CN1960615A - 散热器 - Google Patents
散热器 Download PDFInfo
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- CN1960615A CN1960615A CNA2005101009536A CN200510100953A CN1960615A CN 1960615 A CN1960615 A CN 1960615A CN A2005101009536 A CNA2005101009536 A CN A2005101009536A CN 200510100953 A CN200510100953 A CN 200510100953A CN 1960615 A CN1960615 A CN 1960615A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0012—Brazing heat exchangers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种散热器,包括若干散热鳍片及穿设于所述散热鳍片中的热管,该散热鳍片与热管之间通过接合剂接合,该散热鳍片上设有可使热管穿过的开孔,该开孔的边缘包括第一边缘部及第二边缘部,该第一边缘部的形状与热管的形状相对应,第二边缘部围成一用于收容该接合剂的空间,该第二边缘部设有二与该第一边缘部连接的导引面,该二导引面间的距离由远离第一边缘部的位置向近第一边缘部的位置逐渐增加,可使该空间内的接合剂熔融后沿该导引面流向第一边缘部,将热管与散热鳍片接合。
Description
【技术领域】
本发明是关于一种散热器,特别是关于一种具较高散热效率的散热器。
【背景技术】
在目前的散热领域中,热管式散热器由于具有良好的散热性能,现已被愈来愈多的厂商所接受。该种散热器可将电子元件产生的热量快速地传导出去,避免电子元件内部热量的累积,延长电子元件的使用寿命。
如何增强热管与散热鳍片的热接触对于提升该种散热器的散热性能产生重要影响。通常的做法是在热管与散热鳍片间涂布锡膏等导热介质以降低它们之间的热阻,从而提升整个散热器的散热性能。
如图1所示为一现有的热管式散热器2的立体图,该散热器2的各散热鳍片3上设置一开孔4,该开孔4包括收容热管5的圆形热管孔及容置锡膏等焊料的圆形焊料孔6,该焊料孔6设于热管孔上部,与该热管孔相连通。该散热器2组装时,预先将焊料及热管5分别置于散热鳍片3的焊料孔6及热管孔内,完成该散热器2的预组装,然后加热该预组装后的散热器2,使焊料孔6内的焊料融化,沿该焊料孔6的孔壁流经该焊料孔6与热管孔的接合部位I后到达热管孔,填充于热管5与散热鳍片3间的空隙内,经冷却后,将该热管5固定至散热鳍片3上。
该散热器2的组装过程中,当融熔的焊料流经该焊料孔6与热管孔的接合部位I时,容易堆积在该接合部位I而形成附着在散热鳍片3上的小锡珠,造成焊料的浪费,增加该散热器2的加工成本。
【发明内容】
有鉴于此,下面以具体实施例说明一种加工成本较低的散热器。
一种散热器,包括若干散热鳍片及穿设于所述散热鳍片中的热管,该散热鳍片与热管之间通过接合剂接合,该散热鳍片上设有可使热管穿过的开孔,该开孔的边缘包括第一边缘部及第二边缘部,该第一边缘部的形状与热管的形状相对应,第二边缘部围成一用于收容该接合剂的空间,该第二边缘部设有二与该第一边缘部连接的导引面,该二导引面间的距离由远离第一边缘部的位置向近第一边缘部的位置逐渐增加,可使该空间内的接合剂熔融后沿该导引面流向第一边缘部,将热管与散热鳍片接合。
该散热器的组装过程中,该接合剂熔融后沿该导引面流向该第一边缘部,由于该导引面倾斜设置,该融化后的焊料较易沿该导引面流向该第一边缘部,可避免该焊料附着在该第一边缘部与第二边缘部的接合部位而形成小锡珠所造成的浪费。
【附图说明】
下面参照附图结合实施例作进一步描述:
图1为一现有散热器的立体图;
图2为该散热器的立体分解图;
图3为该散热器的立体组装图;
图4为图3沿-IV-IV线的剖示图;
图5为该散热器中单个散热鳍片的立体图。
【具体实施方式】
请参阅图2至图4,本发明所述的散热器10包括一基板12、设于该基板12上的若干散热鳍片14及穿设于所述散热鳍片14内的若干热管16。该热管16可与一发热元件18相接触,将该发热元件18产生的热量传递至所述散热鳍片14。
请一并参阅图5,所述散热鳍片14相互平行,各该散热鳍片14包括一矩形本体141,该本体141的上、下两端分别向同一方向弯折形成有垂直于该本体141的翼片142,各散热鳍片14的翼片142分别与前一散热鳍片14的本体141相抵靠,使各相邻的二散热鳍片14间存在一定间距,从而在所述散热鳍片14的本体141间形成使气流经过的气流通道。所述散热鳍片14在本体141上对应所述热管16设有若干开孔143,所述热管16穿设于对应的开孔143内,通过接合剂与所述散热鳍片14相接合,该接合剂可为锡膏或锡条等焊料。所述开孔143周围向远离所述翼片142的一侧延伸形成一可与热管16接触的接触部144。
各开孔143的壁部包括第一边缘部145及与该第一边缘部145相连接的第二边缘部146。该第一边缘部145与热管16的部分周缘通过接合剂相接合,本实施例中的热管16为圆形,其对应的第一边缘部145为一圆弧。该第二边缘部146呈倒“V”形,在该第二边缘部146的壁部形成二倾斜的导引面147,该二导引面147与该第一边缘部145光滑连接,且该二导引面147间的距离由远离第一边缘部145的位置向第一边缘部145逐渐增加,较易使接合剂沿该导引面147流向第一边缘部145。
该散热器10组装时,将各散热鳍片14沿一定方向堆叠在一起,然后将热管16穿设于所述散热鳍片14的开孔143内,与第一边缘部145相接触,并将接合剂置于所述散热鳍片14的第二边缘部146所围成的空间内,得到预组装的散热器10,接下来对该预组装后散热器10加热,使接合剂融化并沿该二导引面147流向该第一边缘部145,填充于散热鳍片14与热管16间的空隙内,经冷却后,该接合剂将所述热管16接合至散热鳍片14的第一边缘部145上,使散热鳍片14与热管16间存在良好的热接触。
该散热器10的组装过程中,当对该预组装后的散热器10加热时,该第二边缘部146所围的空间内融熔的接合剂沿该导引面147流向该第一边缘部145,并在表面张力的作用下均匀填充于散热鳍片14与热管16间的空隙内。由于该导引面147倾斜设置,使该融化后的接合剂较易沿该导引面147流向该第一边缘部145,填充于散热鳍片14与热管16之间,将热管16固定至散热鳍片14内,避免该接合剂附着在第一边缘部145与第二边缘部146的接合部位而形成小锡珠所造成的浪费。该接触部144的设置,可使部分接合剂铺设于该接触部144上,使接合剂不易因过多而泄漏,提高接合剂的利用率;该接触部144还可增加热管16与第一边缘部145的接触面积,从而增加热管16与散热鳍片14间的传热面积,提高散热器10的散热效率。
如图5所示,本实施例中,第二边缘部146的二导引面147通过一位于开孔143顶端的圆弧面连接为一体,可以理解地,该二导引面147也可通过一平面连接,或直接相交于开孔143顶端。
本发明中,第二边缘部146位于第一边缘部145上部,同理,第二边缘部146也可位于第一边缘部145下部或两侧,当第二边缘部146位于第一边缘部145下部或两侧时,在加热过程中需将该散热器稍作旋转,使熔融的接合剂沿该导引面147流向该第一边缘部145。
该散热器10中,散热鳍片14的接触部144与翼片142可沿一相同的方向向相邻散热鳍片14的主体141延伸。各散热鳍片14上设置的翼片142也可沿不同的方向向主体141的两侧垂直延伸形成,所述翼片142的延伸方向也可与散热鳍片14的主体141间形成一锐角或一钝角。该散热鳍片14的接触部144可与相邻散热鳍片14的开孔146周围的本体141相抵靠,在该散热器上形成一隔离带,该隔离带可降低接合剂由散热鳍片14之间泄漏的可能性,进一步提高接合剂的利用率。
Claims (8)
1.一种散热器,包括若干散热鳍片及穿设于所述散热鳍片中的热管,该散热鳍片与热管之间通过接合剂接合,该散热鳍片上设有可使热管穿过的开孔,其特征在于:该开孔的边缘包括第一边缘部及第二边缘部,该第一边缘部的形状与热管的形状相对应,第二边缘部围成一用于收容该接合剂的空间,该第二边缘部设有二与该第一边缘部连接的导引面,该二导引面间的距离由远离第一边缘部的位置向近第一边缘部的位置逐渐增加,可使该空间内的接合剂熔融后沿该导引面流向第一边缘部,将热管与散热鳍片接合。
2.如权利要求1所述的散热器,其特征在于:所述第二边缘部呈倒“V”形。
3.如权利要求1所述的散热器,其特征在于:所述第二边缘的导引面与第一边缘间光滑连接。
4.如权利要求1所述的散热器,其特征在于:所述第一边缘部为圆形。
5.如权利要求1所述的散热器,其特征在于:所述第一边缘部边缘向相邻的散热鳍片的本体延伸形成一接触部。
6.如权利要求5所述的散热器,其特征在于:所述散热鳍片的接触部与相邻散热鳍片的本体相抵靠,在该散热器上形成一隔离带。
7.如权利要求1所述的散热器,其特征在于:该本体上设有向相邻的一个散热鳍片延伸的翼片。
8.如权利要求1所述的散热器,其特征在于:该本体部上设有分别向相邻的两个散热鳍片延伸的翼片。
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CNA2005101009536A CN1960615A (zh) | 2005-11-03 | 2005-11-03 | 散热器 |
US11/309,184 US20070095510A1 (en) | 2005-11-03 | 2006-07-07 | Heat-pipe type heat sink |
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CNA2005101009536A CN1960615A (zh) | 2005-11-03 | 2005-11-03 | 散热器 |
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CN101666591B (zh) * | 2008-09-05 | 2011-09-21 | 和硕联合科技股份有限公司 | 散热片、散热模块及其组装方法 |
CN105636415A (zh) * | 2016-03-08 | 2016-06-01 | 北京热刺激光技术有限责任公司 | 新型水冷散热板 |
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CN102253698A (zh) * | 2010-05-18 | 2011-11-23 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
KR101044351B1 (ko) * | 2010-05-26 | 2011-06-29 | 김선기 | 히트 쿨러 |
CN102378545A (zh) * | 2010-08-05 | 2012-03-14 | 奇鋐科技股份有限公司 | 一种散热鳍片结构及其散热器与制造方法 |
TWI400599B (zh) * | 2010-08-05 | 2013-07-01 | Asia Vital Components Co Ltd | Radiative fin manufacturing method |
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US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
US6640888B1 (en) * | 2002-10-16 | 2003-11-04 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
US6958915B2 (en) * | 2003-10-07 | 2005-10-25 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating device for electronic component |
CN100338767C (zh) * | 2004-05-26 | 2007-09-19 | 鸿富锦精密工业(深圳)有限公司 | 热管散热装置及其制造方法 |
US20060108104A1 (en) * | 2004-11-24 | 2006-05-25 | Jia-Hao Li | Heat-dissipating fin set in combination with thermal pipe |
US7121333B2 (en) * | 2004-12-30 | 2006-10-17 | Dong-Mau Wang | Radiator sheet |
US7273094B2 (en) * | 2005-07-27 | 2007-09-25 | Asia Vitag Components Co. Ltd. | Cooling fin unit |
-
2005
- 2005-11-03 CN CNA2005101009536A patent/CN1960615A/zh active Pending
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2006
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CN101666591B (zh) * | 2008-09-05 | 2011-09-21 | 和硕联合科技股份有限公司 | 散热片、散热模块及其组装方法 |
CN101998809A (zh) * | 2009-08-26 | 2011-03-30 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN105636415A (zh) * | 2016-03-08 | 2016-06-01 | 北京热刺激光技术有限责任公司 | 新型水冷散热板 |
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