CN1855364A - 热电晶圆夹盘 - Google Patents

热电晶圆夹盘 Download PDF

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Publication number
CN1855364A
CN1855364A CNA2006100781919A CN200610078191A CN1855364A CN 1855364 A CN1855364 A CN 1855364A CN A2006100781919 A CNA2006100781919 A CN A2006100781919A CN 200610078191 A CN200610078191 A CN 200610078191A CN 1855364 A CN1855364 A CN 1855364A
Authority
CN
China
Prior art keywords
termoelectric
round plate
crystal round
thermoelectric module
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100781919A
Other languages
English (en)
Chinese (zh)
Inventor
林俞良
林进贤
黄见翎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical Taiwan Semiconductor Manufacturing Co TSMC Ltd
Publication of CN1855364A publication Critical patent/CN1855364A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CNA2006100781919A 2005-04-28 2006-04-28 热电晶圆夹盘 Pending CN1855364A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/119,218 US20060242967A1 (en) 2005-04-28 2005-04-28 Termoelectric heating and cooling apparatus for semiconductor processing
US11/119,218 2005-04-28

Publications (1)

Publication Number Publication Date
CN1855364A true CN1855364A (zh) 2006-11-01

Family

ID=37195422

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100781919A Pending CN1855364A (zh) 2005-04-28 2006-04-28 热电晶圆夹盘

Country Status (4)

Country Link
US (1) US20060242967A1 (ja)
JP (1) JP2006310862A (ja)
CN (1) CN1855364A (ja)
TW (1) TW200638506A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102297543A (zh) * 2006-12-18 2011-12-28 美国能量变换公司 直接热电冷却器组件
WO2012129820A1 (zh) * 2011-03-29 2012-10-04 中国科学院微电子研究所 晶圆传送装置以及晶圆传送方法
CN105597850A (zh) * 2015-10-14 2016-05-25 华中科技大学 一种实验室用的电加热载物台
CN112240649A (zh) * 2020-10-10 2021-01-19 蔚县中天电子股份合作公司 一种温差电致冷组件

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US20110097495A1 (en) * 2009-09-03 2011-04-28 Universal Display Corporation Organic vapor jet printing with chiller plate
US8834155B2 (en) 2011-03-29 2014-09-16 Institute of Microelectronics, Chinese Academy of Sciences Wafer transfer apparatus and wafer transfer method
US9679792B2 (en) 2012-10-25 2017-06-13 Noah Precision, Llc Temperature control system for electrostatic chucks and electrostatic chuck for same
US10453775B1 (en) * 2015-06-10 2019-10-22 SA Photonics, Inc. Distributed thermoelectric cooling system
KR20170005222A (ko) * 2015-07-01 2017-01-12 현대자동차주식회사 열전모듈 조립체
US10780447B2 (en) * 2016-04-26 2020-09-22 Applied Materials, Inc. Apparatus for controlling temperature uniformity of a showerhead
KR102147181B1 (ko) * 2018-05-30 2020-08-25 주식회사 에프에스티 온도조절장치 및 이를 포함하는 반도체 처리장치
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3151008A (en) * 1960-09-23 1964-09-29 Sprague Electric Co Method of forming a p-nu junction
JP2636119B2 (ja) * 1992-09-08 1997-07-30 工業技術院長 熱電素子シートとその製造方法
US5385022A (en) * 1993-09-09 1995-01-31 Kornblit; Levy Apparatus and method for deep thermoelectric refrigeration
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP3918279B2 (ja) * 1997-02-28 2007-05-23 アイシン精機株式会社 多段電子冷却装置及びその製造方法
US5983644A (en) * 1997-09-29 1999-11-16 Applied Materials, Inc. Integrated bake and chill plate
JP3448737B2 (ja) * 2000-05-25 2003-09-22 住友重機械工業株式会社 ウエハーチャック用冷却板及びウエハーチャック
US6739138B2 (en) * 2001-11-26 2004-05-25 Innovations Inc. Thermoelectric modules and a heating and cooling apparatus incorporating same
US6745575B2 (en) * 2002-07-11 2004-06-08 Temptronic Corporation Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
JP4442171B2 (ja) * 2003-09-24 2010-03-31 東京エレクトロン株式会社 熱処理装置
WO2008002652A2 (en) * 2006-06-28 2008-01-03 Bipolar Solutions, Llc Apparatus for heating and cooling at food serving stations

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102297543A (zh) * 2006-12-18 2011-12-28 美国能量变换公司 直接热电冷却器组件
WO2012129820A1 (zh) * 2011-03-29 2012-10-04 中国科学院微电子研究所 晶圆传送装置以及晶圆传送方法
CN105597850A (zh) * 2015-10-14 2016-05-25 华中科技大学 一种实验室用的电加热载物台
CN112240649A (zh) * 2020-10-10 2021-01-19 蔚县中天电子股份合作公司 一种温差电致冷组件

Also Published As

Publication number Publication date
JP2006310862A (ja) 2006-11-09
TW200638506A (en) 2006-11-01
US20060242967A1 (en) 2006-11-02

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PB01 Publication
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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication