IT1184408B - Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi - Google Patents

Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi

Info

Publication number
IT1184408B
IT1184408B IT8520284A IT2028485A IT1184408B IT 1184408 B IT1184408 B IT 1184408B IT 8520284 A IT8520284 A IT 8520284A IT 2028485 A IT2028485 A IT 2028485A IT 1184408 B IT1184408 B IT 1184408B
Authority
IT
Italy
Prior art keywords
printed circuit
support
circuit boards
forming printed
resulting
Prior art date
Application number
IT8520284A
Other languages
English (en)
Other versions
IT8520284A1 (it
IT8520284A0 (it
Inventor
Giuseppe Marengo
Original Assignee
Telettra Lab Telefon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telettra Lab Telefon filed Critical Telettra Lab Telefon
Priority to IT8520284A priority Critical patent/IT1184408B/it
Publication of IT8520284A0 publication Critical patent/IT8520284A0/it
Priority to EP86102413A priority patent/EP0197276A3/en
Priority to US06/835,479 priority patent/US4897326A/en
Priority to ES552730A priority patent/ES8707069A1/es
Priority to JP61048710A priority patent/JPH06105826B2/ja
Publication of IT8520284A1 publication Critical patent/IT8520284A1/it
Application granted granted Critical
Publication of IT1184408B publication Critical patent/IT1184408B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT8520284A 1985-04-09 1985-04-09 Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi IT1184408B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8520284A IT1184408B (it) 1985-04-09 1985-04-09 Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
EP86102413A EP0197276A3 (en) 1985-04-09 1986-02-25 Process to manufacture printed circuit boards (pcb's) and related new products
US06/835,479 US4897326A (en) 1985-04-09 1986-03-03 Process to manufacture printed circuit boards
ES552730A ES8707069A1 (es) 1985-04-09 1986-03-06 Procedimiento para la fabricacion de placas de circuito impreso
JP61048710A JPH06105826B2 (ja) 1985-04-09 1986-03-07 印刷回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8520284A IT1184408B (it) 1985-04-09 1985-04-09 Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi

Publications (3)

Publication Number Publication Date
IT8520284A0 IT8520284A0 (it) 1985-04-09
IT8520284A1 IT8520284A1 (it) 1986-10-09
IT1184408B true IT1184408B (it) 1987-10-28

Family

ID=11165423

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8520284A IT1184408B (it) 1985-04-09 1985-04-09 Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi

Country Status (5)

Country Link
US (1) US4897326A (it)
EP (1) EP0197276A3 (it)
JP (1) JPH06105826B2 (it)
ES (1) ES8707069A1 (it)
IT (1) IT1184408B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848830B2 (ja) * 1988-09-02 1999-01-20 旭電化工業株式会社 水に難溶性の脂肪酸エステルの可溶化方法
US4892798A (en) * 1988-12-13 1990-01-09 Minnesota Mining And Manufacturing Company Electrophoretic imaging metal-toner fluid dispersion
US5196286A (en) * 1989-07-31 1993-03-23 Watkins Roger D Method for patterning a substrate
US5416569A (en) * 1991-01-04 1995-05-16 Goldberg; Michael Electrographically making devices having electrically conductive paths corresponding to those graphically represented on a mask
DE4122326C1 (en) * 1991-07-05 1993-02-04 Rolf 7245 Starzach De Jethon Three=dimensional shaped bodies prodn. - by putting powder on photosemiconductor by electrostatic force and transferring to workpiece support
JPH0888456A (ja) * 1994-09-14 1996-04-02 Nikon Corp 基板配線製造方法および製造装置
US6445969B1 (en) * 1997-01-27 2002-09-03 Circuit Image Systems Statistical process control integration systems and methods for monitoring manufacturing processes
JPH11354371A (ja) * 1998-06-04 1999-12-24 Murata Mfg Co Ltd セラミック電子部品の製造方法
SE0000680D0 (sv) * 2000-03-02 2000-03-02 Array Printers Ab Method and device for manufacturing printed circuit boards
EP1457099B1 (de) * 2002-01-14 2005-06-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. System zur fertigung von elektrischen und integrierten schaltkreisen
JP2004048030A (ja) * 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置
JP2005050992A (ja) * 2003-07-28 2005-02-24 Toshiba Corp 配線基板および多層配線基板
JP2005195690A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属含有樹脂粒子、樹脂粒子、及び電子回路の製造方法
JP4130407B2 (ja) * 2003-12-26 2008-08-06 株式会社東芝 電子回路の製造方法
TW200521171A (en) * 2003-12-26 2005-07-01 Toshiba Kk Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
JP2005203396A (ja) * 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
US7433637B2 (en) * 2004-04-08 2008-10-07 Kabsushiki Kaisha Toshiba Image forming apparatus and method of manufacturing electronic circuit using the same
JP2005303090A (ja) * 2004-04-13 2005-10-27 Toshiba Corp 配線基板および配線基板の製造方法
JP4488784B2 (ja) * 2004-04-13 2010-06-23 株式会社東芝 電子回路の製造方法および電子回路

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3275436A (en) * 1962-07-24 1966-09-27 Xerox Corp Method of image reproduction utilizing a uniform releasable surface film
US3862352A (en) * 1968-04-16 1975-01-21 Itek Corp Photographically prepared electrical circuits wherein the photosensitive material is a photoconductor
DE2006134A1 (de) * 1969-02-17 1970-09-03 Electro Connective Systems Inc., Brockton, Mass. (V.St.A. Flexible gedruckte Schaltung sowie Verfahren und Vorrichtung zu ihrer Herstellung
US4066453A (en) * 1973-05-02 1978-01-03 Hoechst Aktiengesellschaft Process for the preparation of printing forms
DE2556386C2 (de) * 1975-12-15 1985-02-28 Hoechst Ag, 6230 Frankfurt Verfahren zur Herstellung von Druckformen und/oder metallisierten Bildern
JPS5437265A (en) * 1977-08-30 1979-03-19 Inoue Japax Res Print wiring substrate
DK153337C (da) * 1979-04-11 1988-11-14 Platonec Aps Fremgangsmaade til toer sensibilisering af en isolerende overflade
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
DE3024772A1 (de) * 1980-06-30 1982-01-28 Hoechst Ag, 6000 Frankfurt Elastische, laminierbare lichtempfindliche schicht
DE3024718A1 (de) * 1980-06-30 1982-01-28 Hoechst Ag, 6000 Frankfurt Verfahren zur herstellung von druckformen oder gedruckten schaltungen
DE3047498A1 (de) * 1980-12-17 1982-07-22 Herbert 4600 Dortmund Karnikowski Uebertragungsfolie fuer die uebertragung von abbildungen auf oberflaechen, sowie uebertragungsverfahren und vorrichtung
US4439815A (en) * 1982-02-01 1984-03-27 International Telephone And Telegraph Corporation Printed circuit assembly for a card file packaging system
US4467335A (en) * 1982-05-07 1984-08-21 Data Card Corporation System for forming an image on the surface of a plastic card
JPS59112688A (ja) * 1983-12-08 1984-06-29 キヤノン株式会社 電子機器
US4661431A (en) * 1984-09-27 1987-04-28 Olin Hunt Specialty Products, Inc. Method of imaging resist patterns of high resolution on the surface of a conductor

Also Published As

Publication number Publication date
EP0197276A3 (en) 1987-05-20
EP0197276A2 (en) 1986-10-15
US4897326A (en) 1990-01-30
JPH06105826B2 (ja) 1994-12-21
ES552730A0 (es) 1987-07-01
JPS61269393A (ja) 1986-11-28
IT8520284A1 (it) 1986-10-09
IT8520284A0 (it) 1985-04-09
ES8707069A1 (es) 1987-07-01

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960424