CN1817638A - 可独立反应的多层薄片 - Google Patents

可独立反应的多层薄片 Download PDF

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Publication number
CN1817638A
CN1817638A CNA2005101310576A CN200510131057A CN1817638A CN 1817638 A CN1817638 A CN 1817638A CN A2005101310576 A CNA2005101310576 A CN A2005101310576A CN 200510131057 A CN200510131057 A CN 200510131057A CN 1817638 A CN1817638 A CN 1817638A
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China
Prior art keywords
thin slice
react
reaction
layer
foil
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CNA2005101310576A
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Inventor
蒂莫西·P·魏斯
迈克尔·莱斯
奥马尔·科尼奥
戴维·范希尔登
托德·赫弗纳格尔
霍华德·菲尔德迈塞
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Johns Hopkins University
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Johns Hopkins University
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Publication of CN1817638A publication Critical patent/CN1817638A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
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    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
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    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B23K20/165—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas involving an exothermic reaction of the interposed material
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    • C06B45/12—Compositions or products which are defined by structure or arrangement of component of product having contiguous layers or zones
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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Abstract

提供了可反应的薄片及它们的用途，用作点火、连接和推进时的局部热源。一种改进的可反应的薄片(14)最好具有多层薄片结构，该结构由从能以发热及自扩散反应方式相互反应的材料中选出的交替的层(16，18)构成。在反应时，这些薄片提供高的局部热量，这些热量可用于诸如连接各层，或直接将松散材料连在一起。这种薄片热源可在各种环境(例如，空气，真空，水等)的室温下产生迅速的连接。如果使用连接材料，该薄片反应将提供足够的热量来熔化连接材料。如果不使用连接材料，该薄片反应将热量直接提供到至少两种松散材料上，熔化每种的一部分，在冷却时形成牢固的连接。此外，薄片(14)还可设计成具有开口，该开口允许使连接(或松散)材料穿过薄片以增加连接牢度。

Description

可独立反应的多层薄片
                       政府关注
本发明系按许可证DMR-9702546和DMR-9632526在政府支持下，以及通过军方实验室/先进材料特征化计划奖项No.019620047完成的。政府在本发明中具有特定的权利。
                 与相关申请的交叉参考
本申请要求享受由本申请人于2002年5月2日提交的美国临时申请序列号第60/201,292且题为“可反应的多层薄片”的权益。它与由M.E.Reiss等人在此一同申请的美国申请序列号第＿＿且题为“制造可反应的多层薄片及产生产品的方法”，以及由T.P.Weiths等人在此一同申请的美国申请序列号第＿＿且题为”用于方便处理和提高延展性的可反应的多层结构”相关。这三个相关申请在此一并作为参考。
                       发明领域
本发明关于可反应的多层薄片，特别是独立式多层薄片，用于局部热源。
                       发明背景
可反应的多层覆盖材料广泛用于多种要求在平面区域发出高的，数量受控的热量的应用中。该结构常规地包括一系列由基板支撑的覆盖材料，它们在适当的激发下进行发热的化学反应，并在由发出精确受控数量的热量的层覆盖的区域蔓延。当我们将这些可反应的覆盖材料基本描述为用于定位焊接，低温焊接或铜焊时的热源时，它们也可用于其它要求受控的局部发热的应用中，如推进和点火。
在许多结合或连接材料的方法中，需要一个热源。该热源对于要连接的结构而言可以是外部的，也可以是内部的。当其为外部的时，热量可由诸如炉子的装置发出。使用该热源的方法要求整个系统，包括松散的材料和结合材料，一起加热到足以熔化结合材料的温度。该方法存在问题，因为要连接的松散材料经常易损或对方法所需的高温很敏感。这些高温会损坏要连接的材料。
为缓解与外部热源相关的问题，内部热源得到使用。这些热源经常以可反应的粉末或甚至电线的形式出现。当使用可反应的粉末时，使用了将在自扩散反应中发生发热反应，以形成最终化合物或合金的金属或化合物的混和物。该方法自1960年代初研制出自扩散粉末、演生出自散物，高温合成物(SHS)起就已出现。然而，SHS反应经常需要在自散前进行预热，而且经常很难控制其能量释放程度和方法。所以，结合可能是不协调且不充分的。
为解决与可反应的粉末结合相关的问题，研制出了由可以进行类似发热反应的材料组成的多层结构。该结构可以进行更受控制和协调的发热反应。该SHS反应背后的基本动力是原子键能的减少。当点燃具有一系列可反应的材料层(已知为薄片)的结构时，不同层自动结合就产生了热量。该热量点燃薄片的邻近区域，从而使反应沿结构的整个长度进行，产生热量，直到所有材料起反应。尽管在结合技术中有了该进步，但仍存在问题。例如，许多材料造成很大困难并在之前不能得以成功结合。此外，将可反应的薄片用作热源的方法经常导致薄片在反应中脱开基板，因而弱化了结合。因此，需要有改进的可反应的多层薄片。
                       发明概要
提供可反应的薄片及它们的用途，用于例如点火、连接和推进时的局部热源。一种改进的可反应的薄片最好具有独立式多层薄片结构，该结构由从能以发热及自扩散反应方式相互反应的材料中选出的交替的层构成。在反应时，这些薄片提供高的局部热量，这些热量可用于例如连接各层，或直接将松散材料连在一起。这种薄片热源可在各种实际环境(例如，空气，真空，水等)的室温下产生迅速的连接。如果使用连接材料，该薄片反应将提供足够的热量来熔化连接材料。如果不使用连接材料，该薄片反应将热量直接提供到至少两种松散材料上，熔化每种的一部分，在冷却时形成牢固的连接。此外，薄片还可设计成具有开口，该开口允许使连接(或松散)材料穿出薄片以增加连接牢度。
                       附图概述
本发明的许多优点、特征和应用都可在以下参考附图的本发明的优选实施例的详细说明中清楚看出。在图中：
图1描述反应中的一个示范性多层可反应的薄片；
图2展示示范性连接应用的独立元件；
图3描述连接应用的启动；
图4展示示范性带孔的可反应的薄片；
图5描述连接材料流经薄片中的孔；
图6描述通过冷滚压形成可反应的薄片；
图7是由微层薄片和毫微层薄片组构成的合成可反应的薄片；
图8展示将可反应的薄片用于把半导体或微电子装置连接到基板上；
图9A和9B描述了一种成型的可反应的薄片，其中一些区域发生反应，形成导电区，而其它则形成不导电区；
应了解这些图系用于描述本发明的概念，而不是加以限制。
                 优选实施例的详细说明
现在说明本发明优选实施例与应用。也可出现其它实施例，且出现组成与结构上的变化，这并不与本发明的精神或领域相悖。尽管在此透露的实施例已特别地说明为使用一种独立的，自扩散的可反应的薄片结构进行连接或粘合松散材料，但很明显本发明也可实施用在其它需要高强度局部加热源的用途或使用中。
根据本发明的优选实施例，提供一种多层可反应的薄片结构(在此通常指“薄片”)在多种应用上，诸如用于将两个或更多(同一或不同)材料连在一起时，作为局部热源。如图1所示，可反应的多层薄片14由材料A与B的交替层16与18组成。这些交替层16与18可以是任何在包括硅化物(如Rh/Si，Ni/S和Zr/Si等)、铝化合物(如Ni/Al，Ti/Al，Monel/Al和Zr/Al等)、硼化物(如Ti/B)、碳化物(如Ti/C)、铝热剂反应化合物(如Al/Fe2O3或Al/Cu2O)，合金、含金属的玻璃和合成材料(如金属陶瓷)等激发物的作用下易于混合邻近原子(或具有化学键变化)的材料。
用于制造可反应的薄片的材料(A/B)最好在化学性质上有所不同。在一个优选实施例中，层16，18在过渡金属(如钛，镍等)和轻元素(如硼，铝等)之间替换。优选地，以该对元素(A/B)在其发生反应，形成稳定化合物并形成大量负热和高的绝热反应温度为基础将其选出，如T.P Weihs在1997年 薄片加工技术手册中的“多层材料的自扩散反应”一文中所述，在此就其完整性进行了参考。在一个优选实施例中，可反应的薄片的至少一层为(或含有)铝。
当多层薄片14暴露在激发物(如电火花、能源脉冲等)中时，例如在一端，材料A和B的邻近原子相混合，如区域30中所示。该混合产生的化学键的变化导致原子键能量减少，从而在发热化学反应中产生热。化学键中的该变化发生在具有A-A结合的层(如层16)和具有B-B结合的层(如层18)交换为A-B结合时，因此减少了储存在每个层中的化学能量，并发热。如图1中进一步描述的那样，所发出的热通过薄片14(沿从反应部分30经过反应区32至未反应部分34的方向)扩散，并启动未反应层的附加混合。其结果是，通过薄片14产生自持/自扩散反应(SHS反应)。随着足够大量且迅速地发热，反应以大于1米/秒的速度扩散到整个薄片14。由于反应不需要来自周围环境的附加的原子(例如，燃烧时的氧气)，该反应使薄片14成为能够喷出热量、迅速点燃，达到1400K以上的温度，局部加热量达到109K/秒的自持能源。该能源在要求迅速且局部地产生热量的应用中(如，连接，点火等)特别有用。
当反应如图1所示在多层薄片14上扩散开时，反应的最高温度通常位于反应区32的后边缘。可以认为这是反应的最终温度，它可由反应热量(ΔHrx)，由环境或周围材料损失的热量(ΔHenv)，样品的平均热容量(Cp)以及样品质量M来决定。另一个决定最终温度的因素是反应的温度是否超过最终产品的熔点。如果超过熔点，一些热量就会被产品从固态到液态的状态改变时吸收。反应的最终温度可以使用以下公式决定(其中To为起始温度，ΔHm为熔化热函，Tm为产品的熔化温度，且没有与周围环境或材料发生反应)，并取决于最终产品是否发生熔化：
Tf＝To-(ΔHrx+ΔHenv)/(CpM)如果最终产品没有发生熔化；
Tf＝Tm  如果固态和液态的最终产品有两相区；
以及
Tf＝To-(ΔHrx+ΔHenv+ΔHm)/(CpM)如果最终产品完全熔化。
与薄片反应错综复杂地相关的是反应沿薄片14长度扩散的速度。反应扩散的速度取决于原子是否迅速垂直地向其它层扩散(图1)以及热量是否迅速沿薄片14的长度传导。扩散速度是多层薄片的一个层厚度的重要功能。当一个层16，18的厚度减小时，扩散距离变小，原子能更快地混合。因为热量更快地发散，所以反应在薄片结构中传递更快。
依照本发明的一个优选实施例，可反应的多层薄片14可通过物理蒸发沉积方法(PVD)制成。例如，可用一种磁控管溅射技术将材料A/B沉积于作为交替层16，18的基板(图1中以虚线形式示出的层35)上。基板35可以以该技术中已知的方式在两个溅射枪上方旋转以将材料A/B层叠成交替层16，18。
基板35以虚线形式示出，用来表示它是一个可除去的层，它有助于将可反应的薄片14制成独立式薄片。基板35可以是任何具有能提供足够粘接、且不会因过度粘接而妨碍薄片从基板移开特征的基板(如，硅，玻璃或其它垫层)。基板可包括一个用于协调其粘接特征的可释放材料或粘接材料的涂层。
最好使用附加的润湿层(如锡)作为第一个薄片层(16或18)与基板35之间的界面层，以提供必要的粘接。当不使用润湿层时，选择恰当的用作沉积在基板上的第一个层的材料A/B将保证满足必要的粘接要求。当制作作为材料A/B的使用铝/蒙乃尔铜-镍合金的可反应的薄片时，例如，没有润湿层的话，示例的可反应的薄片将被沉积在诸如硅的基板上，并以铝作为沉积在基板上的第一层。在该情况下，最好在第一层选用铝，因为铝在沉积中会与硅充分粘接，但会在薄片形成后允许基板剥离。
形成的薄片14可以有成百上千个相互堆叠的交替层16和18。单层16和18的厚度最好从1nm-1000nm。在一个优选实施例中，薄片14的总厚度范围可从10μm至1cm。
另一个制作方法是将材料以同时沉积的几何形状来沉积。通过使用这种方法，可将两种材料来源直接放置到一个基板上，且溅射每种材料来源的原子通量，以沉积交替层16和18。另一种方法是全部消除溅射，并将基板在具有不同原子通量的两种材料来源上方转动。通过这种方法，每次经过一个来源时都会优选地产生一个单层。
最好使在沉积过程中可能发生的材料A/B的原子混合程度达到最低。特别是当多层16和18为溅射沉积时这可以通过将多层沉积在冷却的基板上完成。一定程度的混合程度在所难免，这将形成(与交替的未反应层相比)相对较薄的待反应材料20的区域。不过该待反应区域20有助于防止薄片14进一步的和自发的反应。
在另一实施例中，多层可反应的薄片可使用诸如重复滚轧多层复合材料等机械技术制作。
如图1中所示，优选的薄片14为特别用于发热源的独立式多层可反应的薄片。独立式薄片比薄膜更易于显示其特征，因为它们可当成“松散的“样品进行处理。将可反应的薄片14制成独立式大大延伸了其可能的使用范围。因为这种可反应的薄片不必作其它特别加工，所以它们可以大量生产，用于要求具有自扩散的局部热源的各种用途。它们的产品不限于或不受制于将大型或精密元件放入真空腔使其覆盖上可反应的多层薄片。此外，独立式薄片允许基板上的热沉积在不需要的地方最小化。
根据本发明的优选实施例的独立式薄片可具有多种应用。例如，独立式薄片可以用于将材料体(在此指“松散材料)连接在一起，以形成统一的产品。独立式薄片可用于任何数量的结合，低温焊接，铜焊，定位低温焊接或其它连接松散材料的应用中。一种典型的连接应用由图3示出，其中两种或多种松散材料10将被连接在一起。松散材料10可以是陶瓷，含金属的玻璃，金属/合金，聚合物，化合物，半导体以及其它形式的材料。
在图3所示的特殊连接应用中，连接材料12用于将松散材料10连接在一起。连接材料12可以是将被熔化以将松散材料10连接在一起的材料的任何层(或复合层)。连接材料12可以由含金属的玻璃，金属/合金，功能上分级的层，镍-硼薄膜，焊料，铜焊料，自扩散性铜焊料，此类混合物或其它类似的连接材料组成的独立式薄片形成。
根据本发明的实施例，可反应的薄片14装在连接材料12之间，形成有点像三明治似的结构。由此形成的可反应的薄片“三明治”优选地位于松散材料10之间的位置(如，端点，连接处，截面等)上，松散材料10在此被连接到一起。
另一种方法是，可反应的薄片14装在预先覆盖有连接材料12的松散材料10之间。
另一个方法是，可反应的薄片14装在连接材料12之间，用于形成有点像三明治似的结构。由此形成的可反应的薄片“三明治”优选地位于松散材料10之间的位置(如，端点，连接处，截面等)上，松散材料10在此被连接到一起。松散材料先覆盖上连接材料。
该连接方法包括加上一个力(如图3中由台钳11象征性地代表)，用以保持松散材料10，连接材料12和可反应的薄片14的相对位置。最好所有组件都是压在一起的独立式元件。在另一个实施例中，连接材料12与可反应的薄片14被压成组合物。
一旦连接过程中的组件定位，就将激发物(示为点燃的火柴15)优选地用到可反应的薄片14的一端，以引发SHS反应。可反应的薄片14内的原子结合产生快速且很高的热量，足以在可反应的薄片14的整个长度上熔化连接材料。在此状态下，连接材料12足以将松散材料10连接到一起。此后不久，连接材料10回到环境温度(如室温)，且可被从所施加的力(由台钳11的图代表)下移开。
由连接材料12和可反应的薄片14组成的组合结构可以通过可反应的薄片14沉积(如，蒸汽沉积)到连接材料12的一个层上来形成。连接材料的另一个层于是通过蒸汽沉积或力的运用(如，冷轧)与薄片14结合。
最好加上润湿/粘合层，以使可反应的薄片14、松散材料10或两者的表面润湿。润湿/粘合层使连接材料均匀铺开，以保证松散材料的连贯连接。润湿/粘合层可以是连接材料(如，铜焊料)，钛，锌，含金属的玻璃等的薄层。也可使用诸如银-锌，银-铜-钛，铜-钛，金-锌和镍-硼的商用合金。
本发明的优选实施例可采用增加总厚度的独立式可反应的薄片14。该可反应的薄片的总厚度取决于用以形成薄片的要素层(如，16和18)的厚度与数量。小于10μm的薄片难于处理，因为它们会向自行卷曲。100μm的薄片很硬，从而易于处理。较厚的薄片也减少了在薄片中的自扩散反应骤停的风险。在使用可反应的薄片的连接应用中，有一个薄片发热率与热量传导至周围铜焊料层和要形成的连接处的比率之间的重要平衡的问题。如果热量传导比产生的快，反应会骤停，不能形成连接处。较厚的薄片使反应难于骤停，因为在损失热量的同一表面区域产生的热量更多。
较厚的薄片可与较低的反应温度一起应用，一般会产生更稳定的薄片。具有高合成反应温度的薄片一般不稳定，且很脆，所以使用起来既危险又困难。脆质的薄片，例如，易碎裂，造成局部热点(通过释放弹性应变能和摩擦)，点燃薄片。切割这种脆质薄片(如，用于特殊连接尺寸)很难进行，因为它们很可能在切割过程中碎裂成无用的小片或燃烧。独立式厚薄片具有克服与在已知方法中造成障碍的热冲击与致密问题相关的问题的优点。两种现象均涉及薄片尺寸的快速变化。在反应时，薄片快速变热并试图伸展出抑制它们的基板。这导致热冲击，且装在基板上的薄片会脱落，从而造成不协调和效果不佳的结合。在反应进行时，薄片也会因化学键变化而发生致密化。这种致密作用也能造成从基板脱落与不协调和效果不佳的结合。通过按照本发明的优选实施例将薄片制成独立式，就不会发生脱落，薄片易于操作和处理，所以可反应的薄片可适用在更多应用中。
根据一个优选实施例，较厚的可反应的薄片厚度为50μm至1cm。尽管制造厚的独立式可反应的薄片时可使用许多不同系统，但应谨慎选择在选择所使用的系统的制造条件时的独特工序。例如，最好选择诸如溅射气体和基板温度等沉积条件，以使系统中增加的应力在薄片的薄膜上保持足够低。由于薄膜中的应力乘以其厚度形成用于分层的驱动力，所以应力与厚度的积应保持在1000N/m以下。在制造过程中，薄膜中的应力经常增加。当薄膜变厚时，它们比较薄的薄膜更有可能使其从基板剥落或使其基板碎裂，从而破坏最终的薄片生产。通过认识薄膜中的应力并选择将应力减至最小的条件，可以完成制造程序而不出现薄片过早脱落或基板碎裂。
在另一个实施例中，特意在薄片结构中设计了可反应的薄片中的开口。这些开口特别适用于协助和增强连接。
薄片最初可制成、例如、具有一个或更多开口或穿过薄片结构的穿孔22，如图4所示。开口最好形成规则图案，如穿过薄片区的一个矩形阵列。可以用任何已知的方法来制造开口。例如，可以使用在具有形成图形的孔的可移动基板上溅射沉积薄片14。开口也可通过将薄片14沉积到基板上来形成，将光刻胶沉积到薄片上，光刻法的光刻胶具有图形，然后通过成图形的孔腐蚀底垫薄片。进一步的示范技术包括在薄片14上物理地打孔。开口最好具有在10-10,000微米范围内的有效直径。(非圆形开口的有效直径为相等面积的圆形开口的直径。)
如图4所示，薄片14中的开口允许连接材料12或松散材料10在一些情况下、当被加热并被薄片14的发热反应熔化时从这些穿孔22中挤出(如箭头26所示)。当挤出时，连接材料12的一个层或松散材料10，可以与另一个层12或松散材料10，在独立式薄片14的相对面上接触或结合。带图形的穿孔22能够加强松散材料10与可反应的薄片14的结合且使其相互更加牢固和更致密地结合在一起。
图5是展示两个用银焊料结合的铜体53、54的微观图，焊料穿过薄片52的开口，如51。
使用一个或多个本发明的实施例，许多不同应用现在就得以更有效果、有效率地进行。例如，含金属的玻璃松散材料现在可以连接，其最终产品是包括结合处和可反应的薄片的具有金属玻璃制成的单一结构。现在也可以连接过去造成结合困难的非常不同的化学成分，热性质和其它物理性质的松散材料。半导体或微电子装置可以与电路板或其它结构结合，同时，可生产出与这些装置错综相关的多个导线。半导体或微电子装置也可得到严格密封。
本发明使这些连接在一般与低温焊接、铜焊和定位低温焊接等相关的潜在的受热损坏上得到改进，使其得到避免或至少能减少。
此外，采用本发明的实施例，连接的松散材料可以是独立式的。这意味着在松散材料真正连接前，单独的松散基板上不需要直接沉积任何铜焊层。此外，松散基板不必要求与任何可反应的薄片的预粘结或其它预处理。相关的松散材料可在粘结时简单地固定在一个独立式铜焊层或独立式可反应的薄片上，以产生牢固且持久的连接。
本发明的实施例允许结合至少一种是含金属的玻璃的松散材料。在连接过程中不需要将铜焊料与松散材料连接。这是因为可以将可反应的薄片设计为在反应中直接与含金属的玻璃结合。为完成这种连接过程，可反应的薄片能自已反应以形成含金属的玻璃。
本发明的实施例在松散材料包括微芯片或半导体装置时进一步能够进行出色的结合。在将半导体装置结合到诸如电路板的基板上时，对装置造成潜在的损坏是一个必须考虑到的因素。通过使用独立式可反应的薄片来将该半导体装置连接到基板上，不会产生能损坏装置或相邻元件的热量。半导体装置可以更大自由度和容易地装在基板上。如下所述，可以使用特别的薄片成分，诸如镍/铝或蒙乃尔铜-镍合金/铝。这种成分的薄片不仅较之前的更易于处理，而且镍，铜和铝的结合使独立式薄片具有很高的导热与导电性。
当进行诸如半导体装置的松散材料结合时，可反应的薄片可具有组合图形特性。该实施例可以在最终薄片中形成交替的相邻的电子绝缘和导电区，从而以单个反应结合多个导线并使其绝缘。
在本发明的一个优选实施例中，使用可反应的薄片来进行连接需要更少的能量。作为连接材料的功能分类层可以通过选择它们的材料成分来控制熔化温度。例如，可以使用功能分类层，因为它们的熔化温度可以控制。用作连接材料的镍-硼薄膜可以在熔化温度在开始温度时相对较低、随硼从镍中分解出来而升高时进行低温熔化，产生出熔点相对较高的最终材料。由于在薄片反应中需要的能量较少，所以减少了加在要连接的总结构上的总热量，从而减少了薄片反应产生的对要连接的材料的损坏。
在另一个实施例中，可以在可反应的多层薄片中包含反应的多层铜焊料层。例如，在包括铝反应层和钛，锆或铪合金反应层的薄片中，可以包括一个或更多包含铜或镍合金的可反应的铜焊料层。可反应的多层铜焊料可在层混合并形成连接材料时，提供除可反应的薄片产生的能源以外的能源。可反应的多层薄片与可反应多层铜焊料的结合可以使用没有薄片就不会自扩散的反应的铜焊料。
                         例子
通过参照以下特别例子，可以更清楚地了解本发明：
例1
铝与镍的可反应的薄片通过冷轧许多叠放在一起的5μm的镍与铝薄片形成。图6示出堆61穿过压辊62A和62B来制造薄片60。薄片可以多次冷轧直至层的厚度减小到希望值。
例2
使用一种复合薄片，而不是使用由同一厚度的多个层组成的薄片，其中毫微层的可应多层沉积在可反应的微层薄片上。如图7所示，可反应的薄片71中层70的某些部分将为毫微值(毫微层)，其它部分72将为微米厚度的层(微层)。如上所述，毫微层将易于反应且一旦反应开始，将沿薄片长度自扩散，不会因周围铜焊料层或松散组件的熔化而骤停。因而，毫微层可被视为微层的点燃物。具有微层的部分72在室温下不能保持自扩散反应，但当被邻近的毫微层部分70加热时，它将保持该反应。薄片可由铝与镍交替层组成。
例3
在制造这些复合薄片中，铝与镍的薄片受到压轧以形成微层部分，然后毫微层薄片蒸汽沉积在微层结构的任何一个表面上。制造也可通过整个复合物的蒸汽沉积进行，其中微层以更高速度沉积且在沉积中不点燃薄片或引起交替层中不可接受的混合。
例4
可反应的多层铜焊料以与上述形成可反应的薄片类似的方法形成，它的反应形成含金属的玻璃。该多层铜焊料在其交替层反应时散发出热量。通过精心选择已知的作为良好的玻璃形成材料的反应剂，铜焊料将在反应中形成玻璃状的最终产品，它与商用的以及上述薄片类似。可反应的铜焊料层发出的热量减少了连接需要的可反应的薄片量。
例5
薄片14的某些复合物可以反应形成玻璃状合金(含金属的玻璃)。这些薄片可以是含镍或铜的合金、含钛，锆或铪的合金，以及含铝合金的层的复合物，它们可以反应形成含金属的玻璃。在使用这些薄片时，可以获得特定的性质。含金属的玻璃具有很好的润湿能力。当使用这种薄片来连接松散的含金属玻璃时可以不使用铜焊料层，且在这种情况下，一旦薄片发生反应并与含金属的玻璃连接，就会产生单个的松散的含金属玻璃。
例6
半导体或微电子装置通过使用可反应的多层薄片连接到诸如印刷线路板的基板上。图8绘出该连接设置，其中可反应的薄片80夹在焊料层81A与81B之间，该夹层结构位于装置83的接触导线82与板的接触表面84之间。
例7
带图形的可反应的薄片设计成使一些部分反应形成导电区域，其它部分形成非导电区。
图9A和9B绘出该发明概念。图9A展示反应前的薄片90。图9B为反应后的薄片。由铝镍交替层组成的区域91反应形成导电区域95。由诸如二氧化硅或氮化硅或交替层的绝缘体组成的区域92反应形成非导电区域。
应看到，在使用中，区域91将与薄片90的上下都有接触，并在反应之后通过区域95进行电连接。
现在可以看出本发明的一个方面是一种制造包括可以进行发热反应的多个交替层的可反应的多层薄片的方法。该方法包括提供基板、将交替层蒸汽沉积在基板上以形成多层薄片，以及将多层薄片从基板上分离的步骤。最好基板对沉积层具有足够粘性，以在沉积中保持住该层，但其粘度不足以妨碍沉积之后将多层薄片取下。作为例子，该层可以由一个或更多沉积在硅基板上的铝层组成。此外，基板可以包括一个由可释放材料或粘性材料做成的涂层以达到适当的粘合度。
将多层薄片从基板上分离的方法之一是给基板提供一个防护层(或将整个基板做成防护层)，它可以在沉积后从薄片蚀刻或剥离掉。用于防护层的示例性材料包括铜，黄铜和光刻胶。
层的蒸汽沉积最好是物理蒸汽沉积，如使用磁控管溅射或电子束蒸发。基板在蒸汽沉积中最好得到冷却，以减少交替层的结合，减少能量损失和减少沉积的层上的应力。层最好沉积形成厚度范围在50μm-1cm间的多层薄片。厚度做成10μm-1cm范围间的薄片可用作独立式薄片。
本发明的另一个方面是一种将第一个本体与第二个本体结合的方法，它包括的步骤为：提供可独立反应的多层薄片，将本体一起压到薄片上以及点燃可反应的薄片。点燃的薄片可以熔化本体的材料或熔化相关可熔(连接材料)层，以将本体连接到一起。此外，层的反应产品自身可以是连接材料。一个或两个本体都可以是半导体或微电子装置。该方法对于连接具有1μm/m/℃或更大的不同值的热膨胀系数的本体特别有效。
在另一个实施例中，可反应的多层薄片包括多个贯穿薄片厚度的开口。开口最好在薄片区规则排列。这些开口可以不填充或可以填充入可熔性材料、推进剂或其它在点燃可反应的薄片时受热能改变或反应的材料。
该带孔薄片可通过提供具有表面包括多个有与要沉积的多层薄片的厚度相当或比其厚的厚度(或深度)的现成开口，突起或微粒的基板来制造，它沉积可反应的多层薄片，并将产生的带孔多层薄片从基板分离。
此外，可反应的多层薄片可以沉积在基板上，由可去除的罩层定好图形，并蚀刻形成多个孔。然后可将带孔薄片从基板取下。进而言之，可形成连续的薄片，且孔可以通过机械压制在连续的薄片中形成。
带孔薄片在结合中具有重要用途。打有多个开口的可反应的薄片装在第一个和第二个本体之间。如果本体材料不能为薄片所熔，就将单独的可熔层或可熔连接材料涂层放在本体之间。本体一起被压在薄片(和连接材料)上，薄片被点燃以熔化连接材料。熔化的材料流在或流经薄片的开口，以连接本体。该方法可通过开口产生具有增强过渡的延展性特征连接。当一个或两个本体都是半导体或微电子装置，或装置具有以大于1μm/m/℃区分的电缆终端设备时，它更具优势。
第三种新颖的可反应的薄片是复合的可反应的多层薄片，其薄片中的单独层的厚度或成分、在移过薄片总厚度时有所不同，以达到最佳结果。一个示范性的复合的可反应的多层薄片包括第一个部分，它具有多个相对厚的反应层，如1μm至10μm，并叠放在第二个部分上，第二个部分具有多个较薄的反应层(如1-1000nm)。具有较薄反应层的部分比具有较厚反应层的部分燃烧得更快。但当燃烧在较薄部分伸延时，它点燃较厚部分，以产生更均匀的燃烧以及更高的热量。可以通过使薄片厚度方向有不同成分来达到类似结果。可以提供成份变化，一组层的反应产品提供连接材料和另一组用于燃烧第一组层的更快的反应层。例如，可以通过根据本技术已知的方法变动蒸汽沉积中的加工参数来获得不同成分。
第四种新颖的可反应的薄片具有一个主表面区，它由至少两个不同区域组成：一个或多个第一区反应形成导电材料，以及一个或多个第二区形成为非导电材料。该薄片特别适用于将半导体装置电子触点连接到具有接收触点的基板上。薄片可装在该装置与具有装置触点的基板之间，基板的触点与薄片的第一个区域完全对齐。然后将该装置与基板压在薄片上，薄片通过相应导电连接的触点将该装置结合到基板上，并将另一区域非导电地结合在一起。
在说明并绘出本发明的优选实施例后，应清楚许多对实施例的修正及本发明的应用可以不与本发明的精神及领域相悖。当所说明的绘出的实施例一般指连接松散材料时，也应清楚任何要通过低温焊接，铜焊，定位低温焊接或其它已知技术连接在一起的材料(永久地或暂时地)均可使用本发明连接在一起。诸如含金属的玻璃(如玻璃质的玻璃)，金属(如铜)和合金(如不锈钢)，聚合物，陶瓷(如碳化硅)，化合物，半导体和大量其它不同成分的材料均适用。发明领域通过使用本发明从碳化硅装甲到到钛-铝-钒坦克体的大型连接，或将碳化涂层结合到刀刃上，到将微芯片以微尺度结合到毫微米或微米电路板上，而直接产生效果。
用于引发优选实施例中的可反应的薄片的自扩散反应的激发物可以是任何能源形式，如尖触针的冲击，电源的电火花，灯丝的热量，激光辐射等。尽管所描绘的实施例被说明成用于室温环境的空气中，也应清楚本发明可以在包括真空，氩气中和水中等其它环境下使用。
应看到特殊实施例的各种数据(如反应速度，峰值温度，加热率等)可通过改变反应的元素(如，改变材料A或B的成分，层的厚度，薄片总厚度，或铜焊料层的成分/厚度)来方便地调整。
尽管在此特别描绘出的实施例将连接材料描述为两个围绕可反应的薄片形成三明治结构的薄片形式(例如，如图2和3中所示，由薄片12和薄片14)，但应清楚连接材料可以使用任何数量的薄片(或其它结构)，包括包在可反应的薄片14周围的单一层或附在松散元件上的连接材料。根据一个优选实施例，根本没有使用连接材料层。例如，含金属的玻璃的松散材料，含金属的玻璃的可反应的薄片或两者一起用于连接应用中，并不使用连接材料(如铜焊料)。
另外，尽管所描绘的实施例只使用两种不同材料A/B作为可反应的薄片中的交替层，但应当清楚根据本发明可以使用任何数量的材料层来形成可反应的薄片。
此外，在此揭示的许多实施例(如将薄片做成图形，在薄片上穿孔等)中特别使用了独立式薄片，但应清楚这些实施例和本发明的其它方面可以不使用独立式薄片而实施。进而言之，也应清楚可反应的薄片表面上特意设计的开口可以贯穿任何数量的薄片中的层，尽管最好贯穿整个薄片结构，例如，如图5所示。图4中将开口描述为圆形孔22，它可以是在可反应的薄片上形成一个或更多带图形的结构的任何单一(或组合)形状。开口可以垂直地在与可反应的薄片的层相应的方向上形成，也可以一个或多个角度穿过薄片层形成。
因此本专业技术人员可以做出多种多样的其它设置，而不超出本发明的精神和范围。

Claims (3)

1、一种可反应的多层薄片，包括：
由可发热反应的交替层组成的薄片，其中该薄片包括多个贯穿该薄片的开口。
2、如权利要求1的可反应的多层薄片，其中所述开口内填充入可熔材料、推进剂、或受热发生变化或反应的材料。
3、如权利要求1的可反应的多层薄片，其中所述开口规则地沿薄片区排列。
CNA2005101310576A 2000-05-02 2001-05-01 可独立反应的多层薄片 Pending CN1817638A (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102934261A (zh) * 2010-06-07 2013-02-13 株式会社Lg化学 电池模块和用于把电池的电池胞端子接合到互联件的方法
CN103081177A (zh) * 2010-08-25 2013-05-01 株式会社Lg化学 电池模块和用于将电池单元的单元端子结合到一起的方法
CN103733386A (zh) * 2011-08-31 2014-04-16 株式会社Lg化学 互连组件和用于在电池模块中形成互连组件的方法
CN105547051A (zh) * 2015-12-12 2016-05-04 西安交通大学 一种金属玻璃增强密度梯度型装甲防护装置
US9905892B2 (en) 2015-02-09 2018-02-27 Lg Chem, Ltd. Battery module and method of coupling first and second electrical terminals of first and second battery cells to first and second voltage sense members of an interconnect assembly

Families Citing this family (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027547A1 (en) * 2000-05-02 2011-02-03 Reactive Nanotechnologies, Inc. Methods of making reactive composite materials and resulting products
US20050082343A1 (en) * 2000-05-02 2005-04-21 Jiaping Wang Method of joining using reactive multilayer foils with enhanced control of molten joining materials
US6991856B2 (en) * 2000-05-02 2006-01-31 Johns Hopkins University Methods of making and using freestanding reactive multilayer foils
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
US20060068179A1 (en) * 2000-05-02 2006-03-30 Weihs Timothy P Fuse applications of reactive composite structures
US7441688B2 (en) * 2003-11-04 2008-10-28 Reactive Nanotechnologies Methods and device for controlling pressure in reactive multilayer joining and resulting product
US20050142495A1 (en) * 2003-10-09 2005-06-30 David Peter Van Heerden Methods of controlling multilayer foil ignition
US7361412B2 (en) * 2000-05-02 2008-04-22 Johns Hopkins University Nanostructured soldered or brazed joints made with reactive multilayer foils
US20050136270A1 (en) * 2003-05-13 2005-06-23 Etienne Besnoin Method of controlling thermal waves in reactive multilayer joining and resulting product
US7121402B2 (en) 2003-04-09 2006-10-17 Reactive Nano Technologies, Inc Container hermetically sealed with crushable material and reactive multilayer material
DE10156125A1 (de) * 2001-11-16 2003-05-28 Eads Deutschland Gmbh Metallfaserverstärkter Verbundwerkstoff sowie Verfahren zur Herstellung desselben
WO2003046245A2 (en) * 2001-11-29 2003-06-05 Avery Dennison Corporation Process for making angstrom scale and high aspect functional platelets
US7169363B2 (en) 2002-08-30 2007-01-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Apparatus and method for sequestering a contaminant by use of an exothermically reactive structure
US6860419B2 (en) * 2002-08-30 2005-03-01 Agilent Technologies, Inc. Apparatus and method for controlling movement of a device after packaging
US7494705B1 (en) * 2003-01-15 2009-02-24 Lockheed Martin Corporation Hydride based nano-structured energy dense energetic materials
EP1631450B1 (en) * 2003-05-13 2007-11-28 Johns Hopkins University Nanostructured soldered or brazed joints made with reactive multilayer foils
US7278353B2 (en) * 2003-05-27 2007-10-09 Surface Treatment Technologies, Inc. Reactive shaped charges and thermal spray methods of making same
US7278354B1 (en) 2003-05-27 2007-10-09 Surface Treatment Technologies, Inc. Shock initiation devices including reactive multilayer structures
US7176106B2 (en) 2003-06-13 2007-02-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
US9499895B2 (en) 2003-06-16 2016-11-22 Surface Treatment Technologies, Inc. Reactive materials and thermal spray methods of making same
WO2005051815A2 (en) * 2003-07-23 2005-06-09 Johns Hopkins University Method of joining using reactive multilayer foils with enhanced control of molten joining materials
DE10334391B4 (de) * 2003-07-28 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik
US7090112B2 (en) * 2003-08-29 2006-08-15 The Boeing Company Method and sealant for joints
US7775414B2 (en) * 2003-10-04 2010-08-17 Siemens Energy, Inc. Consumable insert and method of using the same
US8414718B2 (en) 2004-01-14 2013-04-09 Lockheed Martin Corporation Energetic material composition
US7527187B2 (en) * 2004-12-20 2009-05-05 Honeywell International Inc. Titanium braze foil
AU2006212875B2 (en) * 2005-02-08 2011-06-02 Dyno Nobel Inc. Delay units and methods of making the same
US7354659B2 (en) * 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining
US20060219331A1 (en) * 2005-04-04 2006-10-05 Federal Mogul World-Wide, Inc. Exothermic Wire for Bonding Substrates
US20080093418A1 (en) * 2005-06-22 2008-04-24 Weihs Timothy P Multifunctional Reactive Composite Structures Fabricated From Reactive Composite Materials
US20070018774A1 (en) * 2005-07-20 2007-01-25 Dietsch Gordon T Reactive fuse element with exothermic reactive material
US8038048B2 (en) * 2005-08-30 2011-10-18 Medtronic, Inc. Cold weld
US8613808B2 (en) * 2006-02-14 2013-12-24 Surface Treatment Technologies, Inc. Thermal deposition of reactive metal oxide/aluminum layers and dispersion strengthened aluminides made therefrom
KR20080103543A (ko) * 2006-03-24 2008-11-27 파커-한니핀 코포레이션 반응성 포일 조립체
US7829157B2 (en) * 2006-04-07 2010-11-09 Lockheed Martin Corporation Methods of making multilayered, hydrogen-containing thermite structures
JP5275224B2 (ja) * 2006-04-25 2013-08-28 リアクティブ ナノテクノロジーズ，インク． 反応性多層接合処理を用いた大寸法結合を形成する方法
JP4162094B2 (ja) * 2006-05-30 2008-10-08 三菱重工業株式会社 常温接合によるデバイス、デバイス製造方法ならびに常温接合装置
US7886668B2 (en) * 2006-06-06 2011-02-15 Lockheed Martin Corporation Metal matrix composite energetic structures
US8250985B2 (en) 2006-06-06 2012-08-28 Lockheed Martin Corporation Structural metallic binders for reactive fragmentation weapons
US8342383B2 (en) * 2006-07-06 2013-01-01 Praxair Technology, Inc. Method for forming sputter target assemblies having a controlled solder thickness
US20080110962A1 (en) * 2006-07-24 2008-05-15 Neeraj Saxena Process for joining materials using a metallic heat source within a controlled atmosphere
US9078294B2 (en) * 2006-08-07 2015-07-07 University Of Massachusetts Nanoheater elements, systems and methods of use thereof
US7469640B2 (en) * 2006-09-28 2008-12-30 Alliant Techsystems Inc. Flares including reactive foil for igniting a combustible grain thereof and methods of fabricating and igniting such flares
US20080093350A1 (en) * 2006-10-18 2008-04-24 Inframat Corporation Superfine/nanostructured cored wires for thermal spray applications and methods of making
US7955451B2 (en) * 2007-02-22 2011-06-07 Lockheed Martin Corporation Energetic thin-film based reactive fragmentation weapons
DE102007016904B4 (de) * 2007-04-10 2014-11-20 Osram Gmbh Verfahren zur Herstellung einer optoelektronischen Vorrichtung
DE102007020389B4 (de) * 2007-04-30 2014-01-09 Airbus Operations Gmbh Fügeverfahren zum Fügen von Bauteilen im Luft- und Raumfahrtbereich
US7975902B2 (en) * 2007-04-30 2011-07-12 Airbus Operations Gmbh Joining method for joining components
US8298647B2 (en) 2007-08-20 2012-10-30 California Institute Of Technology Multilayered cellular metallic glass structures and methods of preparing the same
WO2009025637A1 (en) * 2007-08-20 2009-02-26 California Institute Of Technology Multilayered cellular metallic glass structures and methods of preparing the same
US8431208B2 (en) * 2007-08-20 2013-04-30 California Institute Of Technology Multilayered cellular metallic glass structures
US8882301B2 (en) 2007-08-31 2014-11-11 Nanofoil Corporation Method for low temperature bonding of electronic components
US20090071526A1 (en) * 2007-09-17 2009-03-19 Alloy Surfaces Company, Inc. Sustained-heat source and thermogenerator system using the same
US8641855B2 (en) * 2007-09-25 2014-02-04 Siemens Energy, Inc. Method for spacing electrical conductors and related devices
DE102007048299A1 (de) 2007-10-08 2009-04-09 Behr Gmbh & Co. Kg Mehrschichtlot
DE102008010228A1 (de) * 2008-02-21 2009-09-03 Airbus Deutschland Gmbh Verfahren und Vorrichtung zur Herstellung faserverstärkter Kunststoffprofilteile
DE102008021636B3 (de) * 2008-04-30 2009-11-19 Esk Ceramics Gmbh & Co. Kg Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement
US20100011559A1 (en) * 2008-07-16 2010-01-21 O'malley Edward J Retrofit Seals and Method for Placement in an Existing Groove
US7644854B1 (en) 2008-07-16 2010-01-12 Baker Hughes Incorporated Bead pack brazing with energetics
KR101834288B1 (ko) * 2008-08-18 2018-03-06 프로덕티브 리서치 엘엘씨 성형가능한 경량 복합체
US8431197B2 (en) 2008-10-23 2013-04-30 Lawrence Livermore National Security, Llc Layered reactive particles with controlled geometries, energies, and reactivities, and methods for making the same
DE102008060116A1 (de) * 2008-12-03 2010-06-10 Ab Skf Verfahren zur Herstellung einer Lageranordnung und Lageranordnung
WO2010107822A2 (en) * 2009-03-16 2010-09-23 University Of Massachusetts Methods for the fabrication of nanostructures
DE102009001850A1 (de) * 2009-03-25 2010-09-30 Robert Bosch Gmbh Elektrische Verbindung paarweiser Leiterenden und Verfahren zur Herstellung der Verbindung
DE102009015502B4 (de) 2009-04-02 2013-08-29 Ulrich Bingel Verfahren zum Herstellen eines reaktiven Halbzeuges und reaktives Halbzeug
DE102009035392A1 (de) 2009-07-30 2011-02-03 Osram Opto Semiconductors Gmbh Organisches Bauteil und Verfahren zu dessen Herstellung
US20110031301A1 (en) * 2009-08-06 2011-02-10 Segletes David S Joining of Electrical Generator Components
WO2011050362A2 (en) * 2009-10-23 2011-04-28 The Johns Hopkins University Mechanical processing of reactive laminates
US8177878B2 (en) * 2009-11-30 2012-05-15 Infineon Technologies Ag Bonding material with exothermically reactive heterostructures
CA2822748C (en) * 2009-12-28 2021-06-01 Shimon Mizrahi Processes for welding composite materials and articles therefrom
KR102032405B1 (ko) 2010-02-15 2019-10-16 프로덕티브 리서치 엘엘씨 성형가능한 경량 복합 재료 시스템 및 방법
AU2011224469B2 (en) 2010-03-09 2014-08-07 Dyno Nobel Inc. Sealer elements, detonators containing the same, and methods of making
US9969022B2 (en) 2010-09-28 2018-05-15 Applied Materials, Inc. Vacuum process chamber component and methods of making
TW201214909A (en) * 2010-09-30 2012-04-01 Arima Lasers Corp Conduction cooled package laser and packaging method thereof
CN102085589A (zh) * 2010-11-03 2011-06-08 宁波江丰电子材料有限公司 Led芯片与背板的焊接方法
DE102010060937A1 (de) * 2010-12-01 2012-06-06 Universität des Saarlandes Reaktive metallische Multischichten und Verfahren zum Herstellen von reaktiven metallischen Multischichten
CN102059445B (zh) * 2010-12-17 2012-08-29 洛阳双瑞金属复合材料有限公司 一种大面积铅-钢复合板的爆炸焊接方法
EP2678155A1 (en) 2011-02-21 2014-01-01 Productive Research LLC Composite materials including regions differing in properties and methods
JP2012186214A (ja) * 2011-03-03 2012-09-27 Stanley Electric Co Ltd 実装品およびその製造方法
CN102248280A (zh) * 2011-06-24 2011-11-23 中国科学院宁波材料技术与工程研究所 一种铝热反应箔、其制作方法以及在焊接工艺中的应用
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
GB201203030D0 (en) * 2012-02-22 2012-04-04 Tubefuse Applic B V Forge welding of tubular articles
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
US8893361B2 (en) * 2012-03-13 2014-11-25 The Boeing Company Method of bonding components to each other using exothermic reactions
EP2828885B9 (de) * 2012-03-19 2019-08-14 Ev Group E. Thallner GmbH Druckübertragungsplatte zur druckübertragung eines bondingdrucks
US8967453B2 (en) * 2012-03-21 2015-03-03 GM Global Technology Operations LLC Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components
DE102012005979B4 (de) 2012-03-23 2013-11-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisches Überbrückungselement und Energiespeicher mit dem Überbrückungselement
US9090046B2 (en) 2012-04-16 2015-07-28 Applied Materials, Inc. Ceramic coated article and process for applying ceramic coating
EP2662474A1 (de) 2012-05-07 2013-11-13 Siemens Aktiengesellschaft Verfahren zur Aufbringung einer Schutzschicht auf eine Turbinenkomponente
US8809445B2 (en) 2012-06-22 2014-08-19 Texas Research International, Inc. Room temperature cured vinyl silazane compositions
US9604249B2 (en) 2012-07-26 2017-03-28 Applied Materials, Inc. Innovative top-coat approach for advanced device on-wafer particle performance
US9343289B2 (en) 2012-07-27 2016-05-17 Applied Materials, Inc. Chemistry compatible coating material for advanced device on-wafer particle performance
DE102012213511B4 (de) * 2012-07-31 2017-02-23 Aktiebolaget Skf Verfahren zum Montieren eines ersten Maschinenteils in ein zweites Maschinenteil
US9233526B2 (en) 2012-08-03 2016-01-12 Productive Research Llc Composites having improved interlayer adhesion and methods thereof
WO2014055229A1 (en) 2012-10-01 2014-04-10 Eveready Battery Company, Inc Fuel unit, gas generator and system
US9916998B2 (en) 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US8941969B2 (en) 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
US9358702B2 (en) 2013-01-18 2016-06-07 Applied Materials, Inc. Temperature management of aluminium nitride electrostatic chuck
US8987052B2 (en) 2013-01-31 2015-03-24 Seagate Technology Llc Attachment of microelectronic components
US9669653B2 (en) 2013-03-14 2017-06-06 Applied Materials, Inc. Electrostatic chuck refurbishment
US9731456B2 (en) 2013-03-14 2017-08-15 Sabic Global Technologies B.V. Method of manufacturing a functionally graded article
US20140272450A1 (en) * 2013-03-14 2014-09-18 Siemens Energy, Inc. Near eutectic composition nickel base sandwich braze foil
US9887121B2 (en) 2013-04-26 2018-02-06 Applied Materials, Inc. Protective cover for electrostatic chuck
US9666466B2 (en) 2013-05-07 2017-05-30 Applied Materials, Inc. Electrostatic chuck having thermally isolated zones with minimal crosstalk
JPWO2014188559A1 (ja) * 2013-05-23 2017-02-23 株式会社日立製作所 反応性粉末、該反応性粉末を用いた接合材料、該接合材料で接合した接合体、および該接合体の製造方法
US9865434B2 (en) 2013-06-05 2018-01-09 Applied Materials, Inc. Rare-earth oxide based erosion resistant coatings for semiconductor application
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
EP2833007B1 (de) * 2013-07-29 2016-12-14 MAGNA STEYR Engineering AG & Co KG Drehbare Verbindung
EP2859987B1 (de) * 2013-10-08 2017-02-08 MAGNA STEYR Fahrzeugtechnik AG & Co KG Bauteilverbund
EP2860407B1 (de) 2013-10-08 2017-01-18 MAGNA STEYR Fahrzeugtechnik AG & Co KG Strukturbauteil
CN103600169B (zh) * 2013-11-28 2015-04-29 哈尔滨工业大学 激光引燃自蔓延连接Cf/Al复合材料与TiAl的方法
JP2015116574A (ja) * 2013-12-16 2015-06-25 公立大学法人兵庫県立大学 反応性多層膜およびそれを用いたデバイス用接合方法
DE102014102717B4 (de) 2014-02-28 2022-10-06 Endress+Hauser SE+Co. KG Bauteilanordnung mit mindestens zwei Bauteilen und Verfahren zum Herstellen einer Bauteilanordnung
US10087118B2 (en) 2014-11-28 2018-10-02 The Johns Hopkins University Reactive composite foil
DE102015103494B4 (de) 2015-03-10 2020-07-16 Friedrich-Schiller-Universität Jena Verfahren zur Herstellung eines Reflektorelements und Reflektorelement
GB201506901D0 (en) * 2015-04-23 2015-06-10 Rolls Royce Plc Manufacture of a hollow aerofoil
DE102015005835B4 (de) 2015-05-07 2022-10-13 Audi Ag Energiespeichermodul, Kraftfahrzeug und Verfahren zum Erzeugen einer Fügeverbindung
WO2016178372A1 (ja) * 2015-05-07 2016-11-10 株式会社日立製作所 耐食皮膜を有する積層体とその製造方法
CN104842064B (zh) * 2015-05-14 2017-02-22 哈尔滨工业大学 一种特种连接Cf/Al复合材料与TiAl的方法
CN104962866B (zh) * 2015-07-10 2017-11-17 哈尔滨工业大学 一种用EBPVD制备Zr/Al反应叠层箔的方法
CN104962867B (zh) * 2015-07-10 2017-11-03 哈尔滨工业大学 一种用EBPVD制备Zr/Ni反应叠层箔的方法
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
DE102015222939A1 (de) * 2015-11-20 2017-05-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrische Überbrückungseinrichtung zum Überbrücken elektrischer Bauelemente, insbesondere einer Energiequelle oder eines Energieverbrauchers
DE102016208420A1 (de) 2016-05-17 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung mit multifunktionalem Anschluss für Energiespeicherzellen oder Energieverbraucher
DE102016208419A1 (de) 2016-05-17 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrische Überbrückungseinrichtung zum Überbrücken einer elektrischen Energiequelle oder eines Energieverbrauchers
DE102016208421A1 (de) 2016-05-17 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrische Energiespeicherzelle mit integrierter Überbrückungseinrichtung
DE102016214742A1 (de) * 2016-08-09 2018-02-15 Siemens Aktiengesellschaft Verfahren zum Fügen von Werkstoffen und Werkstoffverbund
KR101924130B1 (ko) * 2016-10-19 2018-11-30 부산대학교 산학협력단 다층구조 복합체 펠렛 및 이의 제조 방법 그리고 이를 이용한 금속 계면 간 접합 방법
FR3058661B1 (fr) * 2016-11-14 2019-06-28 Adm28 S.Ar.L Procede de soudage par impulsion magnetique d’un empilement de feuillets
CN108247191A (zh) * 2016-12-29 2018-07-06 核工业西南物理研究院 一种热等静压防止焊接部件与包套粘连的方法
CN106825897A (zh) * 2017-01-05 2017-06-13 洛阳双瑞金属复合材料有限公司 一种具有超薄钛复层的铅‑钛复合阳极的制备方法
CN106695141B (zh) * 2017-01-21 2019-08-09 北京工业大学 一种利用纳米多层膜自蔓延反应辅助激光高温钎焊的方法
CN106847671B (zh) * 2017-02-15 2019-09-17 中国工程物理研究院化工材料研究所 消除叠层材料预混层的方法
CN108265258B (zh) * 2017-02-27 2020-05-08 克瓦申基娜·奥利加·叶甫盖尼耶夫娜 一种用于材料连接的多层含能纳米结构箔的制备方法
EP3367475A1 (en) 2017-02-28 2018-08-29 Robert Bosch GmbH Control and/or trigger unit, battery cell, cell module, battery, and apparatus
US10376979B2 (en) * 2017-05-05 2019-08-13 Kairos Industrial Ag Apparatus and method for connecting metal workpieces
DE102017216615A1 (de) * 2017-09-20 2019-03-21 Robert Bosch Gmbh Führungswagen mit stoffschlüssig befestigtem Wälzflächenteil
DE102017218913A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218934A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218936A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, Verfahren zur Herstellung eines elektrischen Überbrückungselementes, Energiespeicher und Vorrichtung
DE102017218908A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, Verfahren zur Herstellung eines elektrischen Überbrückungselements, Energiespeicher und Vorrichtung
DE102017218920A1 (de) 2017-10-24 2019-04-25 Gs Yuasa International Ltd. Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218939A1 (de) 2017-10-24 2019-04-25 Gs Yuasa International Ltd. Elektrisches Überbrückungselement, Energiespeicher und Vorrichtung
DE102017218931A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, Energiespeicher und Vorrichtung
DE102017218912A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, Energiespeicher und Vorrichtung
DE102017218915A1 (de) 2017-10-24 2019-04-25 Gs Yuasa International Ltd. Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218916A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218906A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218927A1 (de) 2017-10-24 2019-05-09 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017218923A1 (de) 2017-10-24 2019-04-25 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrischer Energiespeicher und Vorrichtung
DE102017220364A1 (de) 2017-11-15 2019-05-16 Robert Bosch Gmbh Elektrisches Überbrückungselement, elektrisches Energiespeichermodul, elektrischer Energiespeicher und Vorrichtung
US11047035B2 (en) 2018-02-23 2021-06-29 Applied Materials, Inc. Protective yttria coating for semiconductor equipment parts
JP7101384B2 (ja) * 2018-07-12 2022-07-15 日産自動車株式会社 接合方法
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
US11338552B2 (en) 2019-02-15 2022-05-24 Productive Research Llc Composite materials, vehicle applications and methods thereof
CN110142332B (zh) * 2019-05-27 2020-07-07 大连理工大学 一种NiAl合金薄壁管件成形与控性一体化方法
CN111168407B (zh) * 2020-01-13 2021-06-22 大连理工大学 采用金属箔带铺放制坯的耐高温薄壁构件一体化制造方法
CN114340211A (zh) * 2020-06-29 2022-04-12 南京纳研企业管理合伙企业(有限合伙) 电路板复合材料及其制备方法和应用
CN112207424B (zh) * 2020-09-04 2021-10-01 上海交通大学 一种提高含能材料自蔓延反应速度的装置及方法
CN112013722A (zh) * 2020-09-16 2020-12-01 昆山豪锐电子有限公司 含能桥丝发火电阻及其制作工艺
CN113020261B (zh) * 2021-03-25 2022-11-08 太原理工大学 一种预制波纹界面的金属复合板轧制方法
US11541470B2 (en) 2021-04-02 2023-01-03 General Electric Company Methods of furnace-less brazing
CN113714609B (zh) * 2021-08-03 2023-01-24 中国人民解放军陆军工程大学 一种双源热输入的手工自蔓延焊接方法
CN113858725B (zh) * 2021-09-28 2024-01-30 航天科工(长沙)新材料研究院有限公司 一种多层复合板材及其制备方法
CN114082799B (zh) * 2021-11-17 2024-02-23 海安北京机电研究所锻压产业研发中心 一种基于高温自蔓延技术的氮气弹簧缸体的反挤压模具及其加工工艺
CN115592267A (zh) * 2022-10-11 2023-01-13 上海工程技术大学（Cn） 一种金属箔片与薄膜类塑料纳秒激光焊接用夹持系统
CN116354739B (zh) * 2023-03-13 2024-02-02 中国科学院宁波材料技术与工程研究所 一种陶瓷连接件及其制备方法与应用

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB990692A (en) 1962-08-24 1965-04-28 Temescal Metallurgical Corp Foil production
US3705373A (en) * 1971-05-24 1972-12-05 Westinghouse Electric Corp Current limiting fuse
US3680678A (en) * 1971-07-30 1972-08-01 Robert H Ganz Method and apparatus for grouping containers on a conveyor
US3860678A (en) * 1973-04-24 1975-01-14 Us Army Method of manufacturing a consolidated double base propellant
JPS5514451Y2 (zh) * 1975-11-27 1980-04-02
US4186245A (en) * 1978-09-28 1980-01-29 Allied Chemical Corporation Energy storage flywheel
JPS6024752B2 (ja) * 1979-07-02 1985-06-14 三菱マテリアル株式会社 装飾部品用金属複合材の製造方法
DE3425290A1 (de) * 1984-07-10 1986-01-16 Atlas Fahrzeugtechnik GmbH, 5980 Werdohl Piezokeramische ventilplatte und verfahren zu deren herstellung
JPS6342859A (ja) * 1986-08-08 1988-02-24 航空宇宙技術研究所長 傾斜機能材料の製造方法
US4889745A (en) * 1986-11-28 1989-12-26 Japan As Represented By Director General Of Agency Of Industrial Science And Technology Method for reactive preparation of a shaped body of inorganic compound of metal
JPH0829990B2 (ja) 1988-09-21 1996-03-27 日本特殊陶業株式会社 セラミックスと金属との接合体
US5156720A (en) * 1989-02-02 1992-10-20 Alcan International Limited Process for producing released vapor deposited films and product produced thereby
JP2909913B2 (ja) * 1990-03-08 1999-06-23 松下電器産業株式会社 光学的情報記録媒体およびその製造方法および光学的情報記録方法
US5062025A (en) * 1990-05-25 1991-10-29 Iowa State University Research Foundation Electrolytic capacitor and large surface area electrode element therefor
US5266132A (en) * 1991-10-08 1993-11-30 The United States Of America As Represented By The United States Department Of Energy Energetic composites
CN1026394C (zh) * 1992-04-09 1994-11-02 中国有色金属工业总公司昆明贵金属研究所 金锡钎料的制造方法
JPH0629636A (ja) * 1992-07-07 1994-02-04 Mitsubishi Cable Ind Ltd 多層金属ベース基板の層間接続部構造
JP3515592B2 (ja) * 1993-06-30 2004-04-05 本田技研工業株式会社 金属部材の抵抗溶接方法
US5913256A (en) * 1993-07-06 1999-06-15 Lockheed Martin Energy Systems, Inc. Non-lead environmentally safe projectiles and explosive container
GB9319886D0 (en) * 1993-09-27 1993-12-15 Ici Plc Pyrotechnic material
US5381944A (en) * 1993-11-04 1995-01-17 The Regents Of The University Of California Low temperature reactive bonding
US5490911A (en) * 1993-11-26 1996-02-13 The United States Of America As Represented By The Department Of Energy Reactive multilayer synthesis of hard ceramic foils and films
US5503703A (en) * 1994-01-10 1996-04-02 Dahotre; Narendra B. Laser bonding process
US5538795B1 (en) * 1994-07-15 2000-04-18 Univ California Ignitable heterogeneous stratified structure for the propagation of an internal exothermic chemical reaction along an expanding wavefront and method making same
US5659179A (en) * 1995-03-07 1997-08-19 Motorola Ultra-small semiconductor devices having patterned edge planar surfaces
US5773748A (en) * 1995-06-14 1998-06-30 Regents Of The University Of California Limited-life cartridge primers
DE19527398A1 (de) * 1995-07-27 1997-01-30 Philips Patentverwaltung Verfahren zum Löten von Bauelementen auf einer Trägerfolie
CN1038182C (zh) * 1995-12-27 1998-04-29 昆明贵金属研究所 复合钎料及其制造方法
US5786129A (en) * 1997-01-13 1998-07-28 Presstek, Inc. Laser-imageable recording constructions utilizing controlled, self-propagating exothermic chemical reaction mechanisms
JP3740858B2 (ja) * 1997-09-16 2006-02-01 マツダ株式会社 接合金属部材及び該部材の接合方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102934261A (zh) * 2010-06-07 2013-02-13 株式会社Lg化学 电池模块和用于把电池的电池胞端子接合到互联件的方法
CN102934261B (zh) * 2010-06-07 2015-09-02 株式会社Lg化学 电池模块和用于把电池的电池胞端子接合到互联件的方法
CN103081177A (zh) * 2010-08-25 2013-05-01 株式会社Lg化学 电池模块和用于将电池单元的单元端子结合到一起的方法
CN103081177B (zh) * 2010-08-25 2016-08-03 株式会社Lg化学 电池模块和用于将电池单元的单元端子结合到一起的方法
CN103733386A (zh) * 2011-08-31 2014-04-16 株式会社Lg化学 互连组件和用于在电池模块中形成互连组件的方法
CN103733386B (zh) * 2011-08-31 2016-08-17 株式会社Lg化学 互连组件和用于在电池模块中形成互连组件的方法
US9882192B2 (en) 2011-08-31 2018-01-30 Lg Chem, Ltd. Interconnection assemblies and methods for forming the interconnection assemblies in a battery module
US9905892B2 (en) 2015-02-09 2018-02-27 Lg Chem, Ltd. Battery module and method of coupling first and second electrical terminals of first and second battery cells to first and second voltage sense members of an interconnect assembly
CN105547051A (zh) * 2015-12-12 2016-05-04 西安交通大学 一种金属玻璃增强密度梯度型装甲防护装置

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