CN1642391A - 电路板封装的焊线方法 - Google Patents

电路板封装的焊线方法 Download PDF

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CN1642391A
CN1642391A CNA200410002808XA CN200410002808A CN1642391A CN 1642391 A CN1642391 A CN 1642391A CN A200410002808X A CNA200410002808X A CN A200410002808XA CN 200410002808 A CN200410002808 A CN 200410002808A CN 1642391 A CN1642391 A CN 1642391A
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bonding wire
circuit board
ball
weld
welding
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CN100369533C (zh
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彭育民
蔡铭山
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Dunnan Science And Tech Co Ltd
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Abstract

一种电路板封装的焊线方法，通过印刷电路板的焊接处先焊接一植球，再使焊线的一端焊接于印刷电路板上的芯片的焊接处，并牵引焊线，且使焊线的另一端焊接至印刷电路板的植球上。其中，于该焊接处预先焊接一植球前先使焊线前端结成一焊球，且焊接于该基板的焊接处后形成该植球；该焊接处预先焊接一植球后再使该焊线与该植球分离；于该焊线焊接至该基板上的芯片的焊接处前，先于该焊线焊前端形成一焊球，以使该焊球焊接至该基板上的芯片的焊接处；于该焊线的另一端焊接至该基板的植球后，使该植球后的焊线与该植球分离。如此可增加焊线与印刷电路板的结合面积，且因此增加连接强度，如此可避免其它外在因素而相互脱离。

Description

电路板封装的焊线方法
技术领域
本发明涉及一种电路板封装的焊线方法，特别涉及一种提高电路板与焊线的连接面积及强度的电路板封装的焊线方法。
背景技术
公知的半导体封装工程，特别是芯片在印刷电路板上的封装过程(chipon board)中，需要利用电路板封装的焊线方法，以利用打线统(wire bondsystem)使焊线连接于该芯片与该印电路板上，如此使该芯片与该印刷电路板电连接(请参阅图1至图3所示)，该电路板封装的焊线方法的步骤为：
1.贯穿该打线系统的磁嘴10a的焊线11a前端预先结成焊球12a。
2.利用该磁嘴10a压抵该焊线11a的焊球12a于该印刷电路板20a上的芯片30a(chip)的焊接处31a，以焊接该焊球12a于其上；
3.将该磁嘴10a迁移一距离，且同时使该磁嘴10a牵引该焊线11a并压抵该焊线11a于该印刷电路板20a的焊接处21a，以焊接该焊线11a另一端于其上；
4.使该印刷电路板20a的焊接处21a上的焊线11a与该磁嘴10a上的焊线11a分离。
如此即可将焊线11a焊接于该印刷电路板20a及该芯片30a(chip)，用以使焊线11a作为该印刷电路板20a及该芯片20a的电连接线。
上述公知的电路板封装的焊线方法仍具有下列缺点：
1.请参阅第三A图所示，其中该焊线以楔形结合点(wedge bond)形态与印刷电路板端的焊接处连接，且该楔形结合点与焊接处的黏接面积力少，并连接力较弱，因此容易因外力而相互脱离。
2.该印刷电路板经电镀制程或表面黏着技术(SMT)的制程中，由于该印刷电路板上的焊接处容易因电镀不良、污染或刮伤，导致焊线被焊接于其上时，造成焊线与焊接处的黏着面积更为减少，以致产生焊线与印刷电路板的黏着力不足，而容易相互脱离而影响可靠度。
因此，本发明提出一种设计合理且有效改善上述缺陷的本发明。
发明内容
本发明的其一目的是提供电路板封装的焊线方法，以提高印刷电路板与焊线的黏着面积，并增强其连接强度。
本发明的其二目的是提供电路板封装的焊线方法，以使裸露于印刷电路板上的芯片及焊线不需再利用封胶密封保护，所以节省许多制程时间及成本。
依据前述发明目的，本发明为一种电路板封装的焊线方法，其步骤包括：
将焊线焊接于该芯片的焊接处前先于基板的焊接处焊接一植球；
再将焊线的一端焊接至该基板上的芯片的焊接处，并牵引该焊线，使该焊线的另一端焊接至该基板的植球上，其中，于该焊接处预先焊接一植球前先使焊线前端结成一焊球，且焊接于该基板的焊接处后形成该植球；该焊接处预先焊接一植球后再使该焊线与该植球分离；于该焊线焊接至该基板上的芯片的焊接处前，先于该焊线焊前端形成一焊球，以使该焊球焊接至该基板上的芯片的焊接处；于该焊线的另一端焊接至该基板的植球后，使该植球后的焊线与该植球分离；该基板为印刷电路板，该焊接处为焊垫。该电路板封装的焊线方法是利用超音波打线机完成的。如此增加该焊线与该基板的焊接触的连接强度，并且节省许芯片及焊线利用封胶密封保护于基板的制程及成本。
为了能进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明及附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
图1是公知的焊线欲焊接于芯片时，先形成一焊球的示意图。
图2是公知的磁嘴使焊线焊接于芯片及印刷电路板示意图。
图3是公知的印刷电路板的焊接处上的焊线与磁嘴上的焊线分离示意图。
图3A为图3的印刷电路板的焊接处上的焊线端部局部示意图。
图4是本发明的焊线欲焊接于印刷电路板的焊接处时，先形成一焊球示意图。
图5是本发明的焊接于印刷电路板的焊接处上的植球示意图。
图6是本发明的磁嘴压抵并焊接焊球于芯片上的示意图。
图7是本发明的焊线的一端焊接于芯片，且另一端焊接于印刷电路板的植球示意图。
图7A为图7中焊线端部焊接于植球的局部示意图。
其中，附图标记说明如下：
磁嘴10a                  磁嘴10
焊线11a                  焊线11
焊球12a                  焊球12
印刷电路板20a            印刷电路板20
焊接处21a                焊接处21(first bond)
芯片30a(chip)            植球22
焊接处31a                芯片30(chip)
焊接处31(second bond)
具体实施方式
请参阅图4至图7所示，本发明为一种电路板封装的焊线方法，为芯片30(chip)与印刷电路板20焊接前，先于印刷电路板20的焊接处21(first bond)预先焊接一植球22，再焊接焊线11前端的焊球12于芯片30(chip)上，并牵引该焊线11至该印刷电路板20上的焊接处21(first bond)，且将焊线11压抵焊接于该植球22上，如此增加焊线11与印刷电路板20的焊接面积。
请参阅图4至图5所示，利用超音波打线机焊接芯片30(chip)及印刷电路板20，因此预先于贯穿该超音波打线机的磁嘴10前端的焊线11结成一焊球12，并利用磁嘴10压抵该焊球12于该印刷电路板20的焊接处21(firstbond)，以焊接于其上，再分离该焊球12及该焊线11，如此形成植球22于该焊接处21(first bond)上，再使该植球22与该焊线11分离。
请参阅图6至图7所示，再于该磁嘴10前端的焊线11结成一焊球12，并使磁嘴10压抵该焊球12于该芯片30(chip)的焊接处31(second bond)上，该焊接处31(second bond)为焊垫，再牵引该焊线11至该印刷电路板20的植球22，并将该焊线11压抵并焊接于该植球22上，如此使该焊线11与该印刷电路板20的焊接处21(first bond)形成电导通，最后使该植球22后的焊线11与该磁嘴10上的焊线11分离。如此增加该焊线11与该印刷电路板20的焊接处21(first bond)的黏着面积(如图7A所示)，因此使该焊线11与焊接处21(first bond)的黏着增强，以避免外力因素使该焊线11脱离该焊接处21(first bond)，并且运用于消费性的电子产品中时，因该焊线11与该芯片30(chip)及该印刷电路板20的连接性增强，因此使裸露于该印刷电路板20上的芯片30(chip)及其焊线11不需再利用封胶密封保护，所以节省许多制程时间及成本。
综上所述，通过本发明的电路板封装的焊线方法因此提高印刷电路板与焊线的黏着面积，并增强其连接强度，且使裸露于印刷电路板上的芯片及其上的焊线不需再利用封胶密封保护，所以节省许多制程时间及成本。
上述仅为本发明的较佳可行实施例，非因此拘限本发明的专利范围，故凡运用本发明的说明书及附图内容所为的等效结构变化，均同理包含于本发明的范围内。

Claims (8)

1.一种电路板封装的焊线方法，其中的步骤包括：
于一基板的焊接处先焊接一植球；及
再使焊线的一端焊接于该基板上的芯片的焊接处，并牵引该焊线，使该焊线的另一端焊接于该基板的植球上。
2.如权利要求1所述的电路板封装的焊线方法，其中，于该焊接处预先焊接一植球前先使焊线前端结成一焊球，且焊接于该基板的焊接处后形成该植球。
3.如权利要求2所述的电路板封装的焊线方法，其中，该焊接处预先焊接一植球后再使该焊线与该植球分离。
4.如权利要求1所述的电路板封装的焊线方法，其中，于该焊线焊接至该基板上的芯片的焊接处前，先于该焊线焊前端形成一焊球，以使该焊球焊接至该基板上的芯片的焊接处。
5.如权利要求1所述的电路板封装的焊线方法，其中，于该焊线的另一端焊接至该基板的植球后，使该植球后的焊线与该植球分离。
6.如权利要求1所述的电路板封装的焊线方法，其中，该基板为印刷电路板。
7.如权利要求1所述的电路板封装的焊线方法，其中，该焊接处为焊垫。
8.如权利要求1所述的电路板封装的焊线方法，利用超音波打线机完成。
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CN103972221A (zh) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 Led光源封装结构及led光源封装方法
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CN103972221A (zh) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 Led光源封装结构及led光源封装方法
CN107808829A (zh) * 2017-10-24 2018-03-16 南京矽邦半导体有限公司 一种针对微小焊盘芯片二次焊线方法

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