JP4725346B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4725346B2 JP4725346B2 JP2006031271A JP2006031271A JP4725346B2 JP 4725346 B2 JP4725346 B2 JP 4725346B2 JP 2006031271 A JP2006031271 A JP 2006031271A JP 2006031271 A JP2006031271 A JP 2006031271A JP 4725346 B2 JP4725346 B2 JP 4725346B2
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Description
Claims (2)
- 高抵抗の素材からなる板状部材であって、一方の面に回路が形成された第1の板状部材と、
高抵抗の素材からなる板状部材であって、一方の面に回路が形成された第2の板状部材と、
前記第1の板状部材の前記回路が形成された面に配置された通信用のアンテナとしての複数の第1の平板と、
前記第1の板状部材の前記回路が形成された面に配置された、前記第1の平板を介して通信する第1の通信部と、
前記第2の板状部材の前記回路が形成された面に配置された通信用のアンテナとしての複数の第2の平板と、
前記第2の板状部材の前記回路が形成された面に配置された、前記第2の平板を介して通信する第2の通信部と
により構成される複合部材であって、
前記第1の板状部材と前記第2の板状部材が、それぞれの前記回路が形成されていない方の面が対向するように配置されて構成される前記複合部材を少なくとも2組備え、
前記第1の板状部材には、前記第1の通信部に電力を供給するためのボンディングワイヤが設けられており、
前記2組の一方の組における前記第1の板状部材と他方の組における前記第2の板状部材が、それぞれの前記回路が形成されている方の面が対向するように配置され、
一方の組における前記第1の板状部材と他方の組における前記第2の板状部材とが対向する面の間には、他方の組における前記第2の通信部の通信に用いるバンプが設けられており、
前記バンプは、他方の組における前記第2の通信部に電力も供給する
半導体装置。 - 前記第1の板状部材と前記第2の板状部材は、シリコンインターポーザであり、その体積抵抗は、1kΩcm以上である
請求項1に記載の半導体装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006031271A JP4725346B2 (ja) | 2006-02-08 | 2006-02-08 | 半導体装置 |
US11/627,527 US7351068B2 (en) | 2006-02-08 | 2007-01-26 | Semiconductor device |
TW096103713A TW200805617A (en) | 2006-02-08 | 2007-02-01 | Semiconductor device |
KR1020070011236A KR101348742B1 (ko) | 2006-02-08 | 2007-02-02 | 반도체 장치 |
EP07101732A EP1818986A3 (en) | 2006-02-08 | 2007-02-05 | Semiconductor device |
CNB2007100028492A CN100511670C (zh) | 2006-02-08 | 2007-02-08 | 半导体装置 |
US12/060,490 US7578676B2 (en) | 2006-02-08 | 2008-04-01 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006031271A JP4725346B2 (ja) | 2006-02-08 | 2006-02-08 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007214274A JP2007214274A (ja) | 2007-08-23 |
JP4725346B2 true JP4725346B2 (ja) | 2011-07-13 |
Family
ID=37966491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006031271A Expired - Fee Related JP4725346B2 (ja) | 2006-02-08 | 2006-02-08 | 半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7351068B2 (ja) |
EP (1) | EP1818986A3 (ja) |
JP (1) | JP4725346B2 (ja) |
KR (1) | KR101348742B1 (ja) |
CN (1) | CN100511670C (ja) |
TW (1) | TW200805617A (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US7462038B2 (en) * | 2007-02-20 | 2008-12-09 | Qimonda Ag | Interconnection structure and method of manufacturing the same |
JP5216532B2 (ja) * | 2008-10-30 | 2013-06-19 | 株式会社日立製作所 | 半導体集積回路 |
US8344503B2 (en) | 2008-11-25 | 2013-01-01 | Freescale Semiconductor, Inc. | 3-D circuits with integrated passive devices |
JP5578797B2 (ja) * | 2009-03-13 | 2014-08-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5801531B2 (ja) * | 2009-10-16 | 2015-10-28 | ルネサスエレクトロニクス株式会社 | 半導体パッケージ及びその製造方法 |
US8592973B2 (en) * | 2009-10-16 | 2013-11-26 | Stats Chippac Ltd. | Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof |
US20110168785A1 (en) * | 2010-01-14 | 2011-07-14 | Rfmarq, Inc. | System and Method To Embed A Wireless Communication Device Into Semiconductor Packages |
ITTO20100697A1 (it) * | 2010-08-13 | 2012-02-14 | St Microelectronics Srl | Dispositivo elettronico con isolamento galvanico e procedimento per la fabbricazione di un dispositivo elettronico |
US8491315B1 (en) * | 2011-11-29 | 2013-07-23 | Plastronics Socket Partners, Ltd. | Micro via adapter socket |
DE112011105905B4 (de) * | 2011-12-02 | 2016-10-06 | Intel Corporation | Speichergerät mit gestapeltem Speicher, der Veränderlichkeit bei Zusammenschaltungen von Geräten erlaubt |
KR20130071884A (ko) | 2011-12-21 | 2013-07-01 | 삼성전자주식회사 | 다이 패키지 및 이를 포함하는 시스템 |
US20220189864A1 (en) * | 2014-05-24 | 2022-06-16 | Broadpak Corporation | 3d integrations and methods of making thereof |
KR102618460B1 (ko) | 2019-03-26 | 2023-12-29 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
Citations (6)
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JPH05211283A (ja) * | 1991-08-06 | 1993-08-20 | Internatl Business Mach Corp <Ibm> | オプトエレクトロニクス・パッケージ |
JPH08274124A (ja) * | 1995-03-30 | 1996-10-18 | Sharp Corp | 樹脂封止型半導体装置 |
JPH11289024A (ja) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2004186497A (ja) * | 2002-12-04 | 2004-07-02 | Sony Corp | 半導体装置および半導体装置の製造方法 |
JP2005203657A (ja) * | 2004-01-19 | 2005-07-28 | Atsushi Iwata | 半導体装置 |
JP2005303031A (ja) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Ind Co Ltd | 電子回路モジュールと多層電子回路モジュールおよびそれらの製造方法 |
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JPH10320519A (ja) * | 1997-05-19 | 1998-12-04 | Rohm Co Ltd | Icカード通信システムにおける応答器 |
JP3664720B2 (ja) * | 2001-10-31 | 2005-06-29 | 新光電気工業株式会社 | 半導体装置用多層回路基板の製造方法 |
JP4389471B2 (ja) * | 2003-05-19 | 2009-12-24 | パナソニック株式会社 | 電子回路の接続構造とその接続方法 |
US7173442B2 (en) * | 2003-08-25 | 2007-02-06 | Delaware Capital Formation, Inc. | Integrated printed circuit board and test contactor for high speed semiconductor testing |
TW200520201A (en) * | 2003-10-08 | 2005-06-16 | Kyocera Corp | High-frequency module and communication apparatus |
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WO2006011960A1 (en) * | 2004-06-25 | 2006-02-02 | Sun Microsystems, Inc. | Integrated circuit chip that supports through-chip electromagnetic communication |
JP4403090B2 (ja) * | 2005-03-02 | 2010-01-20 | 日東電工株式会社 | 配線回路基板 |
JP4784773B2 (ja) * | 2005-09-02 | 2011-10-05 | 日本電気株式会社 | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
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JPH05211283A (ja) * | 1991-08-06 | 1993-08-20 | Internatl Business Mach Corp <Ibm> | オプトエレクトロニクス・パッケージ |
JPH08274124A (ja) * | 1995-03-30 | 1996-10-18 | Sharp Corp | 樹脂封止型半導体装置 |
JPH11289024A (ja) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2004186497A (ja) * | 2002-12-04 | 2004-07-02 | Sony Corp | 半導体装置および半導体装置の製造方法 |
JP2005203657A (ja) * | 2004-01-19 | 2005-07-28 | Atsushi Iwata | 半導体装置 |
JP2005303031A (ja) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Ind Co Ltd | 電子回路モジュールと多層電子回路モジュールおよびそれらの製造方法 |
Also Published As
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US7578676B2 (en) | 2009-08-25 |
TW200805617A (en) | 2008-01-16 |
US20070184677A1 (en) | 2007-08-09 |
EP1818986A3 (en) | 2011-02-02 |
KR20070080828A (ko) | 2007-08-13 |
EP1818986A2 (en) | 2007-08-15 |
US20080188096A1 (en) | 2008-08-07 |
JP2007214274A (ja) | 2007-08-23 |
KR101348742B1 (ko) | 2014-01-08 |
CN100511670C (zh) | 2009-07-08 |
TWI349359B (ja) | 2011-09-21 |
US7351068B2 (en) | 2008-04-01 |
CN101017813A (zh) | 2007-08-15 |
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