TWI305868B - - Google Patents

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Publication number
TWI305868B
TWI305868B TW093140070A TW93140070A TWI305868B TW I305868 B TWI305868 B TW I305868B TW 093140070 A TW093140070 A TW 093140070A TW 93140070 A TW93140070 A TW 93140070A TW I305868 B TWI305868 B TW I305868B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
pattern
epoxy resin
atom
Prior art date
Application number
TW093140070A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532376A (en
Inventor
Hiroki Maeda
Toru Takahashi
Naoya Katsumata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004093624A external-priority patent/JP4237088B2/ja
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200532376A publication Critical patent/TW200532376A/zh
Application granted granted Critical
Publication of TWI305868B publication Critical patent/TWI305868B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
TW093140070A 2004-03-26 2004-12-22 Photosensitive resin composition and method of forming pattern with the composition TW200532376A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004093624A JP4237088B2 (ja) 2003-07-24 2004-03-26 感光性樹脂組成物および該組成物を用いたパターン形成方法

Publications (2)

Publication Number Publication Date
TW200532376A TW200532376A (en) 2005-10-01
TWI305868B true TWI305868B (enExample) 2009-02-01

Family

ID=35056346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093140070A TW200532376A (en) 2004-03-26 2004-12-22 Photosensitive resin composition and method of forming pattern with the composition

Country Status (6)

Country Link
US (1) US20060188820A1 (enExample)
EP (1) EP1729175B1 (enExample)
KR (1) KR100795252B1 (enExample)
CN (1) CN1849560B (enExample)
TW (1) TW200532376A (enExample)
WO (1) WO2005093514A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4276407B2 (ja) * 2002-05-08 2009-06-10 ヘンケル コーポレイション 光カチオン硬化型エポキシ樹脂組成物
US8052828B2 (en) * 2005-01-21 2011-11-08 Tokyo Okha Kogyo Co., Ltd. Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space
JP4702784B2 (ja) 2005-08-08 2011-06-15 ソニー株式会社 液体吐出型記録ヘッドの流路構成材料
US8617795B2 (en) * 2006-02-16 2013-12-31 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and pattern forming method using the same
JP4913142B2 (ja) * 2006-07-14 2012-04-11 日本化薬株式会社 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法（３）
JP2008180879A (ja) * 2007-01-24 2008-08-07 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びこれを用いたレジストパターンの形成方法
JP5039442B2 (ja) * 2007-06-15 2012-10-03 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
DE102007043559B4 (de) * 2007-09-13 2012-05-31 Carl Zeiss Vision Gmbh Verwendung eines lichthärtenden thermoplastischen Epoxidharzklebstoffs zum Blocken oder Kleben von optischen Bauelementen
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤
US9599893B2 (en) * 2014-09-25 2017-03-21 Canon Kabushiki Kaisha Production process for optically shaped product and production process for liquid discharge head
JP6205522B2 (ja) 2015-03-26 2017-09-27 東京応化工業株式会社 ネガ型感光性組成物、パターン形成方法
KR20200087876A (ko) * 2017-08-28 2020-07-21 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 수지 조성물, 반도체 장치 및 전자기기

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE37242T1 (de) * 1984-02-10 1988-09-15 Ciba Geigy Ag Verfahren zur herstellung einer schutzschicht oder einer reliefabbildung.
CA1289803C (en) * 1985-10-28 1991-10-01 Robert J. Cox Photoresist composition and printed circuit boards and packages made therewith
US4882245A (en) * 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
US5026624A (en) * 1989-03-03 1991-06-25 International Business Machines Corporation Composition for photo imaging
JP2991313B2 (ja) * 1991-07-15 1999-12-20 インターナショナル・ビジネス・マシーンズ・コーポレイション フォトイメージング用の改良された組成物
JPH09268205A (ja) * 1996-03-29 1997-10-14 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物および光学的立体造形法
JPH09304927A (ja) * 1996-05-20 1997-11-28 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JPH09325491A (ja) * 1996-05-31 1997-12-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性積層体及びフレキシブルプリント板の製造法
JP3437069B2 (ja) * 1996-09-19 2003-08-18 日本曹達株式会社 光触媒組成物
US6313188B1 (en) * 1996-09-19 2001-11-06 Nippon Soda Co., Ltd. Photocationically polymerizable composition comprising a polycyclic aromatic compound
JP4204113B2 (ja) * 1997-12-04 2009-01-07 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法
JPH11323094A (ja) * 1998-05-21 1999-11-26 Nippon Kayaku Co Ltd 光カチオン重合性エポキシ樹脂系固形組成物及び物品
JP4093335B2 (ja) * 2000-01-26 2008-06-04 日本化薬株式会社 光カチオン硬化型ドライフィルムレジスト及びその硬化物
JP2001274849A (ja) * 2000-03-27 2001-10-05 Toshiba Corp インターフェイス回路
US6409316B1 (en) * 2000-03-28 2002-06-25 Xerox Corporation Thermal ink jet printhead with crosslinked polymer layer
JP2001348482A (ja) * 2000-06-07 2001-12-18 Shin Etsu Chem Co Ltd 放射線硬化型シリコーン含有剥離性組成物及び剥離フィルム
US6391523B1 (en) * 2000-09-15 2002-05-21 Microchem Corp. Fast drying thick film negative photoresist
US20030108810A1 (en) * 2001-08-22 2003-06-12 Williamson Sue Ellen Deodorizing agent for sulfur- or nitrogen-containing salt photoinitiators
JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Adeka 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
US6818379B2 (en) * 2001-12-03 2004-11-16 Sumitomo Chemical Company, Limited Sulfonium salt and use thereof
JP3715244B2 (ja) * 2002-02-15 2005-11-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof

Also Published As

Publication number Publication date
EP1729175A1 (en) 2006-12-06
EP1729175A4 (en) 2007-07-04
US20060188820A1 (en) 2006-08-24
EP1729175B1 (en) 2013-03-27
CN1849560B (zh) 2011-12-07
WO2005093514A1 (ja) 2005-10-06
TW200532376A (en) 2005-10-01
KR20060095954A (ko) 2006-09-05
KR100795252B1 (ko) 2008-01-15
CN1849560A (zh) 2006-10-18

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