M338973 八、新型說明： 【新型所屬之技術領域】 本創作係與-種散熱器有關，尤指一種 彎曲型態所構成的散熱裝置。 -板之 【先前技術】 按，利用散熱器提供電子發熱元件之散熱所需 眾所周知的—項技術。而傳統散熱器，主要俜由’ 面浐，且在且f過各放熱鰭片的表面積來增加整體的散熱 積且在具相同散熱系數的材質為^ρ % 的數詈赭容m ^ 7何貝為則4下，當散熱鰭片 P 早一放熱籍片的散熱面積越大時，通者料 产、、為所能提供的散熱效果也越佳。 田κ月 除此之外，如熱管（Heatpipe)或是均 —nber)等透過汽液相循 （—r , . 以如供熱傳作用的導埶 = 牛’也常常被應用於散熱領域中。尤二、 -官在型體上較容易製造， ：吕口為熱 -之延伸，將中央處理@亚可透過其管長度 後，再透過鰭片或風扇娜手段向：引至散熱區 均溫板，則常常被用以替代驅熱之目的。而 於其表面上設置複數散熱鰭片。 U压再 惟’均溫板往往僅能藉由苴 熱與冷凝，再加上呈板狀而扁===二表面作為受 間距幾乎無異，無法透過距離來::文面與冷凝面之 傳作用，以致均溫板在空冷 ：差’故無法提供熱 白勺场合上無法發揮其應有的效 5 M338973M338973 VIII. New description: [New technical field] This creation is related to a kind of radiator, especially a heat sink composed of a curved type. -Board [Prior Art] Press, using a heat sink to provide heat dissipation for electronic heating elements is a well-known technique. The traditional heat sink is mainly made up of 'facets, and f has the surface area of each heat-releasing fin to increase the overall heat dissipation and the material with the same heat dissipation coefficient is ^ρ %. When the shell is 4, when the heat sink fins of the heat-dissipating fins P are earlier, the heat-dissipating area of the heat-dissipating sheets is larger, and the heat-dissipating effect of the materials is better. In addition to this, such as heat pipe (Heatpipe) or homo-nber) through the vapor-liquid phase (-r, . such as the role of heat transfer 埶 = cattle ' is also often used in the field of heat dissipation尤二, - The official is easier to manufacture on the body, : Lukou is the extension of the heat, the central processing @亚可 through the length of the tube, and then through the fins or fan Na means: lead to the heat sink area The warm plate is often used to replace the purpose of heat transfer, and a plurality of heat sink fins are disposed on the surface thereof. U pressure and even the temperature equalization plate can only be heated by heat and condensation, and then added into a plate shape. Flat === The two surfaces are almost the same as the spacing, and the distance cannot be transmitted: the transfer of the surface and the condensation surface, so that the uniform temperature plate can not play its proper role in the case of air cooling: poor Effect 5 M338973
魏於此，本創作人係為改善並解決上述之缺失，乃 特潛心研究並配合學理之運用，終於提出—種設計合理且 有效改善上述缺失之本創作。 【新型内容】 •之气ίίΐ之ΐ要目的’在於可提供—種具有曲狀均溫板 Τ纖置，其係透過彎曲均溫板來改變其内部之相變化 路徑，亚有效利用彎曲後所形成的空間， 外部的熱傳導路徑。 另一 為了達成上述之目的，本創作係提供 溫板之散熱裳置，包括一呈長條㈣…〃有曲狀均 、、Θ 王负仏扁扳狀之均溫板、一與均 :反上、下豐置之散熱板、以及一第勺 板中r:具有—受熱段，而其二端處則各具有-冷： 又且又熱段與_冷凝段間係分別 段，以透過延伸段的f曲將- 弓曲狀的延伸 .的办罢由、， 肘一/7/邊&延伸至較受熱段為高 ”处，亚使散熱板横向平貼於二冷凝段上，以與受熱 • 4又間形成一段差空間，供篦μ λ ^ /、、、、 觸农均溫板之受熱段上。藉 妾 熱衣置，俾以達成上述之目的。 月文 【實施方式】 為了使胃審查委員能更進-步瞭解本創作之特汽另 技術内容，請皋閱以下古狀^ λ 4別邗之特铽及 ^ 下有關本創作之詳細說明與附圖，妙 而所附圖式僅提供參考盥1 + ^然 限制者。 ^…兄明用’並非用來對本創作加以 6 M338973 之立;：tW及第二圖’係分別為本創作第—實施例 :^刀解圖及另-視角之立體組合圖。本創作係提供一 /、有曲狀均溫板之散熱裝置，包括—均溫板卜 板2、以及一第一鰭片組3 ;其中： … 該均溫板（VaP〇rchamber ) !内呈真空而密封，且i :壁上具有毛細組織、内部填充有工作流體透 _=相變化來提供熱傳作用之導熱元件。該均溫板J • 板狀體，於其中段部位具有_受熱段iq 處則各別具有一冷凝段^，且 一而 孫八W日士 ％又熱奴10與二冷凝段11間 ^ΓΓ f曲狀的延伸段12，以透過延伸段_彎 :、，二~凝段11延伸至較受熱㈣為高的位置處，而二 〜緘段11可形成對稱的型態。 吞亥散熱板2可為一銅或叙耸且~ # 扁平板狀體，並與上述均 該均溫板】之二冷凝段njl，以盘:^向平貼於 .，二 ’ 〇〇。另，在本創作所舉之實施例中，In this regard, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and using the application of theory, and finally proposed a design that is reasonable in design and effective in improving the above-mentioned defects. [New content] • The qi ί ΐ ΐ ΐ ΐ ΐ ΐ ' ' ' ' ' ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 种 种 种 种 种 种 种 种 种 种 种 种 种 具有 具有 具有 具有 具有 具有 具有The space formed, the external heat conduction path. In order to achieve the above purpose, the creation department provides the heat sink of the warm plate, including a strip (four)... 〃 has a curved shape, and the Θ 仏 仏 仏 flat 扳 flat shape of the average temperature plate, one and both: anti The upper and lower heat sinks and the first spoon plate have r-heated sections, and the two ends have -column: and the hot section and the _condensing section are respectively separated to extend through The f-curve of the segment will be - the extension of the bow-shaped extension. The elbow/7/side & extends to the higher heat-receiving section, and the sub-surface is flattened on the two condensation sections to Form a space between the heat and the heat, and provide a space for the 篦μ λ ^ /, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In order to make the stomach review committee more step-by-step to understand the other technical content of this special steam, please read the following ancient features ^ λ 4 邗 邗 铽 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The drawing only provides a reference to 盥1 + ^ 然. ^... Brother used 'not used to create 6 M338973 for this creation;: tW and second Figure ' is the creation of the first - the embodiment: ^ knife solution map and another - perspective three-dimensional combination map. This creation provides a /, curved heat plate cooling device, including - temperature plate 2 And a first fin set 3; wherein: ... the temperature equalizing plate (VaP〇rchamber)! is vacuum-sealed, and i: the wall has a capillary structure, and the inside is filled with a working fluid to provide a _= phase change to provide The heat transfer element of the heat transfer function. The temperature equalizing plate J • the plate-shaped body has a condensing section ^ at the middle portion of the heat-receiving section iq, and one of the sun-eight W Japanese and the heat slave 10 The two condensing sections 11 are 曲 f curved extensions 12, such that the extension section _bend:, the second condensing section 11 extends to a position higher than the heat (four), and the two 缄 section 11 can form a symmetry The type of threshing heat sink 2 can be a copper or a shrub and ~ # flat plate-like body, and the above-mentioned uniform temperature plate] two condensation section njl, with the disk: ^ flat to the., two ' 〇 〇. In addition, in the embodiment of the present creation,
Si S'下表面係大於均溫板’叫^ 積:板]亚列排置，以增加均溫板1與散熱板2之接觸面 ，位Γ係由複數縛片30以横向間隔排列而成 L間100内，並熱傳接觸於均溫板1之受 ^又 板1為複數並列排置時，該第-鰭片組 數第^3=#均溫…之受熱段10間’或同樣透過複 弟一鰭月組3分別對應各均溫们之受熱段K)(圖略） 7 M338973 ;如弟二圖所示，在本創作第一實施例中，該第一鰭片組 之頂系與政熱板2下表面間距相肖而未接觸。 此外一上述散熱板2上亦可進一步增設一第二鱗片組 :該第二鰭片組2亦由複數鑛片40以橫向間隔排列而成 ，並熱傳接觸於散熱板2之上表面處。 疋以，藉由上述之構造組成，即可得到本創作具有曲 狀均溫板之散熱裝置。The lower surface of the Si S' is larger than the sub-column of the uniform temperature plate, so as to increase the contact surface of the uniform temperature plate 1 and the heat dissipation plate 2, and the position is arranged by the plurality of sealing pieces 30 at lateral intervals. In the case of L between 100 and the heat transfer contact with the temperature equalization plate 1 and the plate 1 is arranged in parallel, the number of the first fin sets is the same as the temperature of the heating zone 10 or the same Through the dynasty one fin month group 3 respectively corresponding to the heating section K) of each temperature (not shown) 7 M338973; as shown in the second figure, in the first embodiment of the creation, the top of the first fin group The distance between the lower surface and the lower surface of the hot plate 2 is not in contact. In addition, a second scale group can be further added to the heat dissipation plate 2: the second fin group 2 is also arranged by a plurality of the core pieces 40 at a lateral interval, and is thermally transferred to the upper surface of the heat dissipation plate 2. In view of the above-mentioned structural composition, the heat sink having the curved uniform temperature plate can be obtained.
據此，如第四圖所示，當該散熱裝置應用於一如中央 處理器等電子發熱元件5時，係透過其均溫板i之受熱段 10下方貼附於該電子發熱元件5之上表面處。該散熱裝置 在提供導熱路徑上，係分為以下二路徑： 、f 一、係利用均溫板丨之二冷凝段丨丨位於侧向較高處 以提供橫向延伸的導熱路徑；當均溫板丨之受熱段10受 電子發熱兀件5產生的熱量而升溫時，均溫板丨能將其受 熱段1所吸收的熱量快速傳導至二冷凝段11處，並由散熱Accordingly, as shown in the fourth figure, when the heat sink is applied to an electronic heating element 5 such as a central processing unit, it is attached to the electronic heating element 5 through the heating section 10 of the temperature equalizing plate i. At the surface. The heat dissipating device is divided into the following two paths on the providing heat conduction path: , f. The two condensation sections of the uniform temperature plate are located at a laterally higher position to provide a laterally extending heat conduction path; When the heated section 10 is heated by the heat generated by the electronic heating element 5, the uniform temperature plate can quickly transfer the heat absorbed by the heated section 1 to the second condensation section 11, and is cooled by the heat dissipation section
板2提供冷部，令均溫板内形成相變化環循，俾發揮均溫 板1應有的導熱效能。 其二、係利用位於均溫板1之受熱段1〇上方之第一鰭 片組3，以立即幫助均溫板丨之受熱段1〇進行散熱，且第 續片組3可透過段差空間ι〇〇内的冷空氣提供空冷效果 ’或如第五圖所示，令第一鰭片組3之頂部與散熱板2下 表面作熱傳接觸’以將熱量傳導至散熱板2中段處，有效 利用為政熱板2之各部位可提供散熱之處，並可由第二鰭 片組4進一步提供散熱。 M338973The plate 2 provides a cold portion to form a phase change loop in the temperature equalizing plate, and the heat conductivity of the temperature equalizing plate 1 is exerted. Secondly, the first fin group 3 located above the heating section 1 of the temperature equalizing plate 1 is used to immediately help the heat receiving section of the temperature equalizing plate to dissipate heat, and the sequel 3 can pass through the step space ι The cold air in the crucible provides an air cooling effect' or as shown in the fifth figure, the top of the first fin set 3 is in heat transfer contact with the lower surface of the heat sink 2 to conduct heat to the middle section of the heat sink 2, effectively The heat dissipation can be provided by using various parts of the hot plate 2, and the second fin group 4 can further provide heat dissipation. M338973
綜上所述，本創作實為不客 被H 」夕件之新型創作產品，A 隹可達到預期之使用目❸，而解決f 1 、〇·, 新型專利申請要件，爰依糞剎In summary, this creation is not a guest. It is a new creation product of H 夕 夕 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,
/麵:出申請，敬請詳查並賜准I 權利。 勿准本案專利，以保障創作人之 惟以上所述僅為本創作之較佳 ^ „ F <?乂仏可仃貫施例，非因此即 构限本創作之專利範圍，故舉 内宏觫盔L +凡運用本創作说明書及圖式 為之纽結構變化，均同理皆包含於本創作之範圍 内，合予陳明。 M338973 f圖式簡單說明】 ^ 一：係、本創作第—實施例之立體分解圖。 '係本創作第一實施例另一視角之立體組合圖 : 係本創作第一實施例之平面剖視圖。 二图係本創作第一實施例使用狀態之示意圖 第五圖係本創作第二實施例使用狀態之示意圖 【主要元件符號說明】 <本創作> 均溫板 1 段差空間1〇〇 延伸段 12 受熱段 10 冷凝段 η 散熱板 第一鰭片組 3 鰭片 30 弟二鰭片組 4 鰭片 4〇 電子發熱元件5 10/ Face: For application, please check and grant I rights. Do not allow the patent in this case to protect the creator. The above description is only the best of this creation. „ F < 乂仏 乂仏 乂仏 乂仏 , , , , , , , , , , , , , , , , , , , , , , , ,觫 L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L 3D exploded view of the first embodiment of the present invention: a perspective sectional view of the first embodiment of the present invention: a plan sectional view of the first embodiment of the present invention. Fig. 5 is a schematic diagram showing the state of use of the second embodiment of the present invention. [Main component symbol description] <This creation> Mean temperature plate 1 section difference space 1〇〇Extension section 12 Heated section 10 Condensation section η Heat sink first fin group 3 fins 30 brothers two fins group 4 fins 4 〇 electronic heating elements 5 10