CN1849560B - 感光性树脂组合物及使用该组合物的图案形成方法 - Google Patents

感光性树脂组合物及使用该组合物的图案形成方法 Download PDF

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Publication number
CN1849560B
CN1849560B CN2004800262121A CN200480026212A CN1849560B CN 1849560 B CN1849560 B CN 1849560B CN 2004800262121 A CN2004800262121 A CN 2004800262121A CN 200480026212 A CN200480026212 A CN 200480026212A CN 1849560 B CN1849560 B CN 1849560B
Authority
CN
China
Prior art keywords
photosensitive polymer
polymer combination
pattern
resin composition
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2004800262121A
Other languages
English (en)
Chinese (zh)
Other versions
CN1849560A (zh
Inventor
前田浩辉
高桥亨
胜又直也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004093624A external-priority patent/JP4237088B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN1849560A publication Critical patent/CN1849560A/zh
Application granted granted Critical
Publication of CN1849560B publication Critical patent/CN1849560B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
CN2004800262121A 2004-03-26 2004-12-15 感光性树脂组合物及使用该组合物的图案形成方法 Expired - Lifetime CN1849560B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004093624A JP4237088B2 (ja) 2003-07-24 2004-03-26 感光性樹脂組成物および該組成物を用いたパターン形成方法
JP093624/2004 2004-03-26
PCT/JP2004/018759 WO2005093514A1 (ja) 2004-03-26 2004-12-15 感光性樹脂組成物および該組成物を用いたパターン形成方法

Publications (2)

Publication Number Publication Date
CN1849560A CN1849560A (zh) 2006-10-18
CN1849560B true CN1849560B (zh) 2011-12-07

Family

ID=35056346

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800262121A Expired - Lifetime CN1849560B (zh) 2004-03-26 2004-12-15 感光性树脂组合物及使用该组合物的图案形成方法

Country Status (6)

Country Link
US (1) US20060188820A1 (enExample)
EP (1) EP1729175B1 (enExample)
KR (1) KR100795252B1 (enExample)
CN (1) CN1849560B (enExample)
TW (1) TW200532376A (enExample)
WO (1) WO2005093514A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276407B2 (ja) * 2002-05-08 2009-06-10 ヘンケル コーポレイション 光カチオン硬化型エポキシ樹脂組成物
US8052828B2 (en) * 2005-01-21 2011-11-08 Tokyo Okha Kogyo Co., Ltd. Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space
JP4702784B2 (ja) 2005-08-08 2011-06-15 ソニー株式会社 液体吐出型記録ヘッドの流路構成材料
WO2007094396A1 (ja) * 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物およびこれを用いたパターン形成方法
JP4913142B2 (ja) * 2006-07-14 2012-04-11 日本化薬株式会社 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法（３）
JP2008180879A (ja) * 2007-01-24 2008-08-07 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法
JP5039442B2 (ja) * 2007-06-15 2012-10-03 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
DE102007063698B4 (de) * 2007-09-13 2010-10-28 Carl Zeiss Vision Gmbh Optisches Bauelement mit Oberflächenbeschichtung
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤
US9599893B2 (en) * 2014-09-25 2017-03-21 Canon Kabushiki Kaisha Production process for optically shaped product and production process for liquid discharge head
EP3249469B1 (en) 2015-03-26 2024-09-11 Tokyo Ohka Kogyo Co., Ltd. Negative photosensitive composition and pattern formation method
JP6631752B2 (ja) * 2017-08-28 2020-01-15 住友ベークライト株式会社 ネガ型感光性樹脂組成物、半導体装置および電子機器

Citations (3)

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US6313188B1 (en) * 1996-09-19 2001-11-06 Nippon Soda Co., Ltd. Photocationically polymerizable composition comprising a polycyclic aromatic compound
US6368769B1 (en) * 1997-12-04 2002-04-09 Asahi Denki Kogyo Kabushiki Kaisha Aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process
US6391523B1 (en) * 2000-09-15 2002-05-21 Microchem Corp. Fast drying thick film negative photoresist

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DE3565013D1 (en) * 1984-02-10 1988-10-20 Ciba Geigy Ag Process for the preparation of a protection layer or a relief pattern
US4882245A (en) * 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
CA1289803C (en) * 1985-10-28 1991-10-01 Robert J. Cox Photoresist composition and printed circuit boards and packages made therewith
US5026624A (en) * 1989-03-03 1991-06-25 International Business Machines Corporation Composition for photo imaging
JP2991313B2 (ja) * 1991-07-15 1999-12-20 インターナショナル・ビジネス・マシーンズ・コーポレイション フォトイメージング用の改良された組成物
JPH09268205A (ja) * 1996-03-29 1997-10-14 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物および光学的立体造形法
JPH09304927A (ja) * 1996-05-20 1997-11-28 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JPH09325491A (ja) * 1996-05-31 1997-12-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JP3437069B2 (ja) * 1996-09-19 2003-08-18 日本曹達株式会社 光触媒組成物
JPH11323094A (ja) * 1998-05-21 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP4093335B2 (ja) * 2000-01-26 2008-06-04 日本化薬株式会社 光カチオン硬化型ドライフィルムレジスト及びその硬化物
JP2001274849A (ja) * 2000-03-27 2001-10-05 Toshiba Corp インターフェイス回路
US6409316B1 (en) * 2000-03-28 2002-06-25 Xerox Corporation Thermal ink jet printhead with crosslinked polymer layer
JP2001348482A (ja) * 2000-06-07 2001-12-18 Shin Etsu Chem Co Ltd 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム
US20030108810A1 (en) * 2001-08-22 2003-06-12 Williamson Sue Ellen Deodorizing agent for sulfur- or nitrogen-containing salt photoinitiators
JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Adeka 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
US6818379B2 (en) * 2001-12-03 2004-11-16 Sumitomo Chemical Company, Limited Sulfonium salt and use thereof
JP3715244B2 (ja) * 2002-02-15 2005-11-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6313188B1 (en) * 1996-09-19 2001-11-06 Nippon Soda Co., Ltd. Photocationically polymerizable composition comprising a polycyclic aromatic compound
US6368769B1 (en) * 1997-12-04 2002-04-09 Asahi Denki Kogyo Kabushiki Kaisha Aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process
US6391523B1 (en) * 2000-09-15 2002-05-21 Microchem Corp. Fast drying thick film negative photoresist

Also Published As

Publication number Publication date
WO2005093514A1 (ja) 2005-10-06
TW200532376A (en) 2005-10-01
EP1729175A1 (en) 2006-12-06
EP1729175B1 (en) 2013-03-27
KR20060095954A (ko) 2006-09-05
CN1849560A (zh) 2006-10-18
TWI305868B (enExample) 2009-02-01
EP1729175A4 (en) 2007-07-04
KR100795252B1 (ko) 2008-01-15
US20060188820A1 (en) 2006-08-24

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Granted publication date: 20111207