CN1654593A - 红色荧光粉及制法及发光二极管和活性动态液晶装置 - Google Patents
红色荧光粉及制法及发光二极管和活性动态液晶装置 Download PDFInfo
- Publication number
- CN1654593A CN1654593A CNA2004101033738A CN200410103373A CN1654593A CN 1654593 A CN1654593 A CN 1654593A CN A2004101033738 A CNA2004101033738 A CN A2004101033738A CN 200410103373 A CN200410103373 A CN 200410103373A CN 1654593 A CN1654593 A CN 1654593A
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- China
- Prior art keywords
- red fluorescence
- red
- fluorescence powder
- led
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Sm(q)的量 | |
实施例1 | 0.02 |
实施例2 | 0.04 |
实施例3 | 0.06 |
实施例4 | 0.08 |
实施例5 | 0.10 |
Eu(z)的量 | |
实施例6 | 0.7 |
实施例7 | 0.8 |
实施例8 | 0.9 |
实施例9 | 1.0 |
实施例10 | 1.1 |
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR77185/03 | 2003-11-01 | ||
KR77185/2003 | 2003-11-01 | ||
KR1020030077185A KR100616513B1 (ko) | 2003-11-01 | 2003-11-01 | 적색형광체, 그 제조방법, 이를 이용한 적색 led소자,백색 led 소자 및 능동 발광형 액정 디스플레이 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1654593A true CN1654593A (zh) | 2005-08-17 |
CN100556983C CN100556983C (zh) | 2009-11-04 |
Family
ID=34420700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004101033738A Active CN100556983C (zh) | 2003-11-01 | 2004-11-01 | 红色荧光粉及制法及发光二极管和活性动态液晶装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7459846B2 (zh) |
EP (1) | EP1528095B1 (zh) |
JP (1) | JP2005139449A (zh) |
KR (1) | KR100616513B1 (zh) |
CN (1) | CN100556983C (zh) |
Cited By (4)
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CN101168666B (zh) * | 2006-11-30 | 2010-06-09 | 中国科学院长春光学精密机械与物理研究所 | 一种用于白光led的红色荧光粉及其制备方法 |
CN102041002A (zh) * | 2009-10-23 | 2011-05-04 | 三星Led株式会社 | 磷光体及其制备方法、发光装置封装件、表面光源设备 |
CN101298561B (zh) * | 2008-06-30 | 2011-05-25 | 上海师范大学 | 一种蓝光激发的红光荧光体及其制备方法 |
CN104371721A (zh) * | 2014-10-17 | 2015-02-25 | 乐山东承新材料有限公司 | 稀土红色荧光粉及其制备方法 |
Families Citing this family (22)
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KR20060013116A (ko) * | 2004-08-06 | 2006-02-09 | 삼성전기주식회사 | 적색형광체 및 그 제조방법 |
KR100638619B1 (ko) * | 2004-09-23 | 2006-10-26 | 삼성전기주식회사 | 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치 |
US7648649B2 (en) * | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
US7497973B2 (en) * | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
KR101262409B1 (ko) * | 2005-05-23 | 2013-05-08 | 이데미쓰 고산 가부시키가이샤 | 미립자 및 이를 이용한 적색 형광 변환 매체 |
TWI290951B (en) * | 2005-10-04 | 2007-12-11 | Ind Tech Res Inst | The novel red fluorescent powder |
KR100705639B1 (ko) * | 2005-11-25 | 2007-04-09 | 한국화학연구원 | 형광체 최적화 방법 |
JP2007254517A (ja) * | 2006-03-22 | 2007-10-04 | Niigata Univ | 蛍光体用複合酸化物および蛍光体 |
KR100783251B1 (ko) * | 2006-04-10 | 2007-12-06 | 삼성전기주식회사 | 양자점을 이용한 다층 구조 백색 발광 다이오드 및 그의제조방법 |
US8878766B2 (en) * | 2007-11-15 | 2014-11-04 | Cree, Inc. | Apparatus and methods for selecting light emitters for a transmissive display |
DE102008029191A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung |
TW201037059A (en) * | 2009-04-01 | 2010-10-16 | Chunghwa Picture Tubes Ltd | Red light fluorescent material and manufacturing method thereof, and white light luminescent device |
KR100959362B1 (ko) | 2010-02-02 | 2010-05-20 | 한국조폐공사 | 발광체 및 이의 제조방법 |
CN101906301B (zh) * | 2010-02-05 | 2013-06-05 | 四川新力光源股份有限公司 | 红色荧光粉及其制备方法和led光源器件 |
JP5747023B2 (ja) * | 2010-03-18 | 2015-07-08 | 株式会社東芝 | 白色発光ランプおよびそれを用いた白色led照明装置 |
CN103718650A (zh) * | 2011-08-16 | 2014-04-09 | 三星电子株式会社 | 具有可调节的色温的led装置 |
CN102433117A (zh) * | 2011-09-05 | 2012-05-02 | 四川师范大学 | 钨钼酸盐固溶体发光微晶的一种化学溶液制备方法 |
CN102634340B (zh) * | 2012-03-19 | 2013-12-25 | 南京工业大学 | 一种白光led用双钙钛矿红色荧光粉及其制备方法 |
CN102703071A (zh) * | 2012-05-31 | 2012-10-03 | 中南大学 | 一种锂基双钨钼酸盐红色荧光粉的制备方法 |
CN102942925A (zh) * | 2012-06-22 | 2013-02-27 | 四川师范大学 | NaEu(MoO4)2-x(WO4)x系列荧光微晶及其化学溶液制备方法 |
CN102899042A (zh) * | 2012-10-08 | 2013-01-30 | 周口师范学院 | 一种Pr,Eu/Tb共掺杂的钨/钼酸盐荧光粉及其制备方法 |
CN104371719B (zh) * | 2014-11-18 | 2016-08-17 | 安徽理工大学 | 一种白光led用双钙钛矿钨钼酸盐红色荧光粉及其制备方法 |
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JPS5210881A (en) * | 1975-07-16 | 1977-01-27 | Matsushita Electric Ind Co Ltd | Fluorescent substances |
JP3000379B2 (ja) * | 1990-08-23 | 2000-01-17 | セイコーインスツルメンツ株式会社 | X線用螢光スクリーン |
JP2003041252A (ja) | 2001-07-31 | 2003-02-13 | Fine Rubber Kenkyusho:Kk | 赤色発光蛍光体及びそれを用いた発光装置 |
GB0120460D0 (en) * | 2001-08-22 | 2001-10-17 | Oxonica Ltd | Near UV excited phosphors |
CN100386888C (zh) | 2001-10-01 | 2008-05-07 | 松下电器产业株式会社 | 发光元件及使用它的发光装置 |
KR100443257B1 (ko) * | 2001-10-25 | 2004-08-04 | 한국화학연구원 | Uv led 및 능동 발광 lcd용 적색 형광체 |
JP4414821B2 (ja) * | 2004-06-25 | 2010-02-10 | Dowaエレクトロニクス株式会社 | 蛍光体並びに光源およびled |
-
2003
- 2003-11-01 KR KR1020030077185A patent/KR100616513B1/ko active IP Right Grant
-
2004
- 2004-10-28 EP EP04256679A patent/EP1528095B1/en active Active
- 2004-10-29 JP JP2004316453A patent/JP2005139449A/ja active Pending
- 2004-11-01 US US10/976,875 patent/US7459846B2/en active Active
- 2004-11-01 CN CNB2004101033738A patent/CN100556983C/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101168666B (zh) * | 2006-11-30 | 2010-06-09 | 中国科学院长春光学精密机械与物理研究所 | 一种用于白光led的红色荧光粉及其制备方法 |
CN101298561B (zh) * | 2008-06-30 | 2011-05-25 | 上海师范大学 | 一种蓝光激发的红光荧光体及其制备方法 |
CN102041002A (zh) * | 2009-10-23 | 2011-05-04 | 三星Led株式会社 | 磷光体及其制备方法、发光装置封装件、表面光源设备 |
US8773012B2 (en) | 2009-10-23 | 2014-07-08 | Samsung Electronics Co., Ltd. | Phosphor, method for preparing and using the same, light emitting device package, surface light source apparatus and lighting apparatus using red phosphor |
CN104371721A (zh) * | 2014-10-17 | 2015-02-25 | 乐山东承新材料有限公司 | 稀土红色荧光粉及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2005139449A (ja) | 2005-06-02 |
EP1528095B1 (en) | 2012-02-15 |
KR20050042357A (ko) | 2005-05-09 |
US7459846B2 (en) | 2008-12-02 |
CN100556983C (zh) | 2009-11-04 |
US20050093816A1 (en) | 2005-05-05 |
EP1528095A1 (en) | 2005-05-04 |
KR100616513B1 (ko) | 2006-08-29 |
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