CN1829413B - 布线电路基板 - Google Patents

布线电路基板 Download PDF

Info

Publication number
CN1829413B
CN1829413B CN2006100515272A CN200610051527A CN1829413B CN 1829413 B CN1829413 B CN 1829413B CN 2006100515272 A CN2006100515272 A CN 2006100515272A CN 200610051527 A CN200610051527 A CN 200610051527A CN 1829413 B CN1829413 B CN 1829413B
Authority
CN
China
Prior art keywords
metal
support substrate
metal support
circuit board
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100515272A
Other languages
English (en)
Chinese (zh)
Other versions
CN1829413A (zh
Inventor
石井淳
金川仁纪
船田靖人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN1829413A publication Critical patent/CN1829413A/zh
Application granted granted Critical
Publication of CN1829413B publication Critical patent/CN1829413B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2006100515272A 2005-03-02 2006-02-27 布线电路基板 Expired - Fee Related CN1829413B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005057704 2005-03-02
JP2005-057704 2005-03-02
JP2005057704A JP4403090B2 (ja) 2005-03-02 2005-03-02 配線回路基板

Publications (2)

Publication Number Publication Date
CN1829413A CN1829413A (zh) 2006-09-06
CN1829413B true CN1829413B (zh) 2010-05-12

Family

ID=36944656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100515272A Expired - Fee Related CN1829413B (zh) 2005-03-02 2006-02-27 布线电路基板

Country Status (3)

Country Link
US (1) US7182606B2 (enExample)
JP (1) JP4403090B2 (enExample)
CN (1) CN1829413B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7249954B2 (en) * 2002-02-26 2007-07-31 Paricon Technologies Corporation Separable electrical interconnect with anisotropic conductive elastomer for translating footprint
JP4640802B2 (ja) 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4615427B2 (ja) 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP4725346B2 (ja) * 2006-02-08 2011-07-13 ソニー株式会社 半導体装置
US7284992B2 (en) * 2006-03-22 2007-10-23 International Business Machines Corporation Electronic package structures using land grid array interposers for module-to-board interconnection
US7520761B2 (en) * 2006-07-17 2009-04-21 Paricon Technologies Separable electrical interconnect with anisotropic conductive elastomer and adaptor with channel for engaging a frame
DE102006033269B4 (de) * 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
DE102006033477B3 (de) * 2006-07-19 2008-01-24 Siemens Ag Leiterträger und Anordnung mit Leiterträger
JP2008034639A (ja) * 2006-07-28 2008-02-14 Nitto Denko Corp 配線回路基板
JP4865453B2 (ja) 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
JP2009016610A (ja) 2007-07-05 2009-01-22 Nitto Denko Corp 配線回路基板およびその製造方法
JP4887232B2 (ja) 2007-07-24 2012-02-29 日東電工株式会社 配線回路基板の製造方法
JP6021211B2 (ja) * 2010-04-30 2016-11-09 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
TWI442526B (zh) * 2010-09-17 2014-06-21 旭德科技股份有限公司 導熱基板及其製作方法
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5349634B2 (ja) * 2012-03-16 2013-11-20 日東電工株式会社 回路付サスペンション基板
US9736924B2 (en) 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board
JP6688667B2 (ja) 2016-04-18 2020-04-28 日東電工株式会社 配線回路基板およびその製造方法
JP6808266B2 (ja) * 2016-05-18 2021-01-06 日東電工株式会社 配線回路基板およびその製造方法
JP6909566B2 (ja) 2016-09-06 2021-07-28 日東電工株式会社 配線回路基板およびその製造方法
JP6802688B2 (ja) * 2016-11-02 2020-12-16 日東電工株式会社 配線回路基板
JP7757092B2 (ja) 2021-09-07 2025-10-21 日東電工株式会社 配線回路基板の製造方法
TW202406417A (zh) * 2022-06-15 2024-02-01 日商日東電工股份有限公司 配線電路基板、及配線電路基板之製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1415474A (zh) * 2001-10-29 2003-05-07 造利科技股份有限公司 具有载体的转印背胶式铜箔制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5612512A (en) * 1992-11-11 1997-03-18 Murata Manufacturing Co., Ltd. High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate
JP3461204B2 (ja) * 1993-09-14 2003-10-27 株式会社東芝 マルチチップモジュール
US6162996A (en) * 1994-03-23 2000-12-19 Dyconex Patente Ag Insulating foil circuit board with rigid and flexible sections
US5776824A (en) * 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications
EP1100295B1 (en) * 1999-11-12 2012-03-28 Panasonic Corporation Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
JP2001209918A (ja) * 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
KR100584965B1 (ko) * 2003-02-24 2006-05-29 삼성전기주식회사 패키지 기판 및 그 제조 방법
JP4222885B2 (ja) * 2003-06-04 2009-02-12 日東電工株式会社 配線回路基板
JP4178077B2 (ja) * 2003-06-04 2008-11-12 日東電工株式会社 配線回路基板
JP2005011387A (ja) * 2003-06-16 2005-01-13 Hitachi Global Storage Technologies Inc 磁気ディスク装置
JP4028477B2 (ja) * 2003-12-04 2007-12-26 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP2005235318A (ja) * 2004-02-20 2005-09-02 Nitto Denko Corp 回路付サスペンション基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1415474A (zh) * 2001-10-29 2003-05-07 造利科技股份有限公司 具有载体的转印背胶式铜箔制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-11387A 2005.01.13

Also Published As

Publication number Publication date
US20060199402A1 (en) 2006-09-07
US7182606B2 (en) 2007-02-27
JP4403090B2 (ja) 2010-01-20
JP2006245220A (ja) 2006-09-14
CN1829413A (zh) 2006-09-06

Similar Documents

Publication Publication Date Title
CN1829413B (zh) 布线电路基板
JP4178077B2 (ja) 配線回路基板
JP4308862B2 (ja) 配線回路基板およびその製造方法
CN101304635B (zh) 布线电路基板
JP4865453B2 (ja) 配線回路基板およびその製造方法
CN100586251C (zh) 布线电路板
CN101115349A (zh) 布线电路基板
JP2005317836A (ja) 配線回路基板およびその製造方法
EP1635624A2 (en) Wired circuit board
JP4799902B2 (ja) 配線回路基板および配線回路基板の製造方法
CN108024442B (zh) 布线电路基板及其制造方法
CN1976556B (zh) 配线电路基板
WO2019172123A1 (ja) 配線基板およびその製造方法
JP4757079B2 (ja) 配線回路基板およびその製造方法
CN101754580B (zh) 配线电路基板及其连接构造
US20240102174A1 (en) Etch Chemistry For Metallic Materials
CN1979673B (zh) 配线电路基板及其制造方法
JP2000208881A (ja) プリント配線板の導体パタ―ン形成方法およびプリント配線板
JP2004014975A (ja) 金属箔付フレキシブル回路基板
JP4640853B2 (ja) 配線回路基板
JP2004039771A (ja) 配線回路基板の製造方法
JP5351830B2 (ja) 配線回路基板およびその製造方法
JP4611075B2 (ja) 配線回路基板
JP3958639B2 (ja) 可撓性回路基板及びその製造法
JP4640852B2 (ja) 配線回路基板の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100512