CN1607676A - 大面积显示结构的密封 - Google Patents
大面积显示结构的密封 Download PDFInfo
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- CN1607676A CN1607676A CNA2004100565516A CN200410056551A CN1607676A CN 1607676 A CN1607676 A CN 1607676A CN A2004100565516 A CNA2004100565516 A CN A2004100565516A CN 200410056551 A CN200410056551 A CN 200410056551A CN 1607676 A CN1607676 A CN 1607676A
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- 238000007789 sealing Methods 0.000 title claims abstract description 47
- 239000012769 display material Substances 0.000 claims abstract description 45
- 238000003491 array Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 33
- 239000000463 material Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 23
- 238000005516 engineering process Methods 0.000 description 15
- 239000011324 bead Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000000873 masking effect Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000005329 float glass Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000004276 hyalin Anatomy 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13336—Combining plural substrates to produce large-area displays, e.g. tiled displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/00—Organic light-emitting devices
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- H10K50/842—Containers
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/87—Passivation; Containers; Encapsulations
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/02—Composition of display devices
- G09G2300/026—Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
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- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
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Abstract
一种电子显示结构,包括显示模块,该显示模块包括:多个列电极,以及显示材料的多个部分,每个具有连接到所述多个列电极其中之一的第一侧和一第二侧,多个行电极,连接到所述显示材料的多个部分的每一个,以及密封装置,用于密封所述显示材料的多个部分的每一个。
Description
本申请是申请号为99803054.6、申请日为1999年2月17日、发明名称为“大面积显示结构的密封”之专利申请的分案申请。
技术领域
本发明涉及密封大面积显示结构,特别涉及密封拼接(tiled)的OLED显示结构。
技术背景
电子显示结构为根据电信号产生光图形的装置。不同类型的显示材料可用于提供光的图形。显示材料产生光的显示结构称作发光显示器。可以使用如有机发光二极管(OLED)材料形成发光显示器。其它类型的发光显示器包括等离子体显示器、场致发光显示器以及电致发光显示器。显示材料穿过或反射光而不是产生光的显示结构称为光阀。液晶显示器(LCD)为光阀型显示结构。
除了形成单个大电子显示结构(单个显示器),电子显示结构可以相邻地安装以形成拼接的显示器。拼接的显示器相当于大面积的单个显示器。显示结构的拼接使显示器的尺寸和形状更灵活。拼接不会遇到限制单片显示技术的尺寸的许多问题。由于拼接显示器中基本单元的制造不像大的单片显示器那么复杂,因此不必应用复杂的规则。由于制造的基本单元较小,因此尺寸规则不再是限制因素。拼接的显示器遵守显示面积不是按指数而是线性的缩尺规则。所述根本上不同的缩尺特点是造成制造成本减少的拼接技术的一个优点。
需要减小看见包含在拼接显示器中的相邻显示结构之间结的可能性。每个单独的拼接显示器或显示结构具有图像形成其上的前显示面。在许多情况中,该表面由玻璃盖板保护。夹紧拼接显示器以使它们的前玻璃盖板相互靠近。
通常通过将上和下基板联接在一起显示结构。由于许多显示材料需要显示结构的像素周围保持真空、防潮密封或气密密封,因此希望上和下基板之间的机械结也作为密封机构。密封机构的完整性对于可预测的器件性能和确保可预测的器件寿命很重要。
根据电信号由显示结构形成的光的图形由各显示元件或像素形成。到独立地控制对应于每个像素的光,可以使用电信号寻址每个像素。对于具有上和下基板的显示结构,需要耦合基板之间的这些电信号。由于信号的数量很大并且需要同时密封显示结构的显示材料,通常很难将这些信号耦合到显示结构。
能看到接缝、需要耦合电信号以及需要密封显示器产生相互矛盾的制造目的。拼接显示器边界较厚和较坚固的密封增加了拼接显示器之间的接缝宽度,导致接缝更容易看出。
要克服密封的拼接显示器结构的常规方法的不足,提供一种密封拼接显示器结构的新方法。
发明内容
根据本发明的一方面,提供一种电子显示结构,包括:显示模块,该显示模块包括:多个列电极,以及显示材料的多个部分,每个具有连接到所述多个列电极其中之一的第一侧和一第二侧,多个行电极,连接到所述显示材料的多个部分的每一个,以及密封装置,用于密封所述显示材料的多个部分的每一个。
本发明提供一种包括显示模块和区域密封的电子显示结构。显示模块包括具有多个列电极的第一基板。显示材料的多个部分的每一个连接到多个列电极中的一个和多个行电极中的一个。区域密封形成在第一基板上并封闭行电极、列电极以及部分显示材料。
根据本发明的一个方案,区域密封包括封闭多个行电极、多个列电极以及多个部分显示材料并将每个多个行和列电极连接到各信号线的各向异性导电结构。
根据本发明的另一方案,形成各向异性导电结构的工艺步骤用于密封电显示结构并将显示模块连接到电路模块。
根据本发明的又一方案,电子显示结构还包括含有多个信号线的电路模块,每个信号线对应于多个行和列电极中的一个,各向异性导电结构密封电路模块和显示模块,将电路模块粘附到显示模块,并将多个行和列电极中的每个电极连接到各信号线。
根据本发明的再一方案,各向异性导电结构基本上为黑色。
根据本发明的还一方案,多个行电极连接并密封显示材料的多个部分的每一个。
根据本发明的另一方案,电显示结构包括带形密封,由显示模块跨越到电路模块,并在电路和显示模块的外周边附近延伸。
根据本发明的再一方案,显示材料包括有机电致发光材料。
根据本发明的还一方案,珠状封接将显示模块的外部区域连接到电路模块的外部区域,当从基板的第一表面观察显示结构时,掩蔽层用于隐藏珠状封接。
根据本发明的又一方案,珠状封接占据小于像素之间一半间距的区域,以减小相邻拼接显示器之间接缝的视觉感。
附图说明
当结合附图阅读时,从下面详细的说明中可以更好地理解本发明。需要强调的是,根据通常的做法,图中的各种结构没有按比例画出。相反,为了清楚起见各种结构的尺寸可以任意放大或缩小。附图中包括以下图:
图1为已除去两个拼接显示器的大面积显示装置的前面平面图;
图2为适合于图1所示的大面积显示器中使用的一个拼接显示器的背面平面图;
图3为实施图1和2中所示拼接的结构的分解透视图;
图4示出了图3所示拼接结构的电连接结构的分解透视图;
图5示出了具有图3所示结构的四个拼接的一部分的示例性像素布局的像素图;
图6示出了形成在列电极上的显示材料的俯视图;
图6A为沿图6的线A-A截取的剖面图,示出了根据本发明像素密封的示例性实施例;
图6B为沿图6的线B-B截取的剖面图,示出了根据本发明像素密封的示例性实施例;
图6C为沿图6的线B-B截取的剖面图,示出了根据本发明的示例性实施例的绝缘焊盘;
图7示出了拼接的剖面图,示出了根据本发明的区域密封的示例性实施例和边缘密封的示例性实施例;
图7A为示出了根据本发明的掩蔽层与边缘密封结构的相邻拼接显示器的剖面图;
图8为示出了根据本发明的珠状封接的拼接显示器的剖面图;以及
图9为根据本发明显示器密封的剖面图。
具体实施方式
参考附图,其中在各图中类似的数字表示类似的元件,图1是根据本发明部分组装的大面积显示器100的前面平面图。显示器100为一种拼接的显示器,其中其上形成有图像像素的发射或反射元件以较小的阵列形成在拼接显示器120上并组装成一个框架,产生具有大量像素形成元件的大面积显示器。图1中所示的显示器缺少两个拼接显示器122和124。这些拼接显示器插入位置102和104内以使显示器完整。
虽然这里显示的显示器100由具有4×4阵列中16个像素形成元件的拼接显示器形成,但可以预料每个拼接显示器可以包括更多的像素。在本发明的一个示例性实施例中,如下所述,每个拼接显示器包括排列为32×28矩阵的896个像素形成元件。在另一个示例性实施例中,每个拼接显示器延伸到显示器100的全部高度或全部宽度。这些拼接显示器的尺寸仅为示例。可以预料每个拼接显示器可以包括更多或更少像素形成元件。此外,可以预料可以由具有不同像素形成元件数量的多个拼接显示器形成一个显示器。例如,显示器具有靠近中心像素形成元件数量较大的拼接显示器和靠近边缘像素形成元件数量较小的拼接显示器。
图2为适合于图1所示的大面积显示器100中使用的一个拼接显示器120的背面平面图。如图2所示,拼接显示器包括其上安装有至少一个集成电路芯片134的电路板130。集成电路通过电路板130上的导电条132连接到像素形成元件,导电条132连接到通路(vias)(未示出),通路延伸穿过电路板130接触显示装置的行或列电极,如下面参考图3-6B所介绍的。
此外,导电条132和它们的对应通路沿显示器的两个边缘延伸。
在本发明的一个示例性实施例中,像素形成元件由以下称作但不限于此的有机发光二极管(OLED)材料的有机发光材料制成。基本的发光结构由夹在一对适当选择和构图的电极之间的薄有机聚合物层组成。电流由一个电极流到另一个电极使有机聚合物发光。至少一个电极希望能透过发射的光。氧化铟锡(ITO)为用于该目的常用的材料。OLED材料提供了高亮度和高效率,并且为较低成本的材料。
在本发明的示例性显示结构形成有两部分:显示模块和电路模块。这两部分单独地制造然后结合在一起形成完整的拼接显示器。显示模块由其上淀积有透明列电极的透明玻璃层组成。OLED材料淀积在这些层上作为有源(即,发光)介质。淀积行电极作为最终的显示层。提供如保护或钝化层等的附加层以提高显示层的功能或寿命。透明电极优选空穴注入电极,其它电极优选电子注入电极。电极之间的OLED材料优选由厚膜工艺施加的共轭聚合物材料,然而此外也可以通过各种薄膜淀积技术施加小分子材料。构图各层在一个或多个点处形成到每个行和列的电通路。
代替OLED材料,拼接显示器的像素形成元件可以为多种发光器件中的任何一种,例如电致发光元件、发光二极管、场致发射元件、等离子体元件或阴极射线致发光元件。
通过穿过电路板冲出通孔或钻出通孔然后在电路板上印刷或淀积导电条形成电路模块。形成导电条使用的导电膜或膏也填充通孔。当电路模块和显示模块接合在一起形成拼接显示器时,通路接触显示模块的行和列电极。
一个示例性拼接显示器结构由作为基板的多层陶瓷电路板132构成,在其上显示材料安装在观看面上,而用于驱动或其它功能的电子器件134大部分安装在背面上。导体元件132印刷在各层上,以提供电子器件和显示材料之间的互连,通路互连不同层中的导体;连接器提供在背面以连接到外部电源和信号源。拼接显示器结构也具有如高熔点金属或绝缘体等的结构层,以在陶瓷材料的处理期间防止变形,和/或显示器的操作期间进行热管理。拼接显示器结构还包含观看面上的透明层(例如,浮法玻璃)以保护或容纳显示材料。可以提供背板结构以安装各拼接显示器,并提供与各拼接显示器结构需要的电源和驱动信号的电连接。
多层陶瓷电路板130由多层陶瓷材料形成。首先形成各层并处理形成通孔、导体以及其它结构,然后叠置地组装,小心地对准每一层,使其它层与之相邻。这里的陶瓷材料广义上包括陶瓷、玻璃陶瓷、玻璃、以及其它高温绝缘材料。多层与连接器和通路一起为电路板提供基本功能。在电路板上可以放置有源或无源电子元件和电路。
导体132可以为由任何一种标准工艺形成的薄和/或厚膜导体,所述标准工艺包括例如镀敷、蒸发、溅射、印刷以及叠置。材料可以是金属或有机导体。可以通过包括例如印刷或石版印刷等的工艺构图。这些导体图形形成在公开的结构中的各层的表面上并连接到通路,根据器件的设计,提供从公开的结构上和以外的电子器件到显示材料的互连装置。
另一种导体用于互连各层。这些导体称作通路。为广义上使用的通路,包括穿过层中的开口并环绕在层(各层)的边缘的导体。例如可以通过在层中形成孔并用导体填充孔形成穿过层的通路。此外,预先形成的物理导体可以嵌入在层中。可以通过实际地设置布线(圆的或平坦的),或布线的阵列,并线粘附端部到要互连的表面。此外可以通过用于厚或薄膜导体的镀敷或其它制造工艺在适当的位置形成它们。
芯层可以包括在所述结构中。该层通常具有比陶瓷材料高的软化点,并作为用于组装和处理陶瓷材料的基板。芯层可以:消除水平收缩;建立多层系统的单膨胀系数,以及为多层组件提供机械强度。如果层为良好的电导体,那么它还可以提供RF屏蔽。如果层也是良好的导热体,那么它有助于显示器的热管理。然而导电层存在通孔连接的特殊问题。穿过金属层的通孔连接可以用几种方式制成:在使金属导体穿过中间之前用绝缘材料填充孔的周边,或仅使导体穿过中间留出空间以隔开来自导电金属芯层的导体。
形成图像处理和像素驱动电路的电子器件安装在层上。使用的电子器件广义上包括安装在各层上的有源和无源以及分立器件,以及通过例如如今在高温基板上制造用于显示器的有源矩阵电路使用的工艺原位地形成的器件。虽然这些电子器件可以放置在任何地方,但最常见的位置是背面。这样可以使用标准的组装和连接设备和工艺。此外,在插入层或观看面上设置有源或无源器件能够使系统设计具有更大的灵活性。
显示材料提供到观看者可以看到的表面上。由于公开的结构设计的灵活性,因此可以使用不同的显示材料。
需要仔细地形成拼接显示器的边缘,以确保拼接显示器具有难以看出的拼接显示器之间的接缝。拼接显示器的一个评判标准是由拼接显示器接缝隔开的像素之间的间距与拼接显示器上像素的间距相同。要满足该标准,拼接显示器边缘需要尺寸上精确。此外,如果边缘也用做导体或如果竖框用于结合相邻的拼接显示器,那么需要在拼接显示器的设计和布局中计算这些导体或竖框的厚度。
提供背板用于拼接显示器的物理安装和互连以形成显示器。进行拼接显示器的安装以使显示器上的像素间距连续。拼接显示器的形状最常见的为方形或矩形,然而形状可以是可以拼接的任何形状以形成较大的显示器。此外,拼接显示器通常为平坦的,但也可以沿一维或两维弯曲以形成弯曲或拱形显示器。也可以使用安装在弯曲的或拱形背板上的平坦拼接显示器制成弯曲或拱形显示器。可以通过入焊接等的固定连接或使用允许拼接显示器插入在背板内的连接器将拼接显示器装到背板上。所述后一方法能够修理和更换各拼接显示器。不同类型的拼接显示器可以装到不同区域的背板上,例如较高清晰度的区域可以放置在大显示器的中心或其它区域。此外,不同尺寸或不同形状的拼接显示器可以组合成一个显示器。例如,大背板边缘附近的拼接显示器可以较大,比背板中心附近的拼接显示器的像素密度低。
背板也可以提供用于将拼接显示器连接到工作电源和操作拼接显示器需要的数据信号的装置。匹配连接器提供在拼接显示器和背板上以提供所述连接。当连接数据信号时,可以使用光学连接代替物理连接。
背板的电结构用于到拼接显示器的电源和信号的分配,拼接显示器的电结构用于显示像素的寻址。介绍了结构的两级。拼接显示器的信息需要随按像素的总数计量的显示器尺寸的增加而增加。拼接显示器上的像素数量越多,说明存储在拼接显示器上的数据量越大并且信息的传递速率越高。
如果背板由浮法玻璃形成,那么它易于断裂,并且在高温下会受到压缩以及尺寸会改变。对于机械强度,浮法玻璃背板经常制得很厚,导致背板较重。在示例性实施例中,背板由膨胀系数基本上类似于前板膨胀系数的金属构成。金属背板提供了改善的机械强度、高温处理期间的稳定性、以及如果使用薄层重量较轻。
在具有由浮法玻璃构成的前板的示例性实施例中,背板可以由钛或钛合金构成。使用例如LTCC-M技术在金属背板上形成物理和电结构。使用薄膜(通过物理掩模或光刻掩模的蒸发/溅射)、厚膜(丝网印刷、喷墨印刷)以及层压法在背板上形成包括介质、导体、肋状突起和隔离物。
拼接显示器的一个优点是扫描电子器件在拼接显示器内,并且任何一个拼接显示器的扫描速率与小显示器或大显示器的相同。这可确保显示器的亮度和灰度等级不会随着尺寸的增加而变差。详细介绍的拼接显示器具有即使在拼接显示器的边缘将信号连接到像素同时不会中断像素间距连续性的结构。公开的拼接显示器还具有信号处理电路,该电路从广播信息信号中提取出用于该拼接显示器的信号信息并将提取的信息转变为寻址该拼接显示器需要的信号。
一般来说,前到背的连接包括拼接显示器上用于每个像素行的连接和用于每个像素列的连接。拼接显示器具有相对较少的像素,由此每个拼接显示器的互连数量也相对较少,并且各拼接显示器的成品率可以变高。与单个基板的大显示器的制造相比,这是拼接显示器的重要优点。通常,成品率为显示器件中像素数量的函数。
到行或列的最终连接用由拼接显示器的背面延伸的通路制成。所述通路的直径小于像素的间距。为此,显示层中的部分通路制成小于穿过其它插入层的通路,如下所述,在拼接显示器的区域上连接可以交错以提供较宽互连之间最大的间距。这些连接为到像素的显示信号分配的最终连接。
图3示出了示例性显示结构的分解透视图。拼接显示器结构形成有两部分:显示模块和电路模块。
显示模块包括可以为例如浮法玻璃板的透明前板320。使用公知的工艺淀积如氧化铟锡(ITO)等的透明导体的薄带在前板320上形成透明列电极322。红、绿和蓝OLED材料或其它显示材料324和326淀积在列电极的顶部以定义出像素的有效区域。如下面参考图5所述,希望显示材料324和326仅占据部分(例如,约25%)像素区域。然后在OLED材料上形成电子注入电极(例如,钙)。行电极328形成在显示材料324和326的顶部。可以使用标准的淀积技术由例如多晶硅或如铝等的金属形成行电极328。绝缘层330形成在行电极328的顶部。示例性绝缘层330可以由多种绝缘材料形成。要保护显示材料,需要使用低温工艺形成绝缘层330。示例性材料包括聚酰亚胺或其它低温无机材料形成。可以使用厚膜或薄膜淀积技术施加绝缘层330。绝缘层330包括与行电极328或列电极322对准的多个开口331。
在绝缘层330的顶部淀积多个连接板332。可以使用例如汽相淀积的铝或金属油墨(metallic ink)或膏,例如使用厚膜工艺淀积的与溶剂结合的银形成板332。如下面参考图5和6介绍的,连接板通过延伸穿过绝缘材料中的开口的通路连接到列电极322和行电极328。每个示例性连接板仅电接触一个行电极328或一个列电极322。然而,要确保制成良好的连接,每个连接板332在几个位置连接到它的对应行或列电极328,322。
电路模块312包括图像处理和显示器驱动电路134(见图2);电路板130,例如可以是氧化铝(Al2O3)的薄板;淀积的电导体132;以及连接焊盘334和穿过电路板130将导体132电连接到连接焊盘334的通路338。可以使用厚膜淀积工艺施加金属油墨或膏形成导体132、通路338以及连接焊盘334。连接焊盘334也可以由汽相淀积的铝形成。存在电路模块的连接焊盘334和显示模块的连接板322之间的一一对应关系。在根据本发明的示例性实施例中,如下面参考图7所述,通过在显示模块和电路模块之间施加各向异性导电粘合剂电连接连接焊盘334和连接板332。组合的显示模块和电路模块形成拼接显示器120。
然而可以预料也可以使用其它方法将连接焊盘电连接到它们各自的连接板。例如,连接板332和连接焊盘334由可变形的材料制成,并构图以包括在焊盘或板的平面上延伸的那部分。当电路模块与显示模块联接时,连接板332和连接焊盘334上构图的材料接触并变形,形成对应的连接焊盘和板之间的电连接。所述变形也调节了会使间距不均匀和显示器不能使用的如硬颗粒等的缺陷。当电路模块312联接到对应的显示模块310时,也可以通过突点键合技术或使用植入焊盘334和板332内的线连接焊盘334和板332并接合板332和焊盘334。
图4为部分电路模块312的分解透视图。该图清楚地示出了电路模块的电连接结构。电路板130包括多个开口410,每个开口对应于各连接焊盘334。通路338形成在开口410内,同时连接焊盘334形成在电路板130的前表面412上。导电体132形成在电路板130的背面414以将图像处理和显示驱动电路134(参见图2)连接到各连接焊盘334。
图5示出了适合于例如图3所示拼接显示器使用的像素布局。图5示出了4个拼接显示器510、520、530、540的一部分。在图5所示的布局中,像素的有效部分526集中在它们各自的像素区域528。行电极(参见图3)和列电极(参见图3)可以分别通过导体522和
524连接到电路模块上对应的通路。
图6示出了根据本发明的电子显示结构的显示模块的一部分的俯视图。图6A和6B为分别沿图6的线A-A和B-B截取的剖面图,示出了根据本发明的示例性像素密封机构。
如ITO的透明列电极322形成在前板320上。形成在列电极322上的显示材料324定义了像素的有效部分526。如图6A和6B所示,然后如SiO2的绝缘体602淀积在显示材料324的端部。然后行电极328形成在显示材料324和绝缘体602上。绝缘体602能使行电极328形成得较宽足以完整地封闭显示材料而不会使行电极328与列电极322短路。由此,显示材料由行电极328、绝缘体602、列电极322、或者前板320封闭。所述封闭密封了显示材料324,有助于防止显示材料暴露到包括氧气和水蒸气的环境中,使更多的可预测性能寿命更长。在本发明的另一示例性实施例中,绝缘体602覆盖显示材料324,行电极328通过形成在绝缘体602中的通路(未示出)接触显示材料324。
图6示出了将行电极和列电极分别连接到电路模块的导体522和524的示例性位置。在图6B中,显示的导体522形成在相邻像素之间的行导体328上。图6B中显示的导体522为导电突点。
图6C为沿图6的线B-B截取的剖面图,示出了形成在行电极328、列电极322和显示材料324上的绝缘焊盘612。导体522形成在绝缘焊盘612的开口中。
图7为电子显示结构(拼接显示器)700的剖面图,示出了根据本发明的区域密封的示例性实施例和边缘密封的示例性实施例。虽然图7中介绍的示例性密封机构涉及底部发光的OLED显示,但本领域中的技术人员应该知道,本发明的教导通常可以适用于其它的显示技术。
拼接显示器700包括显示模块704和电路模块702,每个由多层组成。显示模块704由有源显示材料708淀积其上的玻璃基板706组成,有源显示材料包括透明空穴注入电极(例如,ITO)、OLED材料、电子注入电极(例如钙)以及接触层710。光由OLED材料发出并穿过透明电极和玻璃基板706射出显示器结构700(由于光穿过OLED材料的基板射出,所以这称作底部发射结构)。电路模块702由具有匹配显示模块704的接触层710的接触层714的绝缘基板712以及将这些接触714连接到绝缘基板712的相对表面的导体和连接到集成电路134的电通路716组成。
电路模块702同时作为密封显示结构700的阻挡层、显示结构700的背面基板以及作为电路板。电路模块702和显示模块704通过结合在一起形成显示结构700。
在所述示例性实施例中,电路模块702和显示模块704通过封闭显示模块704的行电极、列电极和部分显示材料连接在一起。通过施加如环氧树脂等的粘合剂形成区域密封。可以液体或膏的形式施加粘合剂,但也可以预制的板或粉的形式提供。施加密封/接触材料的工艺的例子包括印刷(丝网印刷、喷墨、接触、滚压等);由注射器或类似的分散器分散;刮刀涂敷或毛细作用引入。实际的机械粘合由密封材料的粘合性质产生。激活粘附性的工艺例子包括催化剂、加热、或电磁能、或者可以使用如超声焊和压力等的物理工艺。
在另一示例性实施例中,区域密封包括封闭多个行电极、多个列电极、以及显示材料多个部分的各向异性导电结构,同时将多个行和列电极的每一个耦合连接到各通路716。
在一个示例性实施例中,区域密封和/或各向异性导电结构基本上为黑色。形成区域密封或各向异性导电结构使用的粘合剂通常不是黑色的。可以通过添加黑颜料或染料将这些材料制成黑色。碳黑为合适的黑颜料的一个例子。如果碳黑添加的浓度太高,它将使密封材料导电并影响接触。由0.1%到10%(以重量计)的浓度可以有效地吸收光,但会使密封材料导电。黑色有机染料不会增加导电性。以使密封材料成为良好的吸光剂的浓度添加它们。
由于电子注入电极位于观察者和黑密封材料之间,因此黑密封材料不会吸收由电极反射的光。因此,希望减少由这些电极反射的光。透明空穴注入电极没有问题是由于它们不会很强地发射光。然而,电子注入电极通常由如Ca、Mg和/或Al等的反射性金属制成。通过减小它们的面积或者通过将观察者侧的这些电极涂黑可以减小这些电极的反射。减小它们的面积同时增大了能够吸收环境光的黑材料的面积。通过首先在以后将淀积金属电极的所有区域中淀积黑涂层进行观察者侧电子注入电极的涂黑。
密封和同时密封各向异性导电结构,在一个方向导电而在另一方向中为相对的绝缘体。各向异性导电结构在由电路模块702的接触层714到显示模块704的对应接触层710的方向中导通。
显示在图7中的接触层714形成为突点,接触层710显示为接触焊盘。适用包括以下介绍的多种导电和密封机构的组合形成各向异性导电结构。
对于图3中所示的显示结构,行和列电极通过绝缘层330连接到连接板332。由集成电路134提供的信号线通过通路连接到连接焊盘334。根据本发明可以使用各向异性导电结构(ACS)连接图3的显示模块310和电路模块312。
在示例性实施例中,ACS包括密封同时在从每个连接板332到它的对应连接焊盘334的方向中导电的各向异性的导电粘合剂。各向异性的导电粘合剂的用途和组分介绍在Yamada等人的“Components andMaterials for Liquid Crystal Display(LCD)(液晶显示器的组份和材料)”中,由Sony Chemical Corporation作为营销技术出版物出版,这里参考它对各向异性的导电粘合剂的介绍引入。结合显示和电路板各层使用的材料可以由环氧树脂、其它的两部分加热或光可固化粘合剂、湿气催化的粘合剂以及热固或热塑聚合物制成。材料可以装有导电添加剂,例如导电颗粒、带导电涂层的颗粒、导电细丝、导电薄片、以及磁性的导电细丝和薄片。通过进行不对称单元工艺使这些密封/导体材料得到不对称的电性质。获得不对称导电性的不对称工艺的例子包括施加压力、材料流动、电场或磁场对准、以及电迁移。
在示例性实施例中,ACS包括形成在一个或两个连接板332上的突点和它们对应的连接焊盘334,以提高板332和焊盘334之间的导电性。使用多个突点用于冗余并进一步提高导电性。当密封显示模块310和电路模块312时形成突点,对应的突点接触。此外,突点有延展性,当接触以进一步提高它们之间的导电性时压缩突点,并且可以不对准。此外,粘合剂不导电,通过突点进行电连接。
本领域中的技术人员应该知道,不使用图3的绝缘层330和接触焊盘和板332、334也可以适用本发明的教导。ACS直接地将每个行和列电极连接到电路模块上的对应接触。例如,可以使用各向异性的导电粘合剂制成电路模块上的通路和行或列电极上内像素位置之间的接触。在示例性实施例中,使用图5所示的突点接触522制成接触。在另一示例性实施例中,ACS包括形成在接触点轻微涂敷的导电粘合剂,周围区域由不导电或各向异性的导电粘合剂填充。
本发明提供了改进的电子显示结构。而不是制造电接触的单独步骤和独立地密封结构,以上介绍的ACS能够同时密封和导电。这改进了制造工艺和制成的显示结构。通过用于封闭显示材料的区域密封改善显示结构。此外,包含在ACS中的粘合剂选择为有弹性以补偿电路模块和显示模块之间的热膨胀差异。
图7中的显示结构700还包括边缘密封或带形密封716。带形密封716由显示模块跨越到电路模块并在电路和显示模块周围延伸。显示结构700还包括形成在带形密封端部上的掩蔽层,其中掩蔽层用于通过玻璃基板706观看显示结构时隐藏带形密封。图7A示出了相邻的电子显示结构700,每个有一个带形密封716和一个掩蔽层718,掩蔽层形成在它们的玻璃基板706上以隐藏带形密封716。在一个示例性实施例中,带形密封716由金属、玻璃和聚合物(例如Kapton)中的一个构成。
图8为根据本发明具有珠状封接802的电子显示结构800。珠状封接802形成在电路模块和显示模块之间的显示结构800的周边周围。在一个示例性实施例中,掩蔽层804在至少珠状封接802上与电路模块相对地形成,或形成在显示模块的玻璃基板806的前或背面上。
当从基板的前面808观察显示结构时,掩蔽层804用于隐藏珠状封接。显示在图8中的掩蔽层形成在玻璃基板806的前面808上。在一个示例性实施例中,玻璃基板806的厚度小于相邻像素之间的间隙。在一个示例性实施例中,珠状封接802的宽度小于显示结构800的相邻像素之间间隙的至少一半,由此相邻显示结构800之间的接缝的可见度降低。在一个示例性实施例中,珠状封接为黑色。
在一个示例性实施例中,在显示模块800的整个周边,珠状封接806基本上均匀。根据本发明这是可能的,是由于不需要通过珠状封接进行电连接并且由于它们可以穿过拼接显示器导通到电路模块背面上的驱动电路。
如图9所示,与以上介绍的密封方法结合,可以使用显示密封密封包括拼接显示器910的整个显示器。显示密封包括前板902、背板904以及其间的密封906。确定拼接显示器910的方向使拼接显示器902的前玻璃与显示密封的前板902相邻。根据本发明,每个拼接显示器包括电路以提供驱动它的各像素的信号。由此,除了提供显示密封内来自拼接显示器到显示密封外的信号源的信号路径之外,显示密封不需要提供任何电路。
根据本发明的不同的密封机构可以独立或组合地应用。例如,像素密封结构、区域密封机构、以及边缘密封机构可以组合在一个电子显示结构中。这提供了另一优点:减少了对坚固的珠状封接的需要,使拼接显示器的边缘制得很小,由此可以视觉上看不见接缝地接合拼接显示器。
虽然以上参考某些特定的实施例进行了说明和介绍,但本发明不仅局限在示出的细节。而是可以在权利要求书的等效范围内对细节进行各种修改并且不脱离本发明的精神。
Claims (1)
1、一种电子显示结构,包括:
显示模块,该显示模块包括:
多个列电极,以及
显示材料的多个部分,每个具有连接到所述多个列电极其中之一的第一侧和一第二侧,
多个行电极,连接到所述显示材料的多个部分的每一个,以及密封装置,用于密封所述显示材料的多个部分的每一个。
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US7492298P | 1998-02-17 | 1998-02-17 | |
US60/074,922 | 1998-02-17 | ||
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102396019A (zh) * | 2009-02-18 | 2012-03-28 | 全球Oled科技有限责任公司 | 具有小芯片驱动器的显示装置 |
CN103339667A (zh) * | 2011-01-31 | 2013-10-02 | 全球Oled科技有限责任公司 | 对图像信号进行安全解压缩的显示器 |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6897855B1 (en) * | 1998-02-17 | 2005-05-24 | Sarnoff Corporation | Tiled electronic display structure |
JP2002512434A (ja) * | 1998-04-22 | 2002-04-23 | ケンブリッジ コンサルタンツ リミテッド | 電界発光素子 |
US8009348B2 (en) * | 1999-05-03 | 2011-08-30 | E Ink Corporation | Machine-readable displays |
US7119759B2 (en) * | 1999-05-03 | 2006-10-10 | E Ink Corporation | Machine-readable displays |
EP1196814A1 (en) * | 1999-07-21 | 2002-04-17 | E Ink Corporation | Use of a storage capacitor to enhance the performance of an active matrix driven electronic display |
US6624570B1 (en) * | 1999-09-29 | 2003-09-23 | Sanyo Electric Co., Ltd. | Electroluminescent display device and method for its fabrication |
TW465122B (en) | 1999-12-15 | 2001-11-21 | Semiconductor Energy Lab | Light-emitting device |
US6566808B1 (en) * | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
US7576496B2 (en) * | 1999-12-22 | 2009-08-18 | General Electric Company | AC powered OLED device |
JP4214660B2 (ja) * | 2000-04-11 | 2009-01-28 | ソニー株式会社 | 直視型表示装置 |
US7053874B2 (en) | 2000-09-08 | 2006-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and driving method thereof |
KR100388271B1 (ko) * | 2000-10-14 | 2003-06-19 | 삼성에스디아이 주식회사 | 유기전계발광소자 및 그 제조방법 |
US6683665B1 (en) | 2000-11-20 | 2004-01-27 | Sarnoff Corporation | Tiled electronic display structure and method for modular repair thereof |
US6621168B2 (en) | 2000-12-28 | 2003-09-16 | Intel Corporation | Interconnected circuit board assembly and system |
US7075112B2 (en) | 2001-01-31 | 2006-07-11 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US6639360B2 (en) * | 2001-01-31 | 2003-10-28 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
GB2371910A (en) | 2001-01-31 | 2002-08-07 | Seiko Epson Corp | Display devices |
US6853411B2 (en) * | 2001-02-20 | 2005-02-08 | Eastman Kodak Company | Light-producing high aperture ratio display having aligned tiles |
US6509941B2 (en) * | 2001-03-22 | 2003-01-21 | Eastman Kodak Company | Light-producing display having high aperture ratio pixels |
GB0107236D0 (en) * | 2001-03-22 | 2001-05-16 | Microemissive Displays Ltd | Method of creating an electroluminescent device |
US6940501B2 (en) * | 2001-03-28 | 2005-09-06 | Intel Corporation | Tiled display |
US6870519B2 (en) * | 2001-03-28 | 2005-03-22 | Intel Corporation | Methods for tiling multiple display elements to form a single display |
US20020163301A1 (en) * | 2001-05-02 | 2002-11-07 | Morley Roland M. | Large format emissive display |
US6548961B2 (en) * | 2001-06-22 | 2003-04-15 | International Business Machines Corporation | Organic light emitting devices |
JP2004533022A (ja) * | 2001-06-22 | 2004-10-28 | インターナショナル・ビジネス・マシーンズ・コーポレーション | パッシブ駆動マトリクス・ディスプレイ |
US6600144B2 (en) | 2001-07-12 | 2003-07-29 | Intel Corporation | Reducing the visibility of seams of modular displays |
US6873380B2 (en) | 2001-07-12 | 2005-03-29 | Intel Corporation | Providing optical elements over emissive displays |
US6967640B2 (en) * | 2001-07-27 | 2005-11-22 | E Ink Corporation | Microencapsulated electrophoretic display with integrated driver |
US6822256B2 (en) * | 2001-09-18 | 2004-11-23 | Intel Corporation | Forming organic light emitting device displays |
US6677918B2 (en) * | 2001-09-21 | 2004-01-13 | Yuji Yuhara | Light emitting diode display system |
US6822389B2 (en) | 2001-10-11 | 2004-11-23 | Intel Corporation | Array display including resilient material in the seam |
AU2002351047A1 (en) * | 2001-12-17 | 2003-06-30 | Koninklijke Philips Electronics N.V. | Tiled flat panel display, method of manufacturing the same, and sub-display for use in such a display, and method of driving such a display |
KR100634109B1 (ko) * | 2001-12-18 | 2006-10-17 | 세이코 엡슨 가부시키가이샤 | 발광 장치, 그 제조 방법, 전기 광학 장치, 및 전자 기기 |
US6950220B2 (en) * | 2002-03-18 | 2005-09-27 | E Ink Corporation | Electro-optic displays, and methods for driving same |
US6861792B2 (en) * | 2002-03-29 | 2005-03-01 | Sony Corporation | Color separator for emissive display |
US6777861B2 (en) * | 2002-03-29 | 2004-08-17 | Sony Corporation | Color selector for emissive image display apparatus |
US6947198B2 (en) * | 2002-03-29 | 2005-09-20 | Sony Corporation | Emissive image display apparatus |
US20030184531A1 (en) * | 2002-03-29 | 2003-10-02 | Sony Corporation | GLV engine for image display |
US6788354B2 (en) | 2002-04-01 | 2004-09-07 | Sony Corporation | Method for making color separator for emissive display |
US6849935B2 (en) * | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
US7592276B2 (en) * | 2002-05-10 | 2009-09-22 | Sarnoff Corporation | Woven electronic textile, yarn and article |
US6914379B2 (en) * | 2002-05-10 | 2005-07-05 | Sarnoff Corporation | Thermal management in electronic displays |
USRE41914E1 (en) | 2002-05-10 | 2010-11-09 | Ponnusamy Palanisamy | Thermal management in electronic displays |
US7649674B2 (en) * | 2002-06-10 | 2010-01-19 | E Ink Corporation | Electro-optic display with edge seal |
US6881946B2 (en) | 2002-06-19 | 2005-04-19 | Eastman Kodak Company | Tiled electro-optic imaging device |
KR100851470B1 (ko) * | 2002-12-05 | 2008-08-08 | 오리온피디피주식회사 | 플라즈마 디스플레이 패널 및 이를 이용한 멀티디스플레이패널 |
US6866678B2 (en) * | 2002-12-10 | 2005-03-15 | Interbational Technology Center | Phototherapeutic treatment methods and apparatus |
US7344901B2 (en) * | 2003-04-16 | 2008-03-18 | Corning Incorporated | Hermetically sealed package and method of fabricating of a hermetically sealed package |
US20040206953A1 (en) * | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
EP1469450A1 (en) * | 2003-04-18 | 2004-10-20 | Barco N.V. | Organic light-emitting diode display assembly for use in a large-screen display |
PL1620843T3 (pl) * | 2003-04-21 | 2016-01-29 | Philips Lighting North America Corp | Sposoby i systemy oświetlenia płytkowego |
WO2005004544A1 (en) * | 2003-07-07 | 2005-01-13 | Ifire Technology Corp. | Seal and sealing process for electroluminescent displays |
EP1513059A1 (en) * | 2003-09-08 | 2005-03-09 | Barco N.V. | A pixel module for use in a large-area display |
US7324071B2 (en) * | 2003-09-16 | 2008-01-29 | Sarnoff Corporation | Segmented character display |
US6999138B2 (en) * | 2004-02-24 | 2006-02-14 | Eastman Kodak Company | Tiled display comprising faceplate and displays with at least one defective pixel and method of manufacturing said tiled display |
US8522494B2 (en) * | 2004-03-11 | 2013-09-03 | Barco, Inc. | System for creating a tensioned wall composed of individual LED tiles |
US20070218751A1 (en) * | 2004-03-11 | 2007-09-20 | Element Labs, Inc. | Mounting system for light tiles attached to tensioned cables |
TWM265875U (en) * | 2004-10-07 | 2005-05-21 | Hannspree Inc | Display device |
US7408296B2 (en) * | 2004-11-24 | 2008-08-05 | Eastman Kodak Company | Tiled OLED display |
EP1684366A1 (en) * | 2005-01-25 | 2006-07-26 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Electronic device comprising an electronic component and encapsulation members |
WO2007002452A2 (en) * | 2005-06-23 | 2007-01-04 | E Ink Corporation | Edge seals and processes for electro-optic displays |
US7880113B2 (en) * | 2005-12-01 | 2011-02-01 | Delphi Technologies, Inc. | Plasma discharge method and structure for verifying a hermetical seal |
US7597603B2 (en) * | 2005-12-06 | 2009-10-06 | Corning Incorporated | Method of encapsulating a display element |
US7537504B2 (en) * | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
US8610988B2 (en) | 2006-03-09 | 2013-12-17 | E Ink Corporation | Electro-optic display with edge seal |
US20080124558A1 (en) * | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
KR100812023B1 (ko) | 2006-08-23 | 2008-03-10 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 모기판 |
KR100732819B1 (ko) * | 2006-08-30 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그의 모기판 |
US20080121899A1 (en) * | 2006-11-07 | 2008-05-29 | World Properties, Inc. | Transparent electrode for LED array |
DE102007023066B4 (de) * | 2007-05-16 | 2015-09-10 | Continental Automotive Gmbh | Kombiinstrument |
US8448468B2 (en) | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
DE102008052916A1 (de) * | 2008-10-23 | 2010-04-29 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Bildsensor |
US9148497B2 (en) * | 2009-04-22 | 2015-09-29 | Nokia Technologies Oy | Display with improved electromagnetic compatibility characteristics |
US8232718B2 (en) * | 2009-04-30 | 2012-07-31 | Global Oled Technology Llc | Tiled electroluminescent device with filled gaps |
US8753711B2 (en) * | 2009-12-18 | 2014-06-17 | General Electric Company | Edge sealing method using barrier coatings |
US8710732B2 (en) * | 2009-12-22 | 2014-04-29 | General Electric Company | Organic light emitting device connection methods |
KR101397109B1 (ko) * | 2010-04-13 | 2014-05-19 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 그 제조 방법 |
US8618731B2 (en) * | 2010-05-18 | 2013-12-31 | General Electric Company | Large-area flexible OLED light source |
EP2601694A1 (en) * | 2010-08-05 | 2013-06-12 | Koninklijke Philips Electronics N.V. | Organic electroluminescent device |
KR101846321B1 (ko) * | 2011-10-25 | 2018-04-09 | 엘지이노텍 주식회사 | 폴리에스테르-나노복합체 기판을 포함하는 배리어 필름 및 이를 구비한 플렉시블 디스플레이 |
JP6039905B2 (ja) * | 2012-02-14 | 2016-12-07 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法 |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
AU2014200754A1 (en) * | 2013-03-08 | 2014-09-25 | Samsung Electronics Co., Ltd. | Display apparatus and control method thereof |
JPWO2015011758A1 (ja) * | 2013-07-22 | 2017-03-02 | 株式会社東芝 | 表示システム |
US9383960B2 (en) | 2013-11-12 | 2016-07-05 | Kabushiki Kaisha Toshiba | Video display device, display control method |
CN103680337A (zh) * | 2013-11-15 | 2014-03-26 | 北京维信诺科技有限公司 | 一种pmoled拼接屏体结构 |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
US10211443B2 (en) | 2014-09-10 | 2019-02-19 | Cellink Corporation | Battery interconnects |
US9147875B1 (en) | 2014-09-10 | 2015-09-29 | Cellink Corporation | Interconnect for battery packs |
US9557954B2 (en) | 2014-12-23 | 2017-01-31 | X Development Llc | Display panel using direct emission pixel arrays |
WO2016126890A1 (en) * | 2015-02-03 | 2016-08-11 | Cellink Corporation | Systems and methods for combined thermal and electrical energy transfer |
DE102016103324A1 (de) | 2016-02-25 | 2017-08-31 | Osram Opto Semiconductors Gmbh | Videowand-Modul und Verfahren zum Herstellen eines Videowand-Moduls |
JP2019045606A (ja) * | 2017-08-31 | 2019-03-22 | 京セラ株式会社 | 発光素子基板の検査方法および発光素子基板 |
CN107688724B (zh) * | 2017-09-30 | 2024-05-14 | 中国电子科技集团公司第四十三研究所 | 一种小尺寸ltcc基板版图排布结构 |
TWI732089B (zh) * | 2018-01-15 | 2021-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
DE102018105884A1 (de) * | 2018-03-14 | 2019-09-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement mit einer vielzahl licht emittierender bereiche und verfahren zur herstellung des optoelektronischen bauelements |
KR102554733B1 (ko) * | 2018-07-31 | 2023-07-13 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조 방법 |
KR102620974B1 (ko) | 2018-10-05 | 2024-01-05 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조 방법 |
JP2024512188A (ja) | 2021-03-24 | 2024-03-19 | セルリンク コーポレーション | 多層フレキシブルバッテリー相互接続及びその製造方法 |
CN113643621A (zh) * | 2021-07-22 | 2021-11-12 | 惠州华星光电显示有限公司 | 发光二极管面板及拼接面板 |
CN118266063A (zh) * | 2021-12-23 | 2024-06-28 | 维耶尔公司 | 无缝平铺 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5190299A (zh) * | 1975-02-05 | 1976-08-07 | ||
US4204205A (en) | 1975-02-05 | 1980-05-20 | Kabushiki Kaisha Daini Seikosha | Electronic display device |
GB1509478A (en) * | 1976-12-10 | 1978-05-04 | Ibm | Flat panel display device |
US4490647A (en) * | 1982-11-29 | 1984-12-25 | Burroughs Corporation | Gas-filled dot matrix display panel |
JPS62112891A (ja) * | 1985-11-12 | 1987-05-23 | ミクストン株式会社 | 回転昇降扉 |
JPH0447920Y2 (zh) * | 1986-01-09 | 1992-11-11 | ||
JP2765140B2 (ja) * | 1989-12-22 | 1998-06-11 | 三菱電機株式会社 | 液晶ディスプレイ装置 |
JPH03203193A (ja) * | 1989-12-29 | 1991-09-04 | Sharp Corp | 薄膜elパネル |
JP3016808B2 (ja) * | 1990-02-06 | 2000-03-06 | パイオニア株式会社 | 電界発光素子及びその製造方法 |
JPH0572545A (ja) * | 1991-09-17 | 1993-03-26 | Seiko Epson Corp | 液晶パネルの実装構造 |
JPH0770289B2 (ja) * | 1991-11-29 | 1995-07-31 | 株式会社ティーティーティー | 表示用放電管 |
EP0560072A3 (en) | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropic electrically conductive adhesive film and connection structure using the same |
JPH05258790A (ja) * | 1992-03-13 | 1993-10-08 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造 |
JPH05258789A (ja) * | 1992-03-13 | 1993-10-08 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造 |
KR100356973B1 (ko) * | 1994-01-01 | 2003-01-24 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 액정디스플레이장치및복수의액정디스플레이장치제조방법 |
JP3813217B2 (ja) * | 1995-03-13 | 2006-08-23 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルの製造方法 |
KR960704251A (ko) * | 1994-06-30 | 1996-08-31 | 이데이 노부유키 | 플라즈마어드레스 액정표시장치 |
JP3135793B2 (ja) * | 1994-09-02 | 2001-02-19 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
TW347479B (en) * | 1994-12-15 | 1998-12-11 | Sharp Kk | Liquid crystal display panel and liquid crystal display apparatus |
JPH08213169A (ja) * | 1995-02-01 | 1996-08-20 | Fuji Electric Co Ltd | 薄膜電場発光素子 |
EP0809420B1 (en) * | 1995-02-06 | 2002-09-04 | Idemitsu Kosan Company Limited | Multi-color light emission apparatus and method for production thereof |
JP3401356B2 (ja) * | 1995-02-21 | 2003-04-28 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
US5585695A (en) | 1995-06-02 | 1996-12-17 | Adrian Kitai | Thin film electroluminescent display module |
US5644327A (en) * | 1995-06-07 | 1997-07-01 | David Sarnoff Research Center, Inc. | Tessellated electroluminescent display having a multilayer ceramic substrate |
JPH09120062A (ja) * | 1995-08-18 | 1997-05-06 | Toshiba Electron Eng Corp | カラーフィルタ基板及びその製造方法、それを用いた液晶表示素子及びその製造方法 |
US5697825A (en) | 1995-09-29 | 1997-12-16 | Micron Display Technology, Inc. | Method for evacuating and sealing field emission displays |
US5889568A (en) * | 1995-12-12 | 1999-03-30 | Rainbow Displays Inc. | Tiled flat panel displays |
JPH09181491A (ja) * | 1995-12-27 | 1997-07-11 | Toshiba Corp | 半導体装置の実装方法及び実装構造 |
JP3343642B2 (ja) * | 1996-04-26 | 2002-11-11 | シャープ株式会社 | テープキャリアパッケージ及び液晶表示装置 |
US5827102A (en) | 1996-05-13 | 1998-10-27 | Micron Technology, Inc. | Low temperature method for evacuating and sealing field emission displays |
US5867236A (en) | 1996-05-21 | 1999-02-02 | Rainbow Displays, Inc. | Construction and sealing of tiled, flat-panel displays |
US5703394A (en) | 1996-06-10 | 1997-12-30 | Motorola | Integrated electro-optical package |
US5781258A (en) | 1996-06-13 | 1998-07-14 | Rainbow Displays, Inc. | Assembling and sealing large, hermetic and semi-hermetic, h-tiled, flat-paneled displays |
JPH10153785A (ja) * | 1996-09-26 | 1998-06-09 | Toshiba Corp | 液晶表示装置 |
JP3361947B2 (ja) * | 1997-01-30 | 2003-01-07 | シャープ株式会社 | 液晶表示装置 |
JP3483730B2 (ja) * | 1997-05-21 | 2004-01-06 | シャープ株式会社 | 液晶表示装置 |
EP2098958A1 (en) * | 2008-03-03 | 2009-09-09 | British Telecommunications Public Limited Company | Data management method for a mobile device |
WO2010114855A1 (en) * | 2009-03-31 | 2010-10-07 | Commvault Systems, Inc. | Information management systems and methods for heterogeneous data sources |
-
1999
- 1999-02-16 US US09/250,329 patent/US6370019B1/en not_active Expired - Lifetime
- 1999-02-17 JP JP2000531872A patent/JP4421773B2/ja not_active Expired - Lifetime
- 1999-02-17 KR KR1020007009021A patent/KR100698737B1/ko not_active IP Right Cessation
- 1999-02-17 CN CNB998030546A patent/CN1181544C/zh not_active Expired - Lifetime
- 1999-02-17 EP EP99908203.5A patent/EP1057216B1/en not_active Expired - Lifetime
- 1999-02-17 CN CNA2004100565516A patent/CN1607676A/zh active Pending
- 1999-02-17 WO PCT/US1999/003381 patent/WO1999041787A1/en active IP Right Grant
- 1999-02-17 AU AU27695/99A patent/AU757997B2/en not_active Ceased
-
2009
- 2009-09-08 JP JP2009207392A patent/JP4961000B2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102396019A (zh) * | 2009-02-18 | 2012-03-28 | 全球Oled科技有限责任公司 | 具有小芯片驱动器的显示装置 |
CN102396019B (zh) * | 2009-02-18 | 2014-07-16 | 全球Oled科技有限责任公司 | 具有小芯片驱动器的显示装置 |
CN103339667A (zh) * | 2011-01-31 | 2013-10-02 | 全球Oled科技有限责任公司 | 对图像信号进行安全解压缩的显示器 |
CN103339667B (zh) * | 2011-01-31 | 2016-03-09 | 全球Oled科技有限责任公司 | 对图像信号进行安全解压缩的显示器 |
Also Published As
Publication number | Publication date |
---|---|
US6370019B1 (en) | 2002-04-09 |
WO1999041787A1 (en) | 1999-08-19 |
CN1291351A (zh) | 2001-04-11 |
EP1057216A1 (en) | 2000-12-06 |
KR100698737B1 (ko) | 2007-03-23 |
JP2002503836A (ja) | 2002-02-05 |
JP2009288810A (ja) | 2009-12-10 |
JP4961000B2 (ja) | 2012-06-27 |
EP1057216B1 (en) | 2016-06-29 |
AU2769599A (en) | 1999-08-30 |
CN1181544C (zh) | 2004-12-22 |
KR20010041000A (ko) | 2001-05-15 |
JP4421773B2 (ja) | 2010-02-24 |
AU757997B2 (en) | 2003-03-13 |
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