CN1705112A - 热管散热装置及其制造方法 - Google Patents

热管散热装置及其制造方法 Download PDF

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CN1705112A
CN1705112A CNA2004100274046A CN200410027404A CN1705112A CN 1705112 A CN1705112 A CN 1705112A CN A2004100274046 A CNA2004100274046 A CN A2004100274046A CN 200410027404 A CN200410027404 A CN 200410027404A CN 1705112 A CN1705112 A CN 1705112A
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heat
heat pipe
pipe
substrate
evaporation part
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CN100338767C (zh
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盛剑青
李孟慈
林淑和
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种热管散热装置及其制造方法,该热管散热装置包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,该平表面的平面度与基板的下表面的平面度相同。制造时,将热管固接于基板沟槽中使其成为一体之后,同时对基板下表面及热管蒸发部进行机械加工,从而形成该平表面。该热管散热装置热管蒸发部与热源直接接触,能更加快速有效的吸收热量。

Description

热管散热装置及其制造方法
【技术领域】
本发明是关于一种散热装置及其制造方法,特别是指一种利用热管的散热装置及其制造方法。
【背景技术】
随着大规模集成电路技术的不断进步及广泛应用,信息产业的发展突飞猛进,高频高速处理器不断推出。由于高频高速运行使得处理器单位时间产生大量的热,如果不及时排除这些热量将引起处理器自身温度的升高,对系统的安全及性能造成很大的影响,目前散热问题已经成为每个新一代高速处理器推出时必需要解决的问题。通常业界均在中央处理器等芯片上安装散热器辅助其散热。同时,在散热器上安装风扇,以提供强制气流使散热器的热量快速散发,从而能够对中央处理器进行更为有效的散热。
由于对散热需求的不断提高,新式散热装置不断出现。将热管应用于电子元件散热就是其中重要的一种,热管是在一密封低压管形壳体内盛装适量汽化热高、流动性好、化学性质稳定、沸点较低的液态物质,如水、乙醇、丙酮等,利用该液态物质受热和冷却而在气、液两态间转变时,吸收或放出大量的热而可使热量由管体一端迅速传到另一端。现有技术中,将一导热基座与热源接触,将热管一端接合于导热基座上,另一端结合于散热鳍片,从而组装成散热装置,由基座吸收热量再传导至热管,再进一步通过散热鳍片散发出去。
上述热管散热装置虽然较传统散热方式散热效率有所提高,但热管与热源之间是通过基座连接,热阻较大,不能充分发挥热管快速导热的性能,在热负荷较大时往往达不到所需散热效果。
【发明内容】
本发明的目的在于提供一种热阻小、散热性能好的热管散热装置及其制造方法。
本发明热管散热装置包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,该平表面的平面度与基板下表面的平面度相同。
本发明热管散热装置的制造方法包括以下步骤:提供一表面设有沟槽的基板,将热管的蒸发部热性固接于该基板的沟槽内,使热管与基板成为一体,然后对热管的蒸发部及基板同时进行机械加工,使该热管蒸发部暴露于沟槽外的部分形成一平表面,该平表面与基板的下表面位于同一平面内,再将一散热鳍片组热性固接于热管的冷凝部。
本发明热管散热装置热管蒸发部与热源直接接触,能更加快速有效的吸收热量,同时该装置体积小,适用于日益薄型化的电子产品散热。
【附图说明】
图1是本发明热管散热装置各元件立体分解图。
图2是本发明热管散热装置立体组装图。
图3是本发明热管散热装置另一实施例各元件立体分解图。
【具体实施方式】
下面参照附图,结合实施例对本发明作进一步的描述。
参照图1至图2,本发明热管散热装置,包括二散热鳍片组1及2、一基板4及热管5。
该基板4具有上表面43及下表面42,该下表面42上开设有横直沟槽40,该基板4的一端对应沟槽40开设凹口41,该凹口41与沟槽40连通。
该热管5呈圆柱形,沿径向的内截面为圆形。该热管5包括一蒸发部51、一冷凝部52及一连接该蒸发部51及冷凝部52的弯折部53。该蒸发部51外圆面具有一与热源发热面直接接触的平表面510,该平表面510与基板4下表面42的平面度相同,最好要小于0.08mm,光洁度最好在3.2以内,这样可保证与热源的充分接触。该平表面510通过精密机械加工方法加工而成,如铣削。本说明书及其权利要求所指的直接接触是为区别于利用导热板将热源的热量传递至热管的连接方式,而在热管与热源发热面间设置热界面材料仍属于本说明书及权利要求所述的直接接触。该冷凝部52的延伸方向平行于该平表面510,这样可使热管5在垂直于热源发热面方向上不至于占用太多空间。
该散热鳍片组1及2均包括若干平行的散热鳍片,在该散热鳍片组1下表面10一端的若干散热鳍片上开设有呈倒“U”形凹槽11,该凹槽11大小形状与热管5的弯折部53相配合。该散热鳍片组2具有圆形通孔20。
将散热鳍片组1贴设于基板4上表面43,并将该散热鳍片组1具有凹槽11的一端对应于该基板4具有凹口41的一端。热管蒸发部51热性固结于基板4的沟槽40内,热管5弯折部53穿过该基板4的凹口41并固定于散热鳍片组1的凹槽11内,蒸发部52热性结合于散热鳍片组2的通孔20内。该热管5蒸发部51、冷凝部52及弯折部53均可通过焊接或过盈配合等方式固定。
在制造本发明热管散热装置时,先将热管5的蒸发部51通过焊接或过盈配合热性固接于该基板4的沟槽40内,使热管5与基板4成为一体,热管蒸发部51一部分收容于沟槽40内,另一部分暴露于沟槽40外;然后对该热管蒸发部51及基板4同时进行机械加工,如前述提到的铣削加工,将热管蒸发部51暴露于沟槽40外的那一部分及基板4下表面42同时铣平,从而形成热管蒸发部的平表面510;然后将散热鳍片组1及2分别热性结合于基板4上表面43及热管5的冷凝部52。
将本发明热管散热装置安装于热源上后,热管5蒸发部51内的介质直接吸收热源热量并快速蒸发,将热量传导至热管5冷凝部52,热管5冷凝部52进一步通过散热鳍片组2将热源散发的热量散发到周围环境中,热管5冷凝部52中的介质由于释放出热量恢复至液态,回流至热管5蒸发部51,在蒸发部51内再次吸热蒸发,如此循环,达到散热的目的。同时热管5蒸发部51的热量通过基板4传导至散热鳍片组1,通过散热鳍片组1散发至周围环境中。为增强散热效果,可分别在散热鳍片组1及2上加设散热风扇。
可以理解的,本发明热管散热装置中热管5至少为一根,其数目可随热负荷而增加或减少,相应的基板4的沟槽40及散热鳍片组2上通孔20的数量与热管5的数量一致即可。热管5蒸发部51不限于上述的直线状,为增加与热源的接触面积,该热管5蒸发部51也可以为在同一平面内呈弯曲状或折弯状。
如图3所示为本发明另一实施例示意图。该热管45具有一蒸发部451、两冷凝部452及连接该蒸发部451与两冷凝部452的两弯折部453。与第一实施例相同,该蒸发部451具有一平表面450,该两冷凝部452分别热性结合于两散热鳍片组2中,基板4’上表面热性结合有一散热鳍片组1’,其中各元件组装及工作原理与第一实施例相同,此不赘述。

Claims (8)

1.一种热管散热装置,包括基板、至少一热管及至少一散热鳍片组,该热管包括一蒸发部及至少一冷凝部,该基板下表面设有收容该热管蒸发部的沟槽,该散热鳍片组与热管冷凝部热性结合,该热管蒸发部具有一用于与热源发热面直接接触的平表面,其特征在于:该平表面的平面度与基板的下表面的平面度相同。
2.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部沿其径向的内截面为圆形,外圆面设一平表面。
3.根据权利要求1所述的热管散热装置,其特征在于:该热管冷凝部与蒸发部之间具有弯折部,在竖直方向上该冷凝部与该蒸发部具有高度差。
4.根据权利要求1所述的热管散热装置,其特征在于:该热管散热装置进一步包括一设置于基板上的散热鳍片组。
5.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部的平表面的平面度小于0.08mm。
6.根据权利要求1所述的热管散热装置,其特征在于:该热管蒸发部的平表面的光洁度在3.2之内。
7.一种热管散热装置的制造方法,包括以下步骤:
提供一基板,该基板一表面设有沟槽;
提供至少一热管,该热管具有一蒸发部及至少一冷凝部,将热管蒸发部热性固接于该基板的沟槽内,使热管与基板成为一体;
对热管的蒸发部及基板同时进行机械加工,使该热管蒸发部暴露于沟槽外的部分形成一平表面,该平表面与基板的下表面位于同一平面内;
将一散热鳍片组热性固接于热管的冷凝部。
8.根据权利要求7所述的热管散热装置的制造方法,其特征在于:对热管的蒸发部及基板同时进行的机械加工为铣削加工。
CNB2004100274046A 2004-05-26 2004-05-26 热管散热装置及其制造方法 Ceased CN100338767C (zh)

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US11/019,340 US7028758B2 (en) 2004-05-26 2004-12-21 Heat dissipating device with heat pipe

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Publication number Priority date Publication date Assignee Title
US7742306B2 (en) 2007-12-07 2010-06-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink assembly
US7744257B2 (en) 2008-02-01 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for LED lamp
CN101452897B (zh) * 2007-12-05 2011-03-30 富准精密工业(深圳)有限公司 发光二极管散热装置
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US9087814B2 (en) 2011-11-16 2015-07-21 Acer Incorporated Heat dissipation module
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TW200530549A (en) * 2004-03-11 2005-09-16 Quanta Comp Inc Heat dissipating module with heat pipes
KR100564638B1 (ko) * 2004-11-02 2006-03-29 삼성전자주식회사 유연한 히트 파이프
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US7327576B2 (en) * 2005-06-24 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
TWM282235U (en) * 2005-06-24 2005-12-01 Golden Sun News Tech Co Ltd Improved structure of a heat dissipating device using heat pipes
US7457126B2 (en) * 2005-06-27 2008-11-25 Intel Corporation Optical transponder with active heat transfer
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
CN1960615A (zh) * 2005-11-03 2007-05-09 富准精密工业(深圳)有限公司 散热器
CN100464279C (zh) * 2005-11-17 2009-02-25 富准精密工业(深圳)有限公司 散热装置
US20070268668A1 (en) * 2006-05-19 2007-11-22 I-Ming Lin Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
US7511958B2 (en) * 2006-05-31 2009-03-31 Cheng-Hsing Lin Heat dissipating assembly of heat dissipating device
CN101102655A (zh) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 散热装置
US20080043425A1 (en) * 2006-08-17 2008-02-21 Justin Richard Hebert Methods and systems for cooling a computing device
CN101149234B (zh) * 2006-09-22 2010-05-12 杜建军 热管散热器制造方法
US7694718B2 (en) * 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
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US20080117597A1 (en) * 2006-11-17 2008-05-22 Foxconn Technology Co., Ltd. Light emitting diode module having a thermal management element
US7970497B2 (en) * 2007-03-02 2011-06-28 Honeywell International Inc. Smart hybrid electric and bleed architecture
US20100132924A1 (en) * 2007-04-27 2010-06-03 National University Of Singapore Cooling device for electronic components
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US20080289799A1 (en) * 2007-05-23 2008-11-27 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7637311B2 (en) * 2007-06-27 2009-12-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7762316B2 (en) * 2007-08-06 2010-07-27 Man Zai Industrial Co., Ltd. Heat-dissipating device with high heat-dissipating efficiency
US20090080161A1 (en) * 2007-09-26 2009-03-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on card
US8047270B2 (en) * 2007-12-29 2011-11-01 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device having heat pipes for supporting heat sink thereon
TWM334959U (en) * 2008-01-07 2008-06-21 Cooler Master Co Ltd Lateral extension radiator of heat-pipe
TW200821811A (en) * 2008-01-11 2008-05-16 Chung-Shian Huang Heat dissipation device without a base
TWM338973U (en) * 2008-03-27 2008-08-21 Celsia Technologies Taiwan Inc The heat dissipation device with curve-shaped uniform-temperature plate
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
GB2459981A (en) * 2008-05-16 2009-11-18 yun-chang Liao Light emitting diode module with direct contact heat pipe
TW201005253A (en) 2008-07-31 2010-02-01 Golden Sun News Tech Co Ltd Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof
TWM349179U (en) * 2008-08-05 2009-01-11 yi-ren Xie Heat conduction module
US20100065249A1 (en) * 2008-09-17 2010-03-18 Asia Vital Components Co., Ltd. Heat sink
KR101854966B1 (ko) * 2008-11-04 2018-05-04 다이킨 고교 가부시키가이샤 냉각 부재, 그 제조 방법, 및 제조 장치
US20100175554A1 (en) * 2009-01-15 2010-07-15 Dell Products L.P. Cooling system with debris filtering
CN101808490A (zh) * 2009-02-17 2010-08-18 富准精密工业(深圳)有限公司 散热装置
TWI421148B (zh) * 2009-06-02 2014-01-01 Cpumate Inc 具研磨受熱平面之散熱器及其研磨方法與設備
CN101932221B (zh) * 2009-06-23 2014-08-20 富准精密工业(深圳)有限公司 散热装置
US8322403B2 (en) * 2009-09-04 2012-12-04 Cpumate Inc. Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same
US20110085339A1 (en) * 2009-10-13 2011-04-14 Chang-Yao Lin LED Lamp
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
US20110315352A1 (en) * 2010-06-29 2011-12-29 Asia Vital Components Co., Ltd. Thermal module
US20120043057A1 (en) * 2010-08-19 2012-02-23 Chun-Ming Wu Heat-dissipating module
US8488312B2 (en) * 2011-02-14 2013-07-16 Adc Telecommunications, Inc. Systems and methods for thermal management for telecommunications enclosures using heat pipes
TWM450187U (zh) * 2012-10-25 2013-04-01 Cooling House Co Ltd 循環式熱虹吸散熱裝置
US20140251577A1 (en) * 2013-03-08 2014-09-11 Thermal Corp. Cooling frame with integrated heat pipes
US9390994B2 (en) * 2013-08-07 2016-07-12 Oracle International Corporation Heat sinks with interdigitated heat pipes
US9773718B2 (en) * 2013-08-07 2017-09-26 Oracle International Corporation Winged heat sink
CN106686942B (zh) * 2015-11-10 2023-03-24 奇鋐科技股份有限公司 散热装置组合结构
US9909815B2 (en) * 2015-12-01 2018-03-06 Asia Vital Components Co., Ltd. Assembling structure of heat dissipation device
CN107046792A (zh) * 2016-02-05 2017-08-15 双鸿科技股份有限公司 散热装置及提升散热装置的热传导效能的方法
US10119759B2 (en) * 2016-03-31 2018-11-06 Hoya Candeo Optronics Corporation Heat radiating apparatus and light illuminating apparatus with the same
TWI612272B (zh) * 2016-05-04 2018-01-21 技嘉科技股份有限公司 散熱模組及其組裝方法
CN109690795A (zh) * 2016-09-16 2019-04-26 贺利氏特种光源美国有限责任公司 包括用于uv led阵列的厚膜层的散热器,以及形成uv led阵列的方法
EP3301999B1 (en) * 2016-09-30 2020-06-17 HP Scitex Ltd Light emitting diode heatsink
US20180372424A1 (en) * 2017-06-21 2018-12-27 Microsoft Technology Licensing, Llc Vapor chamber that emits a non-uniform radiative heat flux
JP6952878B2 (ja) * 2018-03-27 2021-10-27 三菱電機株式会社 冷却装置、蓋付き冷却装置、冷却装置付き筐体及びインバータ装置
US10314203B1 (en) * 2018-05-10 2019-06-04 Juniper Networks, Inc Apparatuses, systems, and methods for cooling electronic components
CN217363595U (zh) * 2022-01-17 2022-09-02 全亿大科技(佛山)有限公司 散热器
US20230247799A1 (en) * 2022-02-01 2023-08-03 Cisco Technology, Inc. Heat pipe with localized heatsink

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204368A (ja) * 1992-12-28 1994-07-22 Furukawa Electric Co Ltd:The セラミック基板の冷却構造
FR2773941B1 (fr) * 1998-01-19 2000-04-21 Ferraz Echangeur di-phasique pour au moins un composant electronique de puissance
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6226178B1 (en) 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
US6394175B1 (en) 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
WO2003041472A1 (en) * 2001-07-26 2003-05-15 Jefferson Liu Heat dissipating module
US7128131B2 (en) * 2001-07-31 2006-10-31 The Furukawa Electric Co., Ltd. Heat sink for electronic devices and heat dissipating method
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
TW537437U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating fastener
US7140422B2 (en) 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
CN2578981Y (zh) * 2002-09-26 2003-10-08 唐济海 散热装置
TWM249090U (en) * 2002-12-25 2004-11-01 Jiun-Fu Liou Improved device for heat sink module
TW560835U (en) * 2003-02-25 2003-11-01 Datech Technology Co Ltd Heat sink assembly with heat pipe

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101452897B (zh) * 2007-12-05 2011-03-30 富准精密工业(深圳)有限公司 发光二极管散热装置
US7742306B2 (en) 2007-12-07 2010-06-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink assembly
US7744257B2 (en) 2008-02-01 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for LED lamp
US9087814B2 (en) 2011-11-16 2015-07-21 Acer Incorporated Heat dissipation module
CN103140117A (zh) * 2011-11-30 2013-06-05 宏碁股份有限公司 散热模块
CN103140117B (zh) * 2011-11-30 2015-08-26 宏碁股份有限公司 散热模块
CN104519718A (zh) * 2013-10-08 2015-04-15 英业达科技有限公司 散热模块
CN107346741A (zh) * 2016-05-04 2017-11-14 技嘉科技股份有限公司 散热模块及其组装方法
CN107346741B (zh) * 2016-05-04 2020-04-17 技嘉科技股份有限公司 散热模块及其组装方法
CN110366351A (zh) * 2019-06-18 2019-10-22 南京埃斯顿自动化股份有限公司 伺服驱动器传导散热结构及其制造方法
CN110906293A (zh) * 2019-11-27 2020-03-24 特能热交换科技(中山)有限公司 一种散热器
CN115003122A (zh) * 2022-06-16 2022-09-02 远峰科技股份有限公司 具有t型导热管的散热装置及域控制器主机

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