US20060108104A1 - Heat-dissipating fin set in combination with thermal pipe - Google Patents

Heat-dissipating fin set in combination with thermal pipe Download PDF

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Publication number
US20060108104A1
US20060108104A1 US11/016,823 US1682304A US2006108104A1 US 20060108104 A1 US20060108104 A1 US 20060108104A1 US 1682304 A US1682304 A US 1682304A US 2006108104 A1 US2006108104 A1 US 2006108104A1
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United States
Prior art keywords
heat
hole
conducting material
dissipating device
thermal pipe
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Abandoned
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US11/016,823
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Jia-Hao Li
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Individual
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Individual
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Priority to US11/016,823 priority Critical patent/US20060108104A1/en
Publication of US20060108104A1 publication Critical patent/US20060108104A1/en
Priority to US11/421,108 priority patent/US20060201657A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipating fin set in combination with thermal pipe, more particularly to a heat-dissipating fin set in combination with thermal pipe, wherein a heat-conducting material is filled into a gap between a through hole of the heat-dissipating fin set and the thermal pipe.
  • the conventional heat-dissipating fin set generally comprises thermal pipe with wick structure and working fluid.
  • the working fluid flows through the wick structure and the thermal pipe to have heat exchange with a heat source on the heat-dissipating fin set, thus removing heat from the heat-dissipating fin set.
  • FIG. 1 is a perspective view showing the assembly of a heat-dissipating fin set 10 a and thermal pipes 20 a .
  • At least one closed through hole 11 a is defined in each fin plate 1 a of the heat-dissipating fin set 10 a .
  • the through hole 11 a has an inner diameter slightly larger than the outer diameter of the thermal pipe 20 a to receive the thermal pipe 20 a therein.
  • gap will be formed between the through hole 11 a and the thermal pipe 20 a due to the diameter mismatch.
  • the through hole 11 a could be formed with a diameter smaller than the outer diameter of the thermal pipe 20 a to tightly engage with the thermal pipe 20 a .
  • the gap is still inevitably formed, which causes larger thermal resistance and poor thermal conduction efficiency.
  • a heat-conducting material 2 a is pasted on outer face of the thermal pipe 20 a before the thermal pipe 20 a is assembled into the through hole 11 a of the fin plate 1 a .
  • the heat-conducting material 2 a such as heat-conducting glue or tin paste, will be solidified in the gap to form seamless sealing between the through hole 11 a and the thermal pipe 20 a.
  • the heat-conducting material 2 a may be scratched off by the inner wall of the through hole 11 a during the thermal pipe 20 a being assembled into the through hole 11 a .
  • the scratched heat-conducting material 2 a is piled, with uneven thickness, around the through hole 11 a on the outmost fin plate 1 a .
  • the problem of gap still remains and the provision of the heat-conducting material 2 a cannot solve this problem.
  • the heat-conducting material 2 a suffer to the problem of deposit and storage because it should be applied before the assembling of the thermal pipe 20 a . Moreover, the heat-conducting material 2 a may drop or scatter during paste, which causes dirt and difficulty in processing.
  • the present invention is to provide a heat-dissipating fin set in combination with thermal pipe, wherein a heat-conducting material is filled into a gap between a through hole of the heat-dissipating fin set and the thermal pipe to enhance thermal conduction therebetween.
  • the present invention provides a heat-dissipating fin set in combination with thermal pipe, the heat-dissipating fin set comprising a plurality of fin plates, each of the fin plates having at least one closed through hole, each of the thermal pipe passing through the through hole.
  • Each of the fin plate has an accommodating section atop the through hole and used for accommodating a heat-conducting material.
  • the heat-conducting material is placed into the accommodating section.
  • the heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material fills a gap between the through hole and the thermal pipe, whereby a thermal conductance is provided between the through hole and the thermal pipe.
  • FIG. 1 is a perspective view showing the assembly of a prior art heat-dissipating fin set and thermal pipes.
  • FIG. 2 is a perspective view showing the heat-dissipating fin set according to the present invention.
  • FIG. 3 is a perspective view showing the assembling of the thermal pipe into the heat-dissipating fin set according to the present invention.
  • FIG. 4 is a sectional view showing the applying of heat-conducting material to the heat-dissipating fin set.
  • FIG. 5 is a sectional view showing the flowing of heat-conducting material into the through hole.
  • FIG. 6 is a perspective view showing the heat-dissipating fin set according to another preferred embodiment of the present invention.
  • FIG. 7 is a sectional view showing the tin strip passing the guiding hole according to another preferred embodiment of the present invention.
  • FIG. 8 is a sectional view showing the molten tin strip according to another preferred embodiment of the present invention.
  • FIG. 9 is a front view of the fin plate according to another preferred embodiment of the present invention.
  • the present invention is intended to provide a heat-dissipating fin set in combination with thermal pipe.
  • the heat-dissipating fin set 10 in combination with the thermal pipe 20 are assembled on a heat-generating electronic device such as a CPU, thus dissipating the, heat generated by the device.
  • the heat-dissipating fin set 10 comprises a plurality of sheet-shaped fin plates 1 .
  • Each of the fin plates 1 has at least one closed through hole 11 at predetermined location. In the shown embodiment, there are two through holes 11 .
  • two thermal pipes 20 are assembled to corresponding through holes 11 .
  • the present invention is characterized in that an accommodating section 12 is formed on the fin plate 1 and atop the through hole 11 and used to accommodate the heat-conducting material 2 .
  • the accommodating section 12 is a dent 121 at top of the fin plate 1 and is concave downward.
  • the heat-conducting material 2 is extruded to the dent 121 after the thermal pipe 20 is assembled to the heat-dissipating fin set 10 .
  • the heat-conducting material 2 is sticky heat-conducting glue and can be applied to the dent 121 by automatic gluing process.
  • the heat-conducting material 2 is molten by heating the whole heat-dissipating fin set 10 , after the heat-conducting material 2 is applied to the dent 121 .
  • the molten heat-conducting material 2 flows downward along the lateral side of the plate-shaped fin plates 1 due to the weight per se.
  • the molten heat-conducting material 2 will fill the gap between the thermal pipe 20 and the through hole 11 in case that the inner diameter of the through hole 11 is larger than the outer diameter of the thermal pipe 20 .
  • the thermal pipe 20 and the through hole 11 have tight sealing therebetween after the molten heat-conducting material 2 is solidified. Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11 .
  • FIGS. 6 and 7 show another preferred embodiment of the present invention.
  • the accommodating section 12 is implemented by a through guiding hole 122 atop the through hole 11 .
  • the through guiding hole 122 can be of rounded shape as shown in FIGS. 6 and 7 .
  • the through guiding hole 122 can be of inverted water-drop shape as shown in FIG. 9 , or inverted triangular shape with narrow bottom or tapered shape with narrow bottom.
  • the through guiding hole 122 can facilitate the flowing of the molten heat-conducting material 2 ′ into the through hole 11 .
  • the heat-conducting material 2 ′ in solid status can fill into the through guiding hole 122 after the heat-dissipating fin set 10 is assembled.
  • the heat-conducting material 2 ′ can be tin strip, tin paste or wax.
  • the heat-conducting material 2 ′ in solid status becomes molten heat-conducting material 2 ′ after heating.
  • the molten heat-conducting material 2 flows downward along the lateral side of the plate-shaped fin plates 1 .
  • the molten heat-conducting material 2 ′ will fill the gap between the thermal pipe 20 and the through hole 11 . Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11 .
  • the provision of the accommodating section 12 facilitates the molten heat-conducting material 2 , 2 ′ flowing downward along the lateral side of the plate-shaped fin plates 1 and filling the gap between the thermal pipe 20 and the through hole 11 . Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11 .
  • the through hole is a closed hole to provide mechanical robustness.
  • the thermal pipe can be tightly engaged and secured.
  • the heat-conducting material can be applied from top side of the fin plate to simplify process.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat pipe structure, having a tubular member, a support member and a wick structure. The tubular member is hollow to accommodate the support member and the wick structure therein. The wick structure is located between the tubular member and the support member. The wick structure is supported by the support member to be attached to an interior wall of the tubular member. The material melting point of the wick structure is lower than those of the tubular member and the support member. Therefore, the support member maintains good supporting function during sintering process, such that the wick structure can be adequately attached to interior wall of the tubular member.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a heat-dissipating fin set in combination with thermal pipe, more particularly to a heat-dissipating fin set in combination with thermal pipe, wherein a heat-conducting material is filled into a gap between a through hole of the heat-dissipating fin set and the thermal pipe.
  • The conventional heat-dissipating fin set generally comprises thermal pipe with wick structure and working fluid. The working fluid flows through the wick structure and the thermal pipe to have heat exchange with a heat source on the heat-dissipating fin set, thus removing heat from the heat-dissipating fin set.
  • FIG. 1 is a perspective view showing the assembly of a heat-dissipating fin set 10 a and thermal pipes 20 a. At least one closed through hole 11 a is defined in each fin plate 1 a of the heat-dissipating fin set 10 a. The through hole 11 a has an inner diameter slightly larger than the outer diameter of the thermal pipe 20 a to receive the thermal pipe 20 a therein. However, gap will be formed between the through hole 11 a and the thermal pipe 20 a due to the diameter mismatch. The through hole 11 a could be formed with a diameter smaller than the outer diameter of the thermal pipe 20 a to tightly engage with the thermal pipe 20 a. However, the gap is still inevitably formed, which causes larger thermal resistance and poor thermal conduction efficiency.
  • To solve above-mentioned problem, a heat-conducting material 2 a is pasted on outer face of the thermal pipe 20 a before the thermal pipe 20 a is assembled into the through hole 11 a of the fin plate 1 a. The heat-conducting material 2 a, such as heat-conducting glue or tin paste, will be solidified in the gap to form seamless sealing between the through hole 11 a and the thermal pipe 20 a.
  • However, the heat-conducting material 2 a may be scratched off by the inner wall of the through hole 11 a during the thermal pipe 20 a being assembled into the through hole 11 a. The scratched heat-conducting material 2 a is piled, with uneven thickness, around the through hole 11 a on the outmost fin plate 1 a. The problem of gap still remains and the provision of the heat-conducting material 2 a cannot solve this problem.
  • Furthermore, the heat-conducting material 2 a suffer to the problem of deposit and storage because it should be applied before the assembling of the thermal pipe 20 a. Moreover, the heat-conducting material 2 a may drop or scatter during paste, which causes dirt and difficulty in processing.
    • BRIEF SUMMARY OF THE INVENTION
  • The present invention is to provide a heat-dissipating fin set in combination with thermal pipe, wherein a heat-conducting material is filled into a gap between a through hole of the heat-dissipating fin set and the thermal pipe to enhance thermal conduction therebetween.
  • Accordingly, the present invention provides a heat-dissipating fin set in combination with thermal pipe, the heat-dissipating fin set comprising a plurality of fin plates, each of the fin plates having at least one closed through hole, each of the thermal pipe passing through the through hole. Each of the fin plate has an accommodating section atop the through hole and used for accommodating a heat-conducting material. The heat-conducting material is placed into the accommodating section. The heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material fills a gap between the through hole and the thermal pipe, whereby a thermal conductance is provided between the through hole and the thermal pipe.
  • The above summaries are intended to illustrate exemplary embodiments of the invention, which will be best understood in conjunction with the detailed description to follow, and are not intended to limit the scope of the appended claims.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
  • FIG. 1 is a perspective view showing the assembly of a prior art heat-dissipating fin set and thermal pipes.
  • FIG. 2 is a perspective view showing the heat-dissipating fin set according to the present invention.
  • FIG. 3 is a perspective view showing the assembling of the thermal pipe into the heat-dissipating fin set according to the present invention.
  • FIG. 4 is a sectional view showing the applying of heat-conducting material to the heat-dissipating fin set.
  • FIG. 5 is a sectional view showing the flowing of heat-conducting material into the through hole.
  • FIG. 6 is a perspective view showing the heat-dissipating fin set according to another preferred embodiment of the present invention.
  • FIG. 7 is a sectional view showing the tin strip passing the guiding hole according to another preferred embodiment of the present invention.
  • FIG. 8 is a sectional view showing the molten tin strip according to another preferred embodiment of the present invention.
  • FIG. 9 is a front view of the fin plate according to another preferred embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention is intended to provide a heat-dissipating fin set in combination with thermal pipe. With reference now to FIGS. 2 and 3, the heat-dissipating fin set 10 in combination with the thermal pipe 20 are assembled on a heat-generating electronic device such as a CPU, thus dissipating the, heat generated by the device. The heat-dissipating fin set 10 comprises a plurality of sheet-shaped fin plates 1. Each of the fin plates 1 has at least one closed through hole 11 at predetermined location. In the shown embodiment, there are two through holes 11. As shown in FIG. 4, two thermal pipes 20 are assembled to corresponding through holes 11.
  • The present invention is characterized in that an accommodating section 12 is formed on the fin plate 1 and atop the through hole 11 and used to accommodate the heat-conducting material 2. In the shown embodiment, the accommodating section 12 is a dent 121 at top of the fin plate 1 and is concave downward.
  • With reference to FIGS. 4 and 5, in the present invention, the heat-conducting material 2 is extruded to the dent 121 after the thermal pipe 20 is assembled to the heat-dissipating fin set 10. In the preferred embodiment of the present invention, the heat-conducting material 2 is sticky heat-conducting glue and can be applied to the dent 121 by automatic gluing process. With reference to FIG. 5, the heat-conducting material 2 is molten by heating the whole heat-dissipating fin set 10, after the heat-conducting material 2 is applied to the dent 121. The molten heat-conducting material 2 flows downward along the lateral side of the plate-shaped fin plates 1 due to the weight per se. The molten heat-conducting material 2 will fill the gap between the thermal pipe 20 and the through hole 11 in case that the inner diameter of the through hole 11 is larger than the outer diameter of the thermal pipe 20. The thermal pipe 20 and the through hole 11 have tight sealing therebetween after the molten heat-conducting material 2 is solidified. Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11.
  • FIGS. 6 and 7 show another preferred embodiment of the present invention.
  • The accommodating section 12 is implemented by a through guiding hole 122 atop the through hole 11. The through guiding hole 122 can be of rounded shape as shown in FIGS. 6 and 7. Moreover, the through guiding hole 122 can be of inverted water-drop shape as shown in FIG. 9, or inverted triangular shape with narrow bottom or tapered shape with narrow bottom. The through guiding hole 122 can facilitate the flowing of the molten heat-conducting material 2′ into the through hole 11. The heat-conducting material 2′ in solid status can fill into the through guiding hole 122 after the heat-dissipating fin set 10 is assembled. The heat-conducting material 2′ can be tin strip, tin paste or wax. As shown in FIG. 8, the heat-conducting material 2′ in solid status becomes molten heat-conducting material 2′ after heating. The molten heat-conducting material 2 flows downward along the lateral side of the plate-shaped fin plates 1. The molten heat-conducting material 2′ will fill the gap between the thermal pipe 20 and the through hole 11. Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11.
  • As can be seen in above description, the provision of the accommodating section 12 facilitates the molten heat-conducting material 2, 2′ flowing downward along the lateral side of the plate-shaped fin plates 1 and filling the gap between the thermal pipe 20 and the through hole 11. Therefore, there is excellent thermal conduction between the thermal pipe 20 and the through hole 11.
  • Moreover, the through hole is a closed hole to provide mechanical robustness. The thermal pipe can be tightly engaged and secured. The heat-conducting material can be applied from top side of the fin plate to simplify process.
  • Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims (11)

1. A heat-dissipating device, comprising:
a heat-dissipating fin set including a plurality of fin plates, each of the fin plates having at least one closed through hole and an accommodating section atop the through hole and a heat-conducting material being placed into the accommodating section; and
a thermal pipe passing through the through hole;
a thermal conductance provided between the through hole and the thermal pipe,
wherein the heat-conducting material is molten after heating the heat-dissipating fin set and the molten heat-conducting material filling a gap between the through hole and the thermal pipe.
2. The heat-dissipating device as in claim 1, wherein the accommodating section is a downward dent formed at top face of each fin plate and the heat-conducting material is placed in the dent.
3. The heat-dissipating device as in claim 2, wherein the heat-conducting material is heat-conducting glue.
4. The heat-dissipating device as in claim 1, wherein the accommodating section is a through guiding hole formed on the fin plate and atop the through hole, the heat-conducting material is placed in the guiding hole.
5. The heat-dissipating device as in claim 4, wherein the guiding hole is of rounded shape.
6. The heat-dissipating device as in claim 4, wherein the guiding hole is of tapered shape with narrow bottom.
7. The heat-dissipating device as in claim 4, wherein the guiding hole is of inverted water-drop shape.
8. The heat-dissipating device as in claim 4, wherein the guiding hole is of inverted triangular shape.
9. The heat-dissipating device as in claim 4, wherein the heat-conducting material is tin strip.
10. The heat-dissipating device as in claim 4, wherein the heat-conducting material is tin paste.
11. The heat-dissipating device as in claim 4, wherein the heat-conducting material is wax.
US11/016,823 2004-11-24 2004-11-24 Heat-dissipating fin set in combination with thermal pipe Abandoned US20060108104A1 (en)

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US20070023177A1 (en) * 2005-07-27 2007-02-01 Li-Ping Lee Cooling fin assembly
US20070030654A1 (en) * 2005-08-04 2007-02-08 Delta Electronics, Inc. Heat dissipation modules and assembling methods thereof
US20070039726A1 (en) * 2005-08-17 2007-02-22 Lee Phon Q Fin for a heat sink, heat sink and method for manufacturing a heat sink
US20070095510A1 (en) * 2005-11-03 2007-05-03 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US20070187082A1 (en) * 2006-02-14 2007-08-16 Li-Wei Fan Chiang Structural enhanced heat dissipating device
US20070284082A1 (en) * 2006-05-31 2007-12-13 Min-Hsien Sung Heat dissipating device
US20070284083A1 (en) * 2006-05-31 2007-12-13 Min-Hsien Sung Heat dissipating device
US20080105408A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
US20110005726A1 (en) * 2009-07-13 2011-01-13 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation device and manufacturing method thereof
CN104717875A (en) * 2013-12-17 2015-06-17 广达电脑股份有限公司 Method for manufacturing heat radiation assembly
FR3031804A1 (en) * 2015-01-19 2016-07-22 Valeo Systemes Thermiques IMPROVED HEAT EXCHANGER WITH TUBES AND FINS AND METHOD OF MANUFACTURING SUCH A HEAT EXCHANGER

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CN102116586B (en) * 2009-12-30 2013-11-06 富准精密工业(深圳)有限公司 Heat dissipating device

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