TW200638506A - Thermoelectric heating and cooling apparatus for semiconductor processing - Google Patents

Thermoelectric heating and cooling apparatus for semiconductor processing

Info

Publication number
TW200638506A
TW200638506A TW095110400A TW95110400A TW200638506A TW 200638506 A TW200638506 A TW 200638506A TW 095110400 A TW095110400 A TW 095110400A TW 95110400 A TW95110400 A TW 95110400A TW 200638506 A TW200638506 A TW 200638506A
Authority
TW
Taiwan
Prior art keywords
wafer
cooling apparatus
semiconductor processing
thermoelectric heating
thermoelectric
Prior art date
Application number
TW095110400A
Other languages
English (en)
Chinese (zh)
Inventor
Yu-Liang Lin
Chin-Hsien Lin
Chien-Ling Huang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200638506A publication Critical patent/TW200638506A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW095110400A 2005-04-28 2006-03-24 Thermoelectric heating and cooling apparatus for semiconductor processing TW200638506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/119,218 US20060242967A1 (en) 2005-04-28 2005-04-28 Termoelectric heating and cooling apparatus for semiconductor processing

Publications (1)

Publication Number Publication Date
TW200638506A true TW200638506A (en) 2006-11-01

Family

ID=37195422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110400A TW200638506A (en) 2005-04-28 2006-03-24 Thermoelectric heating and cooling apparatus for semiconductor processing

Country Status (4)

Country Link
US (1) US20060242967A1 (ja)
JP (1) JP2006310862A (ja)
CN (1) CN1855364A (ja)
TW (1) TW200638506A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US20080142068A1 (en) * 2006-12-18 2008-06-19 American Power Conversion Corporation Direct Thermoelectric chiller assembly
US20110097495A1 (en) * 2009-09-03 2011-04-28 Universal Display Corporation Organic vapor jet printing with chiller plate
US8834155B2 (en) 2011-03-29 2014-09-16 Institute of Microelectronics, Chinese Academy of Sciences Wafer transfer apparatus and wafer transfer method
CN102719895A (zh) * 2011-03-29 2012-10-10 中国科学院微电子研究所 晶圆传送装置以及晶圆传送方法
US9679792B2 (en) 2012-10-25 2017-06-13 Noah Precision, Llc Temperature control system for electrostatic chucks and electrostatic chuck for same
US10453775B1 (en) * 2015-06-10 2019-10-22 SA Photonics, Inc. Distributed thermoelectric cooling system
KR20170005222A (ko) * 2015-07-01 2017-01-12 현대자동차주식회사 열전모듈 조립체
CN105597850B (zh) * 2015-10-14 2017-07-07 华中科技大学 一种实验室用的电加热载物台
US10780447B2 (en) * 2016-04-26 2020-09-22 Applied Materials, Inc. Apparatus for controlling temperature uniformity of a showerhead
KR102147181B1 (ko) * 2018-05-30 2020-08-25 주식회사 에프에스티 온도조절장치 및 이를 포함하는 반도체 처리장치
CN112240649A (zh) * 2020-10-10 2021-01-19 蔚县中天电子股份合作公司 一种温差电致冷组件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3151008A (en) * 1960-09-23 1964-09-29 Sprague Electric Co Method of forming a p-nu junction
JP2636119B2 (ja) * 1992-09-08 1997-07-30 工業技術院長 熱電素子シートとその製造方法
US5385022A (en) * 1993-09-09 1995-01-31 Kornblit; Levy Apparatus and method for deep thermoelectric refrigeration
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP3918279B2 (ja) * 1997-02-28 2007-05-23 アイシン精機株式会社 多段電子冷却装置及びその製造方法
US5983644A (en) * 1997-09-29 1999-11-16 Applied Materials, Inc. Integrated bake and chill plate
JP3448737B2 (ja) * 2000-05-25 2003-09-22 住友重機械工業株式会社 ウエハーチャック用冷却板及びウエハーチャック
US6739138B2 (en) * 2001-11-26 2004-05-25 Innovations Inc. Thermoelectric modules and a heating and cooling apparatus incorporating same
US6745575B2 (en) * 2002-07-11 2004-06-08 Temptronic Corporation Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
JP4442171B2 (ja) * 2003-09-24 2010-03-31 東京エレクトロン株式会社 熱処理装置
WO2008002652A2 (en) * 2006-06-28 2008-01-03 Bipolar Solutions, Llc Apparatus for heating and cooling at food serving stations

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755996B (zh) * 2020-12-24 2022-02-21 天虹科技股份有限公司 用以產生均勻溫度的晶圓承載盤及應用該晶圓承載盤的薄膜沉積裝置

Also Published As

Publication number Publication date
JP2006310862A (ja) 2006-11-09
CN1855364A (zh) 2006-11-01
US20060242967A1 (en) 2006-11-02

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