US20050067149A1 - Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins - Google Patents

Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins Download PDF

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Publication number
US20050067149A1
US20050067149A1 US10/951,934 US95193404A US2005067149A1 US 20050067149 A1 US20050067149 A1 US 20050067149A1 US 95193404 A US95193404 A US 95193404A US 2005067149 A1 US2005067149 A1 US 2005067149A1
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United States
Prior art keywords
heat
fins
heat pipe
radiating
fin set
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Abandoned
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US10/951,934
Inventor
Huei-Jan Wu
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Nidec Chaun Choung Technology Corp
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Individual
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Assigned to CHAUN-CHOUNG TECHNOLOGY CORP. reassignment CHAUN-CHOUNG TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WU, HUEI-JAN
Publication of US20050067149A1 publication Critical patent/US20050067149A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a conventional heat-radiating fin set comprises a pipe body 12 , several fins 11 , and a solder bar 13 .
  • Each of the fins 11 has a through hole 111 and is sleeved with the pipe body 12 through the through hole 111 .
  • a gap 112 is further formed at the through hole 111 of each of the fins 11 .
  • the solder bar 13 penetrates the channel formed of the connected gaps 112 (or solder paste (not shown) is provided at inner edges of the through holes 111 of the fins 11 ). After passing a solder furnace and heated, the solder bar 13 (or solder paste) will be melted to bind the pipe body 12 and the through holes 111 of the fins 11 together, hence forming the conventional heat-radiating fin set 1 .
  • the fins are applied with solder paste and then assembled one by one so that the manufacturing and assembly cost is high and automatic and quick production can't be accomplished. Moreover, because there is still isolation of solder material (the solder bar or solder paste) between the fins 11 and the pipe body 12 , conduction of heat will be blocked to cause reduction of the heat conduction efficiency.
  • the present invention aims to propose an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to solve the above problems in the prior art.
  • the present invention relates to an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins and, more particularly, to a heat-radiating fin set capable of assembling several fins for heat radiation of an electronic component (e.g., a CPU).
  • an electronic component e.g., a CPU
  • Another object of the present invention is to provide an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to effectively avoid isolation of solder material between the fins and the heat pipe so that the heat-radiating efficiency won't be lowered.
  • the present invention provides an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to facilitate the operation of a stamping machine.
  • the improved heat-radiating fin set comprises a heat pipe and several fins each having a sleeve hole and a flange formed at the edge of the sleeve hole.
  • the fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.
  • FIG. 1 is an exploded perspective view of a conventional heat-radiating fin set
  • FIG. 2 is a perspective assembly view of a conventional heat-radiating fin set
  • FIG. 3 is an exploded perspective view of a heat-radiating fin set of the present invention.
  • FIG. 4 is a perspective assembly view of a heat-radiating fin set of the present invention.
  • FIG. 5 is a perspective view of a single fin of a heat-radiating fin set of the present invention.
  • FIG. 6 is a cross-sectional view of a heat-radiating fin set of the present invention.
  • the present invention provides an improved heat-radiating fin set 2 formed by combining a heat pipe and several heat-radiating fins.
  • the heat-radiating fin set 2 comprises a heat pipe 22 and several fins 21 , which are sleeved with the heat pipe 22 and stacked together one by one.
  • the improved heat-radiating fin set 2 needs to effectively match an exclusive manufacturing machine (e.g., a stamping machine) so that quick and mass production can be accomplished in an automatic way for the manufacturing and assembly of the heat-radiating fin set, thereby effectively lowering the manufacturing and assembly cost.
  • an exclusive manufacturing machine e.g., a stamping machine
  • the heat pipe 22 is used to quickly conduct heat from its one end to the other end for increasing the heat-radiating efficiency of various heat radiators or heat-radiating devices.
  • the heat pipe 22 can be a round pipe, a flat pipe or a pipe body including any round or flat shape.
  • Each of the fins 21 has a sleeve hole 211 .
  • a flange 212 is formed at the edge of each of the sleeve holes 211 to increase the contact area of each of the fins 21 with the heat pipe 22 and also enhance the fixing effect.
  • the fins 21 are tightly sleeved with the heat pipe 22 through the sleeve holes 211 .
  • the bore diameter of the sleeve holes 211 of the fins 21 is smaller than outer diameter of the heat pipe 22 before being sleeved with the heat pipe 22 . Therefore, the fins 21 will compel open the bore diameter of the sleeve holes 211 to be tightly sleeved with the heat pipe 22 without using any solder material (e.g., solder paste) for binding when being sleeved with the heat pipe 22 .
  • solder material e.g., solder paste
  • the fins 21 can also be of an L-shape (not shown) having only a sidewall or pf an I-shape (not shown) having no sidewall. Because no solder material (e.g., solder paste) is required for binding, not only reduction of the heat conduction efficiency due to the solder material won't occur, the operation of a stamping machine (not shown) will also be facilitated. One only needs to entrust manufacturing procedures like hole punching, shaping, hole expanding, edge bending, and cutting to the stamping machine for continuous stamping and then provide the manufactured fins 21 for the stamping machine for subsequent operations.
  • solder material e.g., solder paste
  • the fins 21 can be led to move and sleeved with the vertical and immobile heat pipe 22 one by one (from top to bottom) in accordance with the longitudinal to-and-fro motion of the stamping machine.
  • the heat pipe 22 be sleeved with the immobile fins 21 .
  • the assembly of the heat-radiating fin set of the present invention can thus be accomplished.
  • the structure of the heat-radiating fin set of the present invention can exactly facilitate the operation of the stamping machine to accomplish quick and mass production in an automatic way, thereby effectively lowering the manufacturing and assembly cost.
  • the present invention can accomplish quick and mass production of an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins in an automatic way, and can also avoid reduction of the heat-radiating efficiency due to solder material (e.g., solder paste) for binding.
  • solder material e.g., solder paste

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins can assemble several fins for heat radiation of an electronic component. The improved heat-radiating fin set can be quickly mass-produced in an automatic way to lower the manufacturing and assembly cost without using any solder material for binding. The improved heat-radiating fin set comprises a heat pipe and several fins. A sleeve hole is disposed in each fin. A flange is formed at the edge of each of the sleeve holes. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.

Description

    BACKGROUND OF THE INVENTION
  • As shown in FIGS. 1 and 2, a conventional heat-radiating fin set comprises a pipe body 12, several fins 11, and a solder bar 13. Each of the fins 11 has a through hole 111 and is sleeved with the pipe body 12 through the through hole 111. A gap 112 is further formed at the through hole 111 of each of the fins 11. After the fins 11 are stacked together one by one, the solder bar 13 penetrates the channel formed of the connected gaps 112 (or solder paste (not shown) is provided at inner edges of the through holes 111 of the fins 11). After passing a solder furnace and heated, the solder bar 13 (or solder paste) will be melted to bind the pipe body 12 and the through holes 111 of the fins 11 together, hence forming the conventional heat-radiating fin set 1.
  • For the above conventional heat-radiating fin set 1, however, the fins are applied with solder paste and then assembled one by one so that the manufacturing and assembly cost is high and automatic and quick production can't be accomplished. Moreover, because there is still isolation of solder material (the solder bar or solder paste) between the fins 11 and the pipe body 12, conduction of heat will be blocked to cause reduction of the heat conduction efficiency.
  • Accordingly, the present invention aims to propose an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to solve the above problems in the prior art.
  • 1. Field of the Invention
  • The present invention relates to an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins and, more particularly, to a heat-radiating fin set capable of assembling several fins for heat radiation of an electronic component (e.g., a CPU).
  • 2. Description of Related Art
    • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to effectively match an exclusive manufacturing machine so that quick and mass production can be accomplished in an automatic way for the manufacturing and assembly of the heat-radiating fin set, thereby effectively lowering the manufacturing and assembly cost.
  • Another object of the present invention is to provide an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to effectively avoid isolation of solder material between the fins and the heat pipe so that the heat-radiating efficiency won't be lowered.
  • To achieve the above objects, the present invention provides an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to facilitate the operation of a stamping machine. The improved heat-radiating fin set comprises a heat pipe and several fins each having a sleeve hole and a flange formed at the edge of the sleeve hole. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.
  • The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded perspective view of a conventional heat-radiating fin set;
  • FIG. 2 is a perspective assembly view of a conventional heat-radiating fin set;
  • FIG. 3 is an exploded perspective view of a heat-radiating fin set of the present invention;
  • FIG. 4 is a perspective assembly view of a heat-radiating fin set of the present invention;
  • FIG. 5 is a perspective view of a single fin of a heat-radiating fin set of the present invention; and
  • FIG. 6 is a cross-sectional view of a heat-radiating fin set of the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • As shown in FIGS. 3 to 6, the present invention provides an improved heat-radiating fin set 2 formed by combining a heat pipe and several heat-radiating fins. The heat-radiating fin set 2 comprises a heat pipe 22 and several fins 21, which are sleeved with the heat pipe 22 and stacked together one by one. The improved heat-radiating fin set 2 needs to effectively match an exclusive manufacturing machine (e.g., a stamping machine) so that quick and mass production can be accomplished in an automatic way for the manufacturing and assembly of the heat-radiating fin set, thereby effectively lowering the manufacturing and assembly cost.
  • The heat pipe 22 is used to quickly conduct heat from its one end to the other end for increasing the heat-radiating efficiency of various heat radiators or heat-radiating devices. The heat pipe 22 can be a round pipe, a flat pipe or a pipe body including any round or flat shape.
  • Each of the fins 21 has a sleeve hole 211. A flange 212 is formed at the edge of each of the sleeve holes 211 to increase the contact area of each of the fins 21 with the heat pipe 22 and also enhance the fixing effect.
  • The fins 21 are tightly sleeved with the heat pipe 22 through the sleeve holes 211. The bore diameter of the sleeve holes 211 of the fins 21 is smaller than outer diameter of the heat pipe 22 before being sleeved with the heat pipe 22. Therefore, the fins 21 will compel open the bore diameter of the sleeve holes 211 to be tightly sleeved with the heat pipe 22 without using any solder material (e.g., solder paste) for binding when being sleeved with the heat pipe 22.
  • In addition to the U-shape having two opposite sidewalls shown in FIG. 5, the fins 21 can also be of an L-shape (not shown) having only a sidewall or pf an I-shape (not shown) having no sidewall. Because no solder material (e.g., solder paste) is required for binding, not only reduction of the heat conduction efficiency due to the solder material won't occur, the operation of a stamping machine (not shown) will also be facilitated. One only needs to entrust manufacturing procedures like hole punching, shaping, hole expanding, edge bending, and cutting to the stamping machine for continuous stamping and then provide the manufactured fins 21 for the stamping machine for subsequent operations. The fins 21 can be led to move and sleeved with the vertical and immobile heat pipe 22 one by one (from top to bottom) in accordance with the longitudinal to-and-fro motion of the stamping machine. Of course, it is also feasible that the heat pipe 22 be sleeved with the immobile fins 21. The assembly of the heat-radiating fin set of the present invention can thus be accomplished. The structure of the heat-radiating fin set of the present invention can exactly facilitate the operation of the stamping machine to accomplish quick and mass production in an automatic way, thereby effectively lowering the manufacturing and assembly cost.
  • To sum up, the present invention can accomplish quick and mass production of an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins in an automatic way, and can also avoid reduction of the heat-radiating efficiency due to solder material (e.g., solder paste) for binding.
  • Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims (7)

1. A heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to facilitate the operation of a stamping machine comprising:
a heat pipe; and
several fins each having a sleeve hole and a flange formed at an edge of said sleeve hole, said fins being tightly sleeved with said heat pipe through said sleeve holes with said flanges of said sleeve holes of said fins touching an outer wall of said heat pipe.
2. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein the bore diameter of said sleeve hole of each said fin is smaller than the outer diameter of said heat pipe before said fin is sleeved with said heat pipe.
3. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are I-shaped.
4. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are L-shaped.
5. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are U-shaped.
6. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said heat pipe is sleeved into said sleeve holes of said fins one by one in accordance with a longitudinal motion of said stamping machine.
7. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are led to move and sleeved with said vertical and immobile heat pipe one by one in accordance with a longitudinal motion of said stamping machine.
US10/951,934 2003-09-30 2004-09-29 Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins Abandoned US20050067149A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092217557 2003-09-30
TW092217557U TWM241626U (en) 2003-09-30 2003-09-30 Improvement on heat-dissipating fin assembly comprising heat pipe coupled to heat-dissipating fin

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060059684A1 (en) * 2004-09-21 2006-03-23 Foxconn Technology Co., Ltd. Method of manufacturing a heat dissipating device
US20060108104A1 (en) * 2004-11-24 2006-05-25 Jia-Hao Li Heat-dissipating fin set in combination with thermal pipe
US20070030654A1 (en) * 2005-08-04 2007-02-08 Delta Electronics, Inc. Heat dissipation modules and assembling methods thereof
US20070115637A1 (en) * 2005-11-18 2007-05-24 Foxconn Technology Co.,Ltd. Heat dissipation device with heat pipe
US20080105408A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
CN102116586A (en) * 2009-12-30 2011-07-06 富准精密工业(深圳)有限公司 Heat dissipating device
US20160212881A1 (en) * 2015-01-20 2016-07-21 Fujitsu Limited Heat dissipation device and method of dissipating heat
CN106960988A (en) * 2017-05-17 2017-07-18 西南交通大学 A kind of dynamic lithium battery heat management system
CN110430720A (en) * 2019-07-09 2019-11-08 北京空间飞行器总体设计部 A kind of gravity force heat pipe radiator suitable for outdoor base station

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2918446A1 (en) * 2007-07-06 2009-01-09 Vortex Cie Sarl Device useful in a field of construction to heat an accessory e.g. a valve body of a tap, comprises a heat pipe having a condensation end and a vaporization end thermically connected to accessory and geothermal heat source
TWI800244B (en) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 Heat sink assembly with heat pipe

Citations (5)

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US4928756A (en) * 1988-08-04 1990-05-29 Spectra-Physics Heat dissipating fin and method for making fin assembly
US6435266B1 (en) * 2001-05-01 2002-08-20 Aavid Taiwan Inc. Heat-pipe type radiator and method for producing the same
US6717813B1 (en) * 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
US20040182552A1 (en) * 2001-07-31 2004-09-23 Yoshinari Kubo Heat sink for electronic devices and heat dissipating method
US20040190260A1 (en) * 2003-03-31 2004-09-30 Chiyoshi Sasaki Heat sink with heat dissipating fins and method of manufacturing heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928756A (en) * 1988-08-04 1990-05-29 Spectra-Physics Heat dissipating fin and method for making fin assembly
US6435266B1 (en) * 2001-05-01 2002-08-20 Aavid Taiwan Inc. Heat-pipe type radiator and method for producing the same
US20040182552A1 (en) * 2001-07-31 2004-09-23 Yoshinari Kubo Heat sink for electronic devices and heat dissipating method
US20040190260A1 (en) * 2003-03-31 2004-09-30 Chiyoshi Sasaki Heat sink with heat dissipating fins and method of manufacturing heat sink
US6717813B1 (en) * 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060059684A1 (en) * 2004-09-21 2006-03-23 Foxconn Technology Co., Ltd. Method of manufacturing a heat dissipating device
US7047640B2 (en) * 2004-09-21 2006-05-23 Foxconn Technology Co., Ltd. Method of manufacturing a heat dissipating device
US20060108104A1 (en) * 2004-11-24 2006-05-25 Jia-Hao Li Heat-dissipating fin set in combination with thermal pipe
US20070030654A1 (en) * 2005-08-04 2007-02-08 Delta Electronics, Inc. Heat dissipation modules and assembling methods thereof
US20070115637A1 (en) * 2005-11-18 2007-05-24 Foxconn Technology Co.,Ltd. Heat dissipation device with heat pipe
US7254026B2 (en) * 2005-11-18 2007-08-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20080105408A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat-pipe type heat sink
US7500513B2 (en) * 2006-11-03 2009-03-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat-pipe type heat sink
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
CN102116586A (en) * 2009-12-30 2011-07-06 富准精密工业(深圳)有限公司 Heat dissipating device
US20160212881A1 (en) * 2015-01-20 2016-07-21 Fujitsu Limited Heat dissipation device and method of dissipating heat
US10091908B2 (en) * 2015-01-20 2018-10-02 Fujitsu Limited Heat dissipation device and method of dissipating heat
CN106960988A (en) * 2017-05-17 2017-07-18 西南交通大学 A kind of dynamic lithium battery heat management system
CN110430720A (en) * 2019-07-09 2019-11-08 北京空间飞行器总体设计部 A kind of gravity force heat pipe radiator suitable for outdoor base station

Also Published As

Publication number Publication date
DE202004015170U1 (en) 2004-12-23
TWM241626U (en) 2004-08-21

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AS Assignment

Owner name: CHAUN-CHOUNG TECHNOLOGY CORP., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WU, HUEI-JAN;REEL/FRAME:015252/0623

Effective date: 20040929

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION