的多层印刷线路板 - Google Patents
热固性树脂组合物和使用该组合物的多层印刷线路板 Download PDFInfo
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- CN1938380A CN1938380A CNA2005800104989A CN200580010498A CN1938380A CN 1938380 A CN1938380 A CN 1938380A CN A2005800104989 A CNA2005800104989 A CN A2005800104989A CN 200580010498 A CN200580010498 A CN 200580010498A CN 1938380 A CN1938380 A CN 1938380A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2314/00—Polymer mixtures characterised by way of preparation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
发明例1 | 发明例2 | 发明例3 | 发明例4 | 对比例1 | 对比例2 | 对比例3 | 对比例4 | 对比例5 | 对比例6 | |
树脂(A-1)*1 | 30 | 30 | 30 | 30 | - | - | - | - | - | - |
树脂(C-1)*2 | - | - | - | - | - | - | 30 | - | - | 30 |
树脂(C-2)*3 | - | - | - | - | - | - | - | 30 | - | - |
树脂(B-1-1)*4 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 |
树脂(B-1-2)*5 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 | 35 |
树脂(B-2-1)*6 | - | 6 | - | 6 | - | - | - | - | 6 | 6 |
树脂(B-3-1)*7 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
固化催化剂(B-4-1)*8 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
氧化硅*9 | - | - | 45 | 45 | - | 45 | - | - | - | 45 |
*1:乙酰基变性的双酚S/联二甲苯酚苯氧基树脂RX200(Dainippon ink andchemicals,incorporated;乙酰化度大于或等于90%;Mn=16000;Mw=82000)*2:双酚A苯氧基树脂YP-50(Tohto kasei co.,ltd.;Mn=14200,Mw=58000)*3:双酚S/联二甲苯酚苯氧基树脂YX8100(Japan epoxy resins co.,ltd.;Mn=13000;Mw=34000)*4:环氧树脂HP4032(Dainppon ink and chemicals,incorporated;环氧当量=140)*5:环氧树脂HP7200(Dainppon ink and chemicals,incorporated;环氧当量=280)*6:氢化丁二烯变性端羧基超支化类型的聚酰亚胺RS23-306(Dainippon ink andchemicals,incorporated)*7:酚醛树脂HF-1(Meiwa plastic industries ltd.)*8:咪唑2PHZ(Shikoku chemicals corporation)*9:球形氧化硅SO-C5(Admatechs co.,Ltd.) |
发明例1 | 发明例2 | 发明例3 | 发明例4 | 对比例1 | 对比例2 | 对比例3 | 对比例4 | 对比例5 | 对比例6 | ||
Tg(℃) | 137 | 142 | 153 | 145 | 148 | 153 | 135 | 138 | 155 | 148 | |
CTE(<Tg) | 70 | 69 | 64 | 64 | 62 | 59 | 70 | 68 | 61 | 65 | |
CTE(>Tg) | 160 | 158 | 135 | 137 | 142 | 125 | 160 | 157 | 142 | 135 | |
介电常数 | 1GHz | 3 | 3 | 2.9 | 2.9 | 3.2 | 3.1 | 3.2 | 3.2 | 3 | 3 |
3GHz | 3 | 2.9 | 2.9 | 2.8 | 3.2 | 3 | 3.2 | 3.1 | 3 | 2.9 | |
5GHz | 2.9 | 2.9 | 2.8 | 2.7 | 3.1 | 2.9 | 3.1 | 3.1 | 3 | 2.9 | |
10GHz | 2.9 | 2.8 | 2.7 | 2.7 | 2.9 | 2.8 | 3 | 3 | 2.9 | 2.8 | |
介质损耗因数 | 1GHz | 0.022 | 0.021 | 0.018 | 0.018 | 0.025 | 0.021 | 0.031 | 0.03 | 0.024 | 0.028 |
3GHz | 0.022 | 0.022 | 0.02 | 0.019 | 0.027 | 0.023 | 0.039 | 0.038 | 0.026 | 0.033 | |
5GHz | 0.023 | 0.023 | 0.02 | 0.02 | 0.027 | 0.024 | 0.046 | 0.049 | 0.027 | 0.039 | |
10GHz | 0.024 | 0.024 | 0.021 | 0.02 | 0.03 | 0.026 | 0.052 | 0.053 | 0.029 | 0.045 | |
焊料耐热性(次数) | 4 | 5 | 4 | 5 | NG | NG | NG | NG | 2 | 2 | |
剥离强度(N/cm) | 8 | 9.2 | 7.8 | 9 | 2.8 | 3.8 | 4.7 | 4.8 | 7.2 | 7.1 | |
树脂流逸量(mm) | 4 | 3 | 2 | 3 | NG | NG | 4 | 3 | NG | 3 |
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004100866 | 2004-03-30 | ||
JP100866/2004 | 2004-03-30 | ||
PCT/JP2005/006164 WO2005095517A1 (ja) | 2004-03-30 | 2005-03-30 | 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1938380A true CN1938380A (zh) | 2007-03-28 |
CN1938380B CN1938380B (zh) | 2012-01-25 |
Family
ID=35063746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800104989A Active CN1938380B (zh) | 2004-03-30 | 2005-03-30 | 热固性树脂组合物和使用该组合物的多层印刷线路 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7825198B2 (zh) |
JP (1) | JP5227514B2 (zh) |
KR (1) | KR100790660B1 (zh) |
CN (1) | CN1938380B (zh) |
TW (1) | TW200602427A (zh) |
WO (1) | WO2005095517A1 (zh) |
Cited By (5)
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CN104364999A (zh) * | 2012-06-15 | 2015-02-18 | 三菱电机株式会社 | 旋转电机定子线圈绝缘用液体状热固化性树脂组合物、使用了其的旋转电机及其制造方法 |
CN104884531A (zh) * | 2012-12-12 | 2015-09-02 | Lg伊诺特有限公司 | 环氧树脂组合物及使用该环氧树脂组合物的印刷电路板 |
CN105199320A (zh) * | 2015-09-24 | 2015-12-30 | 苏州宽温电子科技有限公司 | 一种高耐热环氧树脂基材料及其制备方法 |
CN105940037A (zh) * | 2014-01-30 | 2016-09-14 | 沙特基础工业全球技术有限公司 | 双酚二缩水甘油醚和酚酞和/或苯酚苯并[c]吡咯酮的共聚物、其制备方法、含共聚物的制品及含共聚物的组合物 |
CN109563344A (zh) * | 2016-08-05 | 2019-04-02 | 日本化药株式会社 | 马来酰亚胺树脂组合物、预浸料、其硬化物及半导体装置 |
Families Citing this family (22)
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JP5109258B2 (ja) * | 2006-01-18 | 2012-12-26 | 住友ベークライト株式会社 | 半導体装置 |
JP5326188B2 (ja) * | 2006-04-04 | 2013-10-30 | Dic株式会社 | 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔 |
KR101077435B1 (ko) * | 2007-01-25 | 2011-10-26 | 파나소닉 전공 주식회사 | 프리프레그, 프린트 배선판, 다층 회로 기판, 프린트 배선판의 제조 방법 |
JP5358892B2 (ja) * | 2007-03-26 | 2013-12-04 | Dic株式会社 | 熱硬化性ポリウレタン樹脂組成物 |
JP5092484B2 (ja) * | 2007-03-26 | 2012-12-05 | Dic株式会社 | 熱硬化性ポリイミド樹脂組成物 |
KR101070798B1 (ko) * | 2008-01-15 | 2011-10-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US8236615B2 (en) * | 2009-11-25 | 2012-08-07 | International Business Machines Corporation | Passivation layer surface topography modifications for improved integrity in packaged assemblies |
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US8436125B2 (en) | 2010-05-27 | 2013-05-07 | Basf Se | Materials, methods for production thereof and components thereof |
JP5740940B2 (ja) * | 2010-11-30 | 2015-07-01 | 味の素株式会社 | 金属張積層板の製造方法 |
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KR101350997B1 (ko) * | 2012-08-21 | 2014-01-14 | 주식회사 신아티앤씨 | 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법 |
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KR100930937B1 (ko) * | 2002-01-31 | 2009-12-10 | 디아이씨 가부시끼가이샤 | 열경화성 폴리이미드 수지 조성물 및 폴리이미드 수지의제조 방법 |
US20040094751A1 (en) * | 2002-03-25 | 2004-05-20 | Toshiaki Ogiwara | Composition for filling through-holes in printed wiring boards |
JP2004099635A (ja) * | 2002-09-04 | 2004-04-02 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物とその成形物、及びそれらの硬化物 |
US7816430B2 (en) * | 2002-09-30 | 2010-10-19 | Hitachi Chemical Company, Ltd. | Composition of polycyanate ester and biphenyl epoxy resin |
US7087702B2 (en) * | 2002-10-15 | 2006-08-08 | Dainippon Ink And Chemicals, Inc. | Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin |
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2005
- 2005-03-04 TW TW094106707A patent/TW200602427A/zh unknown
- 2005-03-30 KR KR1020067020231A patent/KR100790660B1/ko active IP Right Grant
- 2005-03-30 JP JP2006511766A patent/JP5227514B2/ja active Active
- 2005-03-30 WO PCT/JP2005/006164 patent/WO2005095517A1/ja active Application Filing
- 2005-03-30 CN CN2005800104989A patent/CN1938380B/zh active Active
-
2006
- 2006-09-22 US US11/525,019 patent/US7825198B2/en active Active
Cited By (7)
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CN104364999A (zh) * | 2012-06-15 | 2015-02-18 | 三菱电机株式会社 | 旋转电机定子线圈绝缘用液体状热固化性树脂组合物、使用了其的旋转电机及其制造方法 |
CN104364999B (zh) * | 2012-06-15 | 2016-12-07 | 三菱电机株式会社 | 旋转电机定子线圈绝缘用液体状热固化性树脂组合物、使用了其的旋转电机及其制造方法 |
CN104884531A (zh) * | 2012-12-12 | 2015-09-02 | Lg伊诺特有限公司 | 环氧树脂组合物及使用该环氧树脂组合物的印刷电路板 |
CN104884531B (zh) * | 2012-12-12 | 2017-10-03 | Lg伊诺特有限公司 | 环氧树脂组合物及使用该环氧树脂组合物的印刷电路板 |
CN105940037A (zh) * | 2014-01-30 | 2016-09-14 | 沙特基础工业全球技术有限公司 | 双酚二缩水甘油醚和酚酞和/或苯酚苯并[c]吡咯酮的共聚物、其制备方法、含共聚物的制品及含共聚物的组合物 |
CN105199320A (zh) * | 2015-09-24 | 2015-12-30 | 苏州宽温电子科技有限公司 | 一种高耐热环氧树脂基材料及其制备方法 |
CN109563344A (zh) * | 2016-08-05 | 2019-04-02 | 日本化药株式会社 | 马来酰亚胺树脂组合物、预浸料、其硬化物及半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100790660B1 (ko) | 2008-01-02 |
TW200602427A (en) | 2006-01-16 |
US7825198B2 (en) | 2010-11-02 |
JPWO2005095517A1 (ja) | 2008-02-21 |
KR20070009604A (ko) | 2007-01-18 |
TWI367918B (zh) | 2012-07-11 |
JP5227514B2 (ja) | 2013-07-03 |
CN1938380B (zh) | 2012-01-25 |
US20070015872A1 (en) | 2007-01-18 |
WO2005095517A1 (ja) | 2005-10-13 |
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