CN1936678A - 基板组装装置和基板组装方法 - Google Patents
基板组装装置和基板组装方法 Download PDFInfo
- Publication number
- CN1936678A CN1936678A CNA2006101110767A CN200610111076A CN1936678A CN 1936678 A CN1936678 A CN 1936678A CN A2006101110767 A CNA2006101110767 A CN A2006101110767A CN 200610111076 A CN200610111076 A CN 200610111076A CN 1936678 A CN1936678 A CN 1936678A
- Authority
- CN
- China
- Prior art keywords
- substrate
- bonding
- base plate
- room
- vacuum state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005254302A JP4107316B2 (ja) | 2005-09-02 | 2005-09-02 | 基板貼合装置 |
JP2005254302 | 2005-09-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1936678A true CN1936678A (zh) | 2007-03-28 |
CN100451775C CN100451775C (zh) | 2009-01-14 |
Family
ID=37828974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101110767A Expired - Fee Related CN100451775C (zh) | 2005-09-02 | 2006-08-18 | 基板组装装置和基板组装方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US20070051462A1 (zh) |
JP (1) | JP4107316B2 (zh) |
KR (1) | KR100795136B1 (zh) |
CN (1) | CN100451775C (zh) |
TW (1) | TW200714951A (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299048A (zh) * | 2010-06-22 | 2011-12-28 | 硅绝缘体技术有限公司 | 用于制造半导体器件的装置 |
WO2012040962A1 (zh) * | 2010-09-30 | 2012-04-05 | 深圳市华星光电技术有限公司 | 液晶盒成盒装置及其方法 |
CN102514341A (zh) * | 2011-11-24 | 2012-06-27 | 深圳市宝德自动化精密设备有限公司 | 精密真空oca贴合机及贴合生产方法 |
CN102576689A (zh) * | 2009-07-21 | 2012-07-11 | 株式会社尼康 | 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 |
US8985175B2 (en) | 2008-01-09 | 2015-03-24 | Mitsubishi Heavy Industries, Ltd. | Room temperature bonding machine and room temperature bonding method |
US9054140B2 (en) | 2009-07-21 | 2015-06-09 | Nikon Corporation | Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices |
CN104730743A (zh) * | 2015-03-31 | 2015-06-24 | 合肥鑫晟光电科技有限公司 | 真空贴合设备 |
CN110120181A (zh) * | 2019-04-16 | 2019-08-13 | 武汉华星光电技术有限公司 | 加压脱泡装置及加压脱泡方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107316B2 (ja) * | 2005-09-02 | 2008-06-25 | 株式会社日立プラントテクノロジー | 基板貼合装置 |
KR101311855B1 (ko) * | 2006-12-08 | 2013-09-27 | 엘아이지에이디피 주식회사 | 기판합착장치 및 기판합착방법 |
US8387674B2 (en) * | 2007-11-30 | 2013-03-05 | Taiwan Semiconductor Manufacturing Comany, Ltd. | Chip on wafer bonder |
TW200931101A (en) * | 2007-12-12 | 2009-07-16 | Chung Shan Inst Of Science | Method of assembling LCD panel, interface apparatus, and assembling apparatus |
US7947570B2 (en) * | 2008-01-16 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method and manufacturing apparatus of semiconductor substrate |
FR2935536B1 (fr) * | 2008-09-02 | 2010-09-24 | Soitec Silicon On Insulator | Procede de detourage progressif |
CN101585668B (zh) * | 2008-10-23 | 2010-10-13 | 刘苏海 | 一种夹层玻璃成型机 |
JP4796120B2 (ja) * | 2008-12-11 | 2011-10-19 | 三菱重工業株式会社 | 常温接合装置 |
EP2200077B1 (en) * | 2008-12-22 | 2012-12-05 | Soitec | Method for bonding two substrates |
JP5326098B2 (ja) * | 2009-02-05 | 2013-10-30 | シャープ株式会社 | 基板表面の封止装置と有機elパネルの製造方法 |
KR101073558B1 (ko) * | 2009-10-08 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 기판 합착 장치 및 기판 합착 방법 |
US8338266B2 (en) | 2010-08-11 | 2012-12-25 | Soitec | Method for molecular adhesion bonding at low pressure |
JP5334135B2 (ja) * | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | 積層装置 |
FR2964193A1 (fr) | 2010-08-24 | 2012-03-02 | Soitec Silicon On Insulator | Procede de mesure d'une energie d'adhesion, et substrats associes |
DE102010048043A1 (de) | 2010-10-15 | 2012-04-19 | Ev Group Gmbh | Vorrichtung und Verfahren zur Prozessierung von Wafern |
PL2924536T3 (pl) * | 2014-03-28 | 2016-11-30 | Sposób i urządzenie do mocowania płyty ochronnej na wyświetlaczu | |
US20170207191A1 (en) * | 2016-01-15 | 2017-07-20 | Taiwan Semiconductor Manufacturing Company Ltd. | Bonding system and associated apparatus and method |
KR102041044B1 (ko) * | 2018-04-30 | 2019-11-05 | 피에스케이홀딩스 주식회사 | 기판 지지 유닛 |
CN109581707B (zh) * | 2018-11-15 | 2021-02-26 | 惠科股份有限公司 | 贴合显示面板的方法、控制装置及真空贴合机 |
US11604372B2 (en) | 2018-11-15 | 2023-03-14 | HKC Corporation Limited | Method and control device for laminating display panel as well as vacuum laminator |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61291631A (ja) * | 1985-06-17 | 1986-12-22 | Honda Motor Co Ltd | 真空処理方法および装置 |
JPH02235329A (ja) * | 1989-03-08 | 1990-09-18 | Mitsubishi Electric Corp | 半導体基板処理装置 |
JP3016792B2 (ja) * | 1989-06-19 | 2000-03-06 | 日本電気株式会社 | ウェーハ搬送システム |
US5223001A (en) * | 1991-11-21 | 1993-06-29 | Tokyo Electron Kabushiki Kaisha | Vacuum processing apparatus |
JPH0636198U (ja) * | 1992-10-06 | 1994-05-13 | 日新電機株式会社 | 真空処理装置 |
TW434745B (en) * | 1995-06-07 | 2001-05-16 | Tokyo Electron Ltd | Plasma processing apparatus |
JP2001235760A (ja) * | 1999-12-14 | 2001-08-31 | Sharp Corp | 液晶表示素子の製造方法およびその製造装置 |
JP3492284B2 (ja) * | 2000-04-19 | 2004-02-03 | 株式会社 日立インダストリイズ | 基板貼合装置 |
JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
JP3909659B2 (ja) * | 2001-06-26 | 2007-04-25 | 日本ビクター株式会社 | 液晶表示素子の製造方法 |
US7027122B2 (en) * | 2002-03-12 | 2006-04-11 | Lg.Philips Lcd Co., Ltd. | Bonding apparatus having compensating system for liquid crystal display device and method for manufacturing the same |
JP3693972B2 (ja) * | 2002-03-19 | 2005-09-14 | 富士通株式会社 | 貼合せ基板製造装置及び基板貼合せ方法 |
KR100840676B1 (ko) * | 2002-05-22 | 2008-06-24 | 엘지디스플레이 주식회사 | 액정표시소자의 핫 프레스 장치 및 이를 이용한 합착방법 |
JP3823083B2 (ja) * | 2002-07-19 | 2006-09-20 | 株式会社 日立インダストリイズ | 基板組立装置 |
JP2004157452A (ja) * | 2002-11-08 | 2004-06-03 | Seiko Epson Corp | 電気光学装置及びその製造装置 |
KR100662497B1 (ko) * | 2002-11-18 | 2007-01-02 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 제조 공정용 기판 합착 장치 |
JP2004179236A (ja) * | 2002-11-25 | 2004-06-24 | Matsushita Electric Ind Co Ltd | ドライエッチング装置、及びドライエッチング方法 |
JP4107316B2 (ja) * | 2005-09-02 | 2008-06-25 | 株式会社日立プラントテクノロジー | 基板貼合装置 |
-
2005
- 2005-09-02 JP JP2005254302A patent/JP4107316B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-28 TW TW095127813A patent/TW200714951A/zh not_active IP Right Cessation
- 2006-08-18 KR KR1020060078352A patent/KR100795136B1/ko not_active IP Right Cessation
- 2006-08-18 CN CNB2006101110767A patent/CN100451775C/zh not_active Expired - Fee Related
- 2006-08-31 US US11/513,071 patent/US20070051462A1/en not_active Abandoned
-
2007
- 2007-10-23 US US11/877,224 patent/US20080053619A1/en not_active Abandoned
-
2011
- 2011-11-29 US US13/306,060 patent/US20120067525A1/en not_active Abandoned
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8985175B2 (en) | 2008-01-09 | 2015-03-24 | Mitsubishi Heavy Industries, Ltd. | Room temperature bonding machine and room temperature bonding method |
CN102576689A (zh) * | 2009-07-21 | 2012-07-11 | 株式会社尼康 | 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 |
CN102576689B (zh) * | 2009-07-21 | 2015-06-03 | 株式会社尼康 | 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法 |
US9054140B2 (en) | 2009-07-21 | 2015-06-09 | Nikon Corporation | Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices |
US9138980B2 (en) | 2010-06-22 | 2015-09-22 | Soitec | Apparatus for manufacturing semiconductor devices |
CN102437073A (zh) * | 2010-06-22 | 2012-05-02 | 硅绝缘体技术有限公司 | 用于制造半导体器件的装置 |
CN102299048A (zh) * | 2010-06-22 | 2011-12-28 | 硅绝缘体技术有限公司 | 用于制造半导体器件的装置 |
CN105428285A (zh) * | 2010-06-22 | 2016-03-23 | 硅绝缘体技术有限公司 | 用于制造半导体器件的装置 |
CN102437073B (zh) * | 2010-06-22 | 2015-07-22 | 硅绝缘体技术有限公司 | 用于制造半导体器件的装置 |
WO2012040962A1 (zh) * | 2010-09-30 | 2012-04-05 | 深圳市华星光电技术有限公司 | 液晶盒成盒装置及其方法 |
US8388397B2 (en) | 2010-09-30 | 2013-03-05 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal cell manufacturing device and method thereof |
CN102514341A (zh) * | 2011-11-24 | 2012-06-27 | 深圳市宝德自动化精密设备有限公司 | 精密真空oca贴合机及贴合生产方法 |
CN104730743A (zh) * | 2015-03-31 | 2015-06-24 | 合肥鑫晟光电科技有限公司 | 真空贴合设备 |
CN104730743B (zh) * | 2015-03-31 | 2018-07-27 | 合肥鑫晟光电科技有限公司 | 真空贴合设备 |
CN110120181A (zh) * | 2019-04-16 | 2019-08-13 | 武汉华星光电技术有限公司 | 加压脱泡装置及加压脱泡方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080053619A1 (en) | 2008-03-06 |
US20070051462A1 (en) | 2007-03-08 |
JP4107316B2 (ja) | 2008-06-25 |
KR20070026019A (ko) | 2007-03-08 |
CN100451775C (zh) | 2009-01-14 |
TWI346225B (zh) | 2011-08-01 |
KR100795136B1 (ko) | 2008-01-17 |
TW200714951A (en) | 2007-04-16 |
US20120067525A1 (en) | 2012-03-22 |
JP2007065521A (ja) | 2007-03-15 |
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Legal Events
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C06 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI,LTD. Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD. Effective date: 20140306 |
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TR01 | Transfer of patent right | ||
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Effective date of registration: 20140306 Address after: Tokyo, Japan Patentee after: Hitachi Ltd. Address before: Tokyo, Japan, Japan Patentee before: Hitachi Plant Technologies Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20160818 |