ES552730A0 - Procedimiento para la fabricacion de placas de circuito impreso - Google Patents
Procedimiento para la fabricacion de placas de circuito impresoInfo
- Publication number
- ES552730A0 ES552730A0 ES86552730A ES552730A ES552730A0 ES 552730 A0 ES552730 A0 ES 552730A0 ES 86552730 A ES86552730 A ES 86552730A ES 552730 A ES552730 A ES 552730A ES 552730 A0 ES552730 A0 ES 552730A0
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- manufacture
- printed circuit
- circuit boards
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8520284A IT1184408B (it) | 1985-04-09 | 1985-04-09 | Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi |
Publications (2)
Publication Number | Publication Date |
---|---|
ES552730A0 true ES552730A0 (es) | 1987-07-01 |
ES8707069A1 ES8707069A1 (es) | 1987-07-01 |
Family
ID=11165423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES552730A Expired ES8707069A1 (es) | 1985-04-09 | 1986-03-06 | Procedimiento para la fabricacion de placas de circuito impreso |
Country Status (5)
Country | Link |
---|---|
US (1) | US4897326A (es) |
EP (1) | EP0197276A3 (es) |
JP (1) | JPH06105826B2 (es) |
ES (1) | ES8707069A1 (es) |
IT (1) | IT1184408B (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2848830B2 (ja) * | 1988-09-02 | 1999-01-20 | 旭電化工業株式会社 | 水に難溶性の脂肪酸エステルの可溶化方法 |
US4892798A (en) * | 1988-12-13 | 1990-01-09 | Minnesota Mining And Manufacturing Company | Electrophoretic imaging metal-toner fluid dispersion |
US5196286A (en) * | 1989-07-31 | 1993-03-23 | Watkins Roger D | Method for patterning a substrate |
US5416569A (en) * | 1991-01-04 | 1995-05-16 | Goldberg; Michael | Electrographically making devices having electrically conductive paths corresponding to those graphically represented on a mask |
DE4122326C1 (en) * | 1991-07-05 | 1993-02-04 | Rolf 7245 Starzach De Jethon | Three=dimensional shaped bodies prodn. - by putting powder on photosemiconductor by electrostatic force and transferring to workpiece support |
JPH0888456A (ja) * | 1994-09-14 | 1996-04-02 | Nikon Corp | 基板配線製造方法および製造装置 |
US6445969B1 (en) * | 1997-01-27 | 2002-09-03 | Circuit Image Systems | Statistical process control integration systems and methods for monitoring manufacturing processes |
JPH11354371A (ja) * | 1998-06-04 | 1999-12-24 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
SE0000680D0 (sv) * | 2000-03-02 | 2000-03-02 | Array Printers Ab | Method and device for manufacturing printed circuit boards |
WO2003058677A2 (de) * | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | System zur fertigung von elektrischen und integrierten schaltkreisen |
JP2004048030A (ja) * | 2002-07-15 | 2004-02-12 | Toshiba Corp | 電子回路の製造方法および電子回路の製造装置 |
JP2005050992A (ja) * | 2003-07-28 | 2005-02-24 | Toshiba Corp | 配線基板および多層配線基板 |
TW200521171A (en) * | 2003-12-26 | 2005-07-01 | Toshiba Kk | Resin particles and resin layer containing metal micro particles, its forming method and circuit base board |
JP2005195690A (ja) * | 2003-12-26 | 2005-07-21 | Toshiba Corp | 金属含有樹脂粒子、樹脂粒子、及び電子回路の製造方法 |
JP4130407B2 (ja) * | 2003-12-26 | 2008-08-06 | 株式会社東芝 | 電子回路の製造方法 |
JP2005203396A (ja) * | 2004-01-13 | 2005-07-28 | Toshiba Corp | 電子部品の製造装置、電子部品の製造方法および電子部品 |
US7433637B2 (en) * | 2004-04-08 | 2008-10-07 | Kabsushiki Kaisha Toshiba | Image forming apparatus and method of manufacturing electronic circuit using the same |
JP2005303090A (ja) * | 2004-04-13 | 2005-10-27 | Toshiba Corp | 配線基板および配線基板の製造方法 |
JP4488784B2 (ja) * | 2004-04-13 | 2010-06-23 | 株式会社東芝 | 電子回路の製造方法および電子回路 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3275436A (en) * | 1962-07-24 | 1966-09-27 | Xerox Corp | Method of image reproduction utilizing a uniform releasable surface film |
US3862352A (en) * | 1968-04-16 | 1975-01-21 | Itek Corp | Photographically prepared electrical circuits wherein the photosensitive material is a photoconductor |
DE2006134A1 (de) * | 1969-02-17 | 1970-09-03 | Electro Connective Systems Inc., Brockton, Mass. (V.St.A. | Flexible gedruckte Schaltung sowie Verfahren und Vorrichtung zu ihrer Herstellung |
US4066453A (en) * | 1973-05-02 | 1978-01-03 | Hoechst Aktiengesellschaft | Process for the preparation of printing forms |
DE2556386C2 (de) * | 1975-12-15 | 1985-02-28 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung von Druckformen und/oder metallisierten Bildern |
JPS5437265A (en) * | 1977-08-30 | 1979-03-19 | Inoue Japax Res | Print wiring substrate |
DK153337C (da) * | 1979-04-11 | 1988-11-14 | Platonec Aps | Fremgangsmaade til toer sensibilisering af en isolerende overflade |
JPS56129394A (en) * | 1980-03-14 | 1981-10-09 | Dainippon Screen Mfg | Method of producing through hole of printed board |
DE3024772A1 (de) * | 1980-06-30 | 1982-01-28 | Hoechst Ag, 6000 Frankfurt | Elastische, laminierbare lichtempfindliche schicht |
DE3024718A1 (de) * | 1980-06-30 | 1982-01-28 | Hoechst Ag, 6000 Frankfurt | Verfahren zur herstellung von druckformen oder gedruckten schaltungen |
DE3047498A1 (de) * | 1980-12-17 | 1982-07-22 | Herbert 4600 Dortmund Karnikowski | Uebertragungsfolie fuer die uebertragung von abbildungen auf oberflaechen, sowie uebertragungsverfahren und vorrichtung |
US4439815A (en) * | 1982-02-01 | 1984-03-27 | International Telephone And Telegraph Corporation | Printed circuit assembly for a card file packaging system |
US4467335A (en) * | 1982-05-07 | 1984-08-21 | Data Card Corporation | System for forming an image on the surface of a plastic card |
JPS59112688A (ja) * | 1983-12-08 | 1984-06-29 | キヤノン株式会社 | 電子機器 |
US4661431A (en) * | 1984-09-27 | 1987-04-28 | Olin Hunt Specialty Products, Inc. | Method of imaging resist patterns of high resolution on the surface of a conductor |
-
1985
- 1985-04-09 IT IT8520284A patent/IT1184408B/it active
-
1986
- 1986-02-25 EP EP86102413A patent/EP0197276A3/en not_active Withdrawn
- 1986-03-03 US US06/835,479 patent/US4897326A/en not_active Expired - Fee Related
- 1986-03-06 ES ES552730A patent/ES8707069A1/es not_active Expired
- 1986-03-07 JP JP61048710A patent/JPH06105826B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IT8520284A0 (it) | 1985-04-09 |
JPH06105826B2 (ja) | 1994-12-21 |
IT1184408B (it) | 1987-10-28 |
EP0197276A3 (en) | 1987-05-20 |
EP0197276A2 (en) | 1986-10-15 |
ES8707069A1 (es) | 1987-07-01 |
US4897326A (en) | 1990-01-30 |
JPS61269393A (ja) | 1986-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Patent lapsed |
Effective date: 19960506 |