CN1649471A - 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板 - Google Patents

含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板 Download PDF

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Publication number
CN1649471A
CN1649471A CNA2004101034389A CN200410103438A CN1649471A CN 1649471 A CN1649471 A CN 1649471A CN A2004101034389 A CNA2004101034389 A CN A2004101034389A CN 200410103438 A CN200410103438 A CN 200410103438A CN 1649471 A CN1649471 A CN 1649471A
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CN
China
Prior art keywords
resin
particle
containing metal
particles
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004101034389A
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English (en)
Chinese (zh)
Inventor
青木秀夫
山口直子
田窪知章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003435760A external-priority patent/JP4166686B2/ja
Priority claimed from JP2003435757A external-priority patent/JP2005197007A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN1649471A publication Critical patent/CN1649471A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
CNA2004101034389A 2003-12-26 2004-12-27 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板 Pending CN1649471A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003435760A JP4166686B2 (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
JP2003435757A JP2005197007A (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法
JP435757/2003 2003-12-26
JP435760/2003 2003-12-26

Publications (1)

Publication Number Publication Date
CN1649471A true CN1649471A (zh) 2005-08-03

Family

ID=34889281

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004101034389A Pending CN1649471A (zh) 2003-12-26 2004-12-27 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板

Country Status (4)

Country Link
US (1) US7939171B2 (enExample)
KR (1) KR100612170B1 (enExample)
CN (1) CN1649471A (enExample)
TW (1) TW200521171A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902884B (zh) * 2009-05-26 2012-11-07 欣兴电子股份有限公司 形成复合材料电路板结构的方法
CN104685267A (zh) * 2012-10-02 2015-06-03 株式会社理研 活塞环
CN107994100A (zh) * 2017-12-15 2018-05-04 岭南师范学院 一种柔性单晶颗粒薄膜及其制备方法和应用
CN108029201A (zh) * 2015-09-15 2018-05-11 赛峰电子与防务公司 无压力银烧结的组装方法
CN109076702A (zh) * 2016-03-22 2018-12-21 杨军 基材上无溶剂印刷电路的方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4445448B2 (ja) * 2005-09-16 2010-04-07 株式会社東芝 回路基板の製造方法
KR20090025337A (ko) * 2006-06-14 2009-03-10 바스프 에스이 지지체 상의 전기 전도성 표면의 제조 방법
WO2008080893A1 (de) * 2007-01-05 2008-07-10 Basf Se Verfahren zur herstellung von elektrisch leitfähigen oberflächen
RU2009131220A (ru) * 2007-01-19 2011-02-27 Басф Се (De) Способ изготовления структурированных токопроводящих повехностей
TWI377278B (en) * 2007-02-20 2012-11-21 Ralf Noerenberg Process for production of metallized textile surfaces comprising current-generating or current-consuming articles and textile prepared by the same
WO2008101884A2 (de) * 2007-02-20 2008-08-28 Basf Se Verfahren zur kontaktierung elektrischer bauelemente
DE102007014501A1 (de) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil
US20090148182A1 (en) * 2007-12-06 2009-06-11 Kabushiki Kaisha Toshiba Image holding member, image forming apparatus, and charging member for image forming apparatus
US8247320B2 (en) * 2008-06-18 2012-08-21 Basf Se Process for producing electrodes for solar cells
TWI645973B (zh) * 2017-12-15 2019-01-01 律勝科技股份有限公司 聚醯亞胺薄化軟性基板及其製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123848A (ja) 1982-12-29 1984-07-17 Matsushita Electric Ind Co Ltd 配線基板印刷用現像剤
JPS60102794A (ja) 1983-11-09 1985-06-06 ブラザー工業株式会社 回路基板の製造方法
IT1184408B (it) 1985-04-09 1987-10-28 Telettra Lab Telefon Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
JPH0755979B2 (ja) 1988-08-18 1995-06-14 有限会社鈴木研究所 エポキシ樹脂組成物
JPH0389359A (ja) 1989-09-01 1991-04-15 Nec Corp 回路配線用機能性トナーとその製造方法
JPH04237063A (ja) 1991-01-21 1992-08-25 Nec Corp 回路印刷用帯電性粒子
EP0521153B1 (en) 1991-01-23 2001-03-14 Sun Microsystems, Inc. Method and apparatus for scoped interprocess message switching
JPH0669618A (ja) 1992-04-22 1994-03-11 Nec Corp 回路印刷用帯電性粒子
JPH07263841A (ja) 1994-03-18 1995-10-13 Toshiba Corp 配線基板
JPH0856077A (ja) 1994-08-12 1996-02-27 Mitsubishi Paper Mills Ltd 多層プリント配線板の製造方法
JPH1140933A (ja) 1997-07-17 1999-02-12 Alps Electric Co Ltd 導電性組成物およびそれを用いた電子機器
JPH11243279A (ja) 1998-02-26 1999-09-07 Ibiden Co Ltd フィルドビア構造を有する多層プリント配線板
JPH11243277A (ja) 1998-02-26 1999-09-07 Ibiden Co Ltd フィルドビア構造を有する多層プリント配線板
JPH11243278A (ja) 1998-02-26 1999-09-07 Ibiden Co Ltd フィルドビア構造を有する多層プリント配線板
EP1811825A1 (en) 1998-02-26 2007-07-25 Ibiden Co., Ltd. Multilayer printed wiring board with filled viaholes
JPH11243280A (ja) 1998-02-26 1999-09-07 Ibiden Co Ltd フィルドビア構造を有する多層プリント配線板
JP3505993B2 (ja) 1998-03-03 2004-03-15 株式会社村田製作所 回路形成用荷電性粉末及びそれを用いた多層配線基板
DE19812880A1 (de) * 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
JPH11354908A (ja) 1998-06-08 1999-12-24 Murata Mfg Co Ltd 回路パターン形成方法及びそれを用いて形成された多層配線基板
US6440625B1 (en) 1999-01-31 2002-08-27 Elfotek Ltd. Method of electrostatic recording on a cylindrical photoreceptor with dielectric coating and an electrophotographic duplicating apparatus
KR100504591B1 (ko) 1999-12-28 2005-08-03 티디케이가부시기가이샤 투명 도전막 및 그 제조방법
JP4036613B2 (ja) 1999-12-28 2008-01-23 Ｔｄｋ株式会社 透明導電膜及びその製造方法
JP2001265054A (ja) 2000-03-17 2001-09-28 Murata Mfg Co Ltd 金属粉末の再利用方法
JP4543490B2 (ja) 2000-03-29 2010-09-15 株式会社村田製作所 回路パターン形成方法及びそれによって形成された配線基板
TW499501B (en) 2000-10-19 2002-08-21 Hitachi Ltd Member having metallic layer, its manufacturing method
EP1325682A1 (en) 2001-12-11 2003-07-09 Societe Des Produits Nestle S.A. Food or pet food composition containing plant extracts for maintenance of bone health and prevention or treatment of bone diseases
JP3939175B2 (ja) * 2002-03-12 2007-07-04 株式会社日本触媒 金属含有粒子およびその製造方法
JP2004048030A (ja) 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902884B (zh) * 2009-05-26 2012-11-07 欣兴电子股份有限公司 形成复合材料电路板结构的方法
CN104685267A (zh) * 2012-10-02 2015-06-03 株式会社理研 活塞环
CN104685267B (zh) * 2012-10-02 2017-02-22 株式会社理研 活塞环
CN108029201A (zh) * 2015-09-15 2018-05-11 赛峰电子与防务公司 无压力银烧结的组装方法
CN108029201B (zh) * 2015-09-15 2020-09-08 赛峰电子与防务公司 无压力银烧结的组装方法
CN109076702A (zh) * 2016-03-22 2018-12-21 杨军 基材上无溶剂印刷电路的方法
CN107994100A (zh) * 2017-12-15 2018-05-04 岭南师范学院 一种柔性单晶颗粒薄膜及其制备方法和应用
CN107994100B (zh) * 2017-12-15 2021-01-05 岭南师范学院 一种柔性单晶颗粒薄膜及其制备方法和应用

Also Published As

Publication number Publication date
US20050191511A1 (en) 2005-09-01
KR100612170B1 (ko) 2006-08-14
TWI297021B (enExample) 2008-05-21
US7939171B2 (en) 2011-05-10
KR20050067049A (ko) 2005-06-30
TW200521171A (en) 2005-07-01

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