JP4961000B2 - 広い面積のディスプレイ構造のシール - Google Patents
広い面積のディスプレイ構造のシール Download PDFInfo
- Publication number
- JP4961000B2 JP4961000B2 JP2009207392A JP2009207392A JP4961000B2 JP 4961000 B2 JP4961000 B2 JP 4961000B2 JP 2009207392 A JP2009207392 A JP 2009207392A JP 2009207392 A JP2009207392 A JP 2009207392A JP 4961000 B2 JP4961000 B2 JP 4961000B2
- Authority
- JP
- Japan
- Prior art keywords
- display
- seal
- module
- electronic display
- circuit module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012769 display material Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 29
- 239000011324 bead Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 66
- 239000004020 conductor Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000007789 sealing Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 12
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000012212 insulator Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000005329 float glass Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007736 thin film deposition technique Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13336—Combining plural substrates to produce large-area displays, e.g. tiled displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/18—Tiled displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/02—Composition of display devices
- G09G2300/026—Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Description
ジュールと回路モジュールとの間に導電接着剤を異方性をもって加えることにより、電気的に接続される。組み合わされたディスプレイモジュールと回路モジュールは1枚のタイル120を形成する。
Claims (14)
- 電子ディスプレイ構造が、ディスプレイモジュールと回路モジュールとを備え、
前記ディスプレイモジュールが、複数の縦列電極を有する基板と、複数の横列電極と、各々が複数の横列電極のうちの1つ及び複数の縦列電極のうちの1つに接続される複数のディスプレイ材料部分と、複数の横列電極と複数の縦列電極と複数のディスプレイ材料部分とを包むための異方性の導電構造とを有し、
前記回路モジュールが複数の信号ラインを有し、前記回路モジュールが外側領域と内側領域とを有し、前記異方性の導電構造が前記回路モジュールを前記ディスプレイモジュールに付着させるように、かつ、前記回路モジュールを前記ディスプレイモジュールとの間で信号を電気的に繋ぐように形成される
電子ディスプレイ構造。 - 前記ディスプレイモジュールと前記回路モジュールを包むためのディスプレイシールを更に備える、請求項1に記載の電子ディスプレイ構造。
- 前記異方性の導電構造が、前記複数のディスプレイ材料部分の各々をシールするように形成される、請求項1に記載の電子ディスプレイ構造。
- 前記複数の信号ラインのそれぞれが前記複数の横列及び縦列電極のうちの1つに対応し、前記電子ディスプレイ構造が前記回路モジュールの前記外側領域に接続される第1の側と前記ディスプレイモジュールの外側領域に接続される第2の側とを有するビードシールを更に備える、請求項1に記載の電子ディスプレイ構造。
- 前記回路モジュールの反対側で、前記ビードシール、前記基板の第1の面、または前記基板の第2の面のうちの1つに形成されたマスク層を更に備え、該マスク層は、前記ディスプレイが前記基板の前記第1の面から観察される際に、前記ビードシールを隠すように作用する、請求項4に記載の電子ディスプレイ構造。
- 前記複数のディスプレイ材料部分の各々がピクセルの一部であり、前記基板上の隣り合うピクセルが隙間によって互いに分離されており、前記ビードシールが隣り合うピクセル間の隙間の1/2よりも小さい幅を有している、請求項4に記載の電子ディスプレイ構造。
- 前記ビードシールが、前記ディスプレイモジュールの前記外側領域にわたって略均一である、請求項4に記載の電子ディスプレイ構造。
- 前記ディスプレイモジュールから前記回路モジュールにわたって形成され且つ前記回路モジュール及び前記ディスプレイモジュールの周囲で延びるバンドシールと、
前記バンドシールの端部に形成されたマスク層と、
を更に備え、
前記マスク層は、前記バンドシールが前記ディスプレイモジュール側から観察される際に、前記バンドシールを隠すように作用する、請求項1に記載の電子ディスプレイ構造。 - 前記複数の横列電極のうち少なくともいくつかは、それぞれに対応するディスプレイ材料部分を包むように形成される、請求項1に記載の電子ディスプレイ構造。
- 前記ディスプレイ材料が有機電子発光材料を含んでいる、請求項9に記載の電子ディスプレイ構造。
- 前記複数のディスプレイ材料部分の各々の上に位置する絶縁層を更に備え、前記絶縁材料がその中に形成された複数のバイアを有しており、それぞれのバイアがディスプレイ材料関連部分に対応しており、各々の前記横列電極が関連バイアを介してディスプレイ材料対応部分に接触している、請求項1に記載の電子ディスプレイ構造。
- 前記異方性の導電構造が実質的に黒色である、請求項1に記載の電子ディスプレイ構造。
- 前記異方性の導電構造が、接着剤と導電粒子との混合物を含む異方性の導電封止材を備え、局部的な圧力、局部的な磁場、又は局部的なエレクトロマイグレーションのうちのいずれかの要因によって、前記導電粒子は、前記複数の横列及び縦列電極のそれぞれを各信号ラインに接続する、請求項12に記載の電子ディスプレイ構造。
- 前記異方性の導電構造が、前記複数の信号ラインとこれらに対応する横列または縦列電極との間で少なくとも部分的に延びる複数の導電バンプを更に有する、請求項13に記載の電子ディスプレイ構造。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7492298P | 1998-02-17 | 1998-02-17 | |
US60/074,922 | 1998-02-17 | ||
US09/250,329 US6370019B1 (en) | 1998-02-17 | 1999-02-16 | Sealing of large area display structures |
US09/250,329 | 1999-02-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000531872A Division JP4421773B2 (ja) | 1998-02-17 | 1999-02-17 | 広い面積のディスプレイ構造のシール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009288810A JP2009288810A (ja) | 2009-12-10 |
JP2009288810A5 JP2009288810A5 (ja) | 2010-07-29 |
JP4961000B2 true JP4961000B2 (ja) | 2012-06-27 |
Family
ID=26756218
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000531872A Expired - Lifetime JP4421773B2 (ja) | 1998-02-17 | 1999-02-17 | 広い面積のディスプレイ構造のシール |
JP2009207392A Expired - Lifetime JP4961000B2 (ja) | 1998-02-17 | 2009-09-08 | 広い面積のディスプレイ構造のシール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000531872A Expired - Lifetime JP4421773B2 (ja) | 1998-02-17 | 1999-02-17 | 広い面積のディスプレイ構造のシール |
Country Status (7)
Country | Link |
---|---|
US (1) | US6370019B1 (ja) |
EP (1) | EP1057216B1 (ja) |
JP (2) | JP4421773B2 (ja) |
KR (1) | KR100698737B1 (ja) |
CN (2) | CN1607676A (ja) |
AU (1) | AU757997B2 (ja) |
WO (1) | WO1999041787A1 (ja) |
Families Citing this family (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6897855B1 (en) * | 1998-02-17 | 2005-05-24 | Sarnoff Corporation | Tiled electronic display structure |
ATE223139T1 (de) * | 1998-04-22 | 2002-09-15 | Cambridge Consultants | Elektrolumineszierende vorrichtung |
US7119759B2 (en) * | 1999-05-03 | 2006-10-10 | E Ink Corporation | Machine-readable displays |
US8009348B2 (en) * | 1999-05-03 | 2011-08-30 | E Ink Corporation | Machine-readable displays |
EP1196814A1 (en) * | 1999-07-21 | 2002-04-17 | E Ink Corporation | Use of a storage capacitor to enhance the performance of an active matrix driven electronic display |
US6624570B1 (en) * | 1999-09-29 | 2003-09-23 | Sanyo Electric Co., Ltd. | Electroluminescent display device and method for its fabrication |
TW465122B (en) | 1999-12-15 | 2001-11-21 | Semiconductor Energy Lab | Light-emitting device |
US7576496B2 (en) * | 1999-12-22 | 2009-08-18 | General Electric Company | AC powered OLED device |
US6566808B1 (en) * | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
JP4214660B2 (ja) * | 2000-04-11 | 2009-01-28 | ソニー株式会社 | 直視型表示装置 |
US7053874B2 (en) | 2000-09-08 | 2006-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and driving method thereof |
KR100388271B1 (ko) * | 2000-10-14 | 2003-06-19 | 삼성에스디아이 주식회사 | 유기전계발광소자 및 그 제조방법 |
US6683665B1 (en) * | 2000-11-20 | 2004-01-27 | Sarnoff Corporation | Tiled electronic display structure and method for modular repair thereof |
US6621168B2 (en) | 2000-12-28 | 2003-09-16 | Intel Corporation | Interconnected circuit board assembly and system |
US7075112B2 (en) | 2001-01-31 | 2006-07-11 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US6639360B2 (en) * | 2001-01-31 | 2003-10-28 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
GB2371910A (en) | 2001-01-31 | 2002-08-07 | Seiko Epson Corp | Display devices |
US6853411B2 (en) * | 2001-02-20 | 2005-02-08 | Eastman Kodak Company | Light-producing high aperture ratio display having aligned tiles |
GB0107236D0 (en) * | 2001-03-22 | 2001-05-16 | Microemissive Displays Ltd | Method of creating an electroluminescent device |
US6509941B2 (en) * | 2001-03-22 | 2003-01-21 | Eastman Kodak Company | Light-producing display having high aperture ratio pixels |
US6870519B2 (en) * | 2001-03-28 | 2005-03-22 | Intel Corporation | Methods for tiling multiple display elements to form a single display |
US6940501B2 (en) * | 2001-03-28 | 2005-09-06 | Intel Corporation | Tiled display |
US20020163301A1 (en) * | 2001-05-02 | 2002-11-07 | Morley Roland M. | Large format emissive display |
JP2004533022A (ja) * | 2001-06-22 | 2004-10-28 | インターナショナル・ビジネス・マシーンズ・コーポレーション | パッシブ駆動マトリクス・ディスプレイ |
US6548961B2 (en) * | 2001-06-22 | 2003-04-15 | International Business Machines Corporation | Organic light emitting devices |
US6600144B2 (en) | 2001-07-12 | 2003-07-29 | Intel Corporation | Reducing the visibility of seams of modular displays |
US6873380B2 (en) | 2001-07-12 | 2005-03-29 | Intel Corporation | Providing optical elements over emissive displays |
US6967640B2 (en) * | 2001-07-27 | 2005-11-22 | E Ink Corporation | Microencapsulated electrophoretic display with integrated driver |
US6822256B2 (en) * | 2001-09-18 | 2004-11-23 | Intel Corporation | Forming organic light emitting device displays |
US6677918B2 (en) * | 2001-09-21 | 2004-01-13 | Yuji Yuhara | Light emitting diode display system |
US6822389B2 (en) | 2001-10-11 | 2004-11-23 | Intel Corporation | Array display including resilient material in the seam |
WO2003052825A1 (en) * | 2001-12-17 | 2003-06-26 | Koninklijke Philips Electronics N.V. | Tiled flat panel display, method of manufacturing the same, and sub-display for use in such a display, and method of driving such a display |
US20030136966A1 (en) * | 2001-12-18 | 2003-07-24 | Seiko Epson Corporation | Light emission device, method of manufacturing same, electro-optical device and electronic device |
US6950220B2 (en) * | 2002-03-18 | 2005-09-27 | E Ink Corporation | Electro-optic displays, and methods for driving same |
US6947198B2 (en) * | 2002-03-29 | 2005-09-20 | Sony Corporation | Emissive image display apparatus |
US20030184531A1 (en) * | 2002-03-29 | 2003-10-02 | Sony Corporation | GLV engine for image display |
US6861792B2 (en) * | 2002-03-29 | 2005-03-01 | Sony Corporation | Color separator for emissive display |
US6777861B2 (en) * | 2002-03-29 | 2004-08-17 | Sony Corporation | Color selector for emissive image display apparatus |
US6788354B2 (en) | 2002-04-01 | 2004-09-07 | Sony Corporation | Method for making color separator for emissive display |
USRE41914E1 (en) | 2002-05-10 | 2010-11-09 | Ponnusamy Palanisamy | Thermal management in electronic displays |
US6849935B2 (en) * | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
US7592276B2 (en) * | 2002-05-10 | 2009-09-22 | Sarnoff Corporation | Woven electronic textile, yarn and article |
US6914379B2 (en) * | 2002-05-10 | 2005-07-05 | Sarnoff Corporation | Thermal management in electronic displays |
US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
US7649674B2 (en) | 2002-06-10 | 2010-01-19 | E Ink Corporation | Electro-optic display with edge seal |
US6881946B2 (en) * | 2002-06-19 | 2005-04-19 | Eastman Kodak Company | Tiled electro-optic imaging device |
KR100851470B1 (ko) * | 2002-12-05 | 2008-08-08 | 오리온피디피주식회사 | 플라즈마 디스플레이 패널 및 이를 이용한 멀티디스플레이패널 |
US6866678B2 (en) * | 2002-12-10 | 2005-03-15 | Interbational Technology Center | Phototherapeutic treatment methods and apparatus |
US20040206953A1 (en) * | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
US7344901B2 (en) * | 2003-04-16 | 2008-03-18 | Corning Incorporated | Hermetically sealed package and method of fabricating of a hermetically sealed package |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
EP1469450A1 (en) * | 2003-04-18 | 2004-10-20 | Barco N.V. | Organic light-emitting diode display assembly for use in a large-screen display |
SI3419388T1 (sl) * | 2003-04-21 | 2020-12-31 | Signify North America Corporation | Postopek razsvetljave s ploščicami in sistemi |
JP2007505445A (ja) * | 2003-07-07 | 2007-03-08 | アイファイアー・テクノロジー・コープ | エレクトロルミネセント・ディスプレイのためのシールおよびシール方法 |
EP1513059A1 (en) * | 2003-09-08 | 2005-03-09 | Barco N.V. | A pixel module for use in a large-area display |
US7324071B2 (en) * | 2003-09-16 | 2008-01-29 | Sarnoff Corporation | Segmented character display |
US6999138B2 (en) * | 2004-02-24 | 2006-02-14 | Eastman Kodak Company | Tiled display comprising faceplate and displays with at least one defective pixel and method of manufacturing said tiled display |
US20070218751A1 (en) * | 2004-03-11 | 2007-09-20 | Element Labs, Inc. | Mounting system for light tiles attached to tensioned cables |
US8522494B2 (en) * | 2004-03-11 | 2013-09-03 | Barco, Inc. | System for creating a tensioned wall composed of individual LED tiles |
TWM265875U (en) * | 2004-10-07 | 2005-05-21 | Hannspree Inc | Display device |
US7408296B2 (en) * | 2004-11-24 | 2008-08-05 | Eastman Kodak Company | Tiled OLED display |
EP1684366A1 (en) * | 2005-01-25 | 2006-07-26 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Electronic device comprising an electronic component and encapsulation members |
WO2007002452A2 (en) | 2005-06-23 | 2007-01-04 | E Ink Corporation | Edge seals and processes for electro-optic displays |
US7880113B2 (en) * | 2005-12-01 | 2011-02-01 | Delphi Technologies, Inc. | Plasma discharge method and structure for verifying a hermetical seal |
US7537504B2 (en) * | 2005-12-06 | 2009-05-26 | Corning Incorporated | Method of encapsulating a display element with frit wall and laser beam |
US7597603B2 (en) * | 2005-12-06 | 2009-10-06 | Corning Incorporated | Method of encapsulating a display element |
US8610988B2 (en) | 2006-03-09 | 2013-12-17 | E Ink Corporation | Electro-optic display with edge seal |
US20080124558A1 (en) * | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
KR100812023B1 (ko) * | 2006-08-23 | 2008-03-10 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 모기판 |
KR100732819B1 (ko) * | 2006-08-30 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그의 모기판 |
US20080121899A1 (en) * | 2006-11-07 | 2008-05-29 | World Properties, Inc. | Transparent electrode for LED array |
DE102007023066B4 (de) * | 2007-05-16 | 2015-09-10 | Continental Automotive Gmbh | Kombiinstrument |
US8448468B2 (en) | 2008-06-11 | 2013-05-28 | Corning Incorporated | Mask and method for sealing a glass envelope |
US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
DE102008052916A1 (de) * | 2008-10-23 | 2010-04-29 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Bildsensor |
US8456387B2 (en) | 2009-02-18 | 2013-06-04 | Global Oled Technology Llc | Display device with chiplet drivers |
US9148497B2 (en) * | 2009-04-22 | 2015-09-29 | Nokia Technologies Oy | Display with improved electromagnetic compatibility characteristics |
US8232718B2 (en) * | 2009-04-30 | 2012-07-31 | Global Oled Technology Llc | Tiled electroluminescent device with filled gaps |
US8753711B2 (en) * | 2009-12-18 | 2014-06-17 | General Electric Company | Edge sealing method using barrier coatings |
US8710732B2 (en) * | 2009-12-22 | 2014-04-29 | General Electric Company | Organic light emitting device connection methods |
KR101397109B1 (ko) * | 2010-04-13 | 2014-05-19 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 그 제조 방법 |
US8618731B2 (en) * | 2010-05-18 | 2013-12-31 | General Electric Company | Large-area flexible OLED light source |
CN103081156B (zh) * | 2010-08-05 | 2016-05-04 | Oled工厂有限责任公司 | 有机电致发光器件 |
US20120194564A1 (en) * | 2011-01-31 | 2012-08-02 | White Christopher J | Display with secure decompression of image signals |
KR101846321B1 (ko) * | 2011-10-25 | 2018-04-09 | 엘지이노텍 주식회사 | 폴리에스테르-나노복합체 기판을 포함하는 배리어 필름 및 이를 구비한 플렉시블 디스플레이 |
JP6039905B2 (ja) * | 2012-02-14 | 2016-12-07 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法 |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
AU2014200754A1 (en) * | 2013-03-08 | 2014-09-25 | Samsung Electronics Co., Ltd. | Display apparatus and control method thereof |
WO2015011758A1 (ja) * | 2013-07-22 | 2015-01-29 | 株式会社 東芝 | 表示システム |
US9383960B2 (en) | 2013-11-12 | 2016-07-05 | Kabushiki Kaisha Toshiba | Video display device, display control method |
CN103680337A (zh) * | 2013-11-15 | 2014-03-26 | 北京维信诺科技有限公司 | 一种pmoled拼接屏体结构 |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
US10211443B2 (en) | 2014-09-10 | 2019-02-19 | Cellink Corporation | Battery interconnects |
US9147875B1 (en) | 2014-09-10 | 2015-09-29 | Cellink Corporation | Interconnect for battery packs |
US9557954B2 (en) | 2014-12-23 | 2017-01-31 | X Development Llc | Display panel using direct emission pixel arrays |
KR20180031626A (ko) * | 2015-02-03 | 2018-03-28 | 셀링크 코포레이션 | 조합된 열 및 전기 에너지 전달을 위한 시스템 및 방법 |
DE102016103324A1 (de) * | 2016-02-25 | 2017-08-31 | Osram Opto Semiconductors Gmbh | Videowand-Modul und Verfahren zum Herstellen eines Videowand-Moduls |
JP2019045606A (ja) * | 2017-08-31 | 2019-03-22 | 京セラ株式会社 | 発光素子基板の検査方法および発光素子基板 |
CN107688724B (zh) * | 2017-09-30 | 2024-05-14 | 中国电子科技集团公司第四十三研究所 | 一种小尺寸ltcc基板版图排布结构 |
TWI732089B (zh) * | 2018-01-15 | 2021-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
DE102018105884A1 (de) * | 2018-03-14 | 2019-09-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement mit einer vielzahl licht emittierender bereiche und verfahren zur herstellung des optoelektronischen bauelements |
KR102554733B1 (ko) * | 2018-07-31 | 2023-07-13 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조 방법 |
KR102620974B1 (ko) | 2018-10-05 | 2024-01-05 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조 방법 |
WO2022204709A1 (en) | 2021-03-24 | 2022-09-29 | Cellink Corporation | Multilayered flexible battery interconnects and methods of fabricating thereof |
CN113643621A (zh) * | 2021-07-22 | 2021-11-12 | 惠州华星光电显示有限公司 | 发光二极管面板及拼接面板 |
WO2023119251A1 (en) * | 2021-12-23 | 2023-06-29 | Vuereal Inc. | Seamless tiling |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4204205A (en) | 1975-02-05 | 1980-05-20 | Kabushiki Kaisha Daini Seikosha | Electronic display device |
JPS5190299A (ja) * | 1975-02-05 | 1976-08-07 | ||
GB1509478A (en) * | 1976-12-10 | 1978-05-04 | Ibm | Flat panel display device |
US4490647A (en) * | 1982-11-29 | 1984-12-25 | Burroughs Corporation | Gas-filled dot matrix display panel |
JPS62112891A (ja) * | 1985-11-12 | 1987-05-23 | ミクストン株式会社 | 回転昇降扉 |
JPH0447920Y2 (ja) * | 1986-01-09 | 1992-11-11 | ||
JP2765140B2 (ja) * | 1989-12-22 | 1998-06-11 | 三菱電機株式会社 | 液晶ディスプレイ装置 |
JPH03203193A (ja) * | 1989-12-29 | 1991-09-04 | Sharp Corp | 薄膜elパネル |
JP3016808B2 (ja) * | 1990-02-06 | 2000-03-06 | パイオニア株式会社 | 電界発光素子及びその製造方法 |
JPH0572545A (ja) * | 1991-09-17 | 1993-03-26 | Seiko Epson Corp | 液晶パネルの実装構造 |
JPH0770289B2 (ja) * | 1991-11-29 | 1995-07-31 | 株式会社ティーティーティー | 表示用放電管 |
EP0560072A3 (en) | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropic electrically conductive adhesive film and connection structure using the same |
JPH05258790A (ja) * | 1992-03-13 | 1993-10-08 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造 |
JPH05258789A (ja) * | 1992-03-13 | 1993-10-08 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造 |
JPH08507622A (ja) * | 1994-01-01 | 1996-08-13 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 液晶表示装置及び多数の液晶表示装置を製造する方法 |
JP3813217B2 (ja) * | 1995-03-13 | 2006-08-23 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルの製造方法 |
CN1079545C (zh) * | 1994-06-30 | 2002-02-20 | 索尼株式会社 | 等离子体地址液晶显示装置 |
JP3135793B2 (ja) * | 1994-09-02 | 2001-02-19 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
TW347479B (en) * | 1994-12-15 | 1998-12-11 | Sharp Kk | Liquid crystal display panel and liquid crystal display apparatus |
JPH08213169A (ja) * | 1995-02-01 | 1996-08-20 | Fuji Electric Co Ltd | 薄膜電場発光素子 |
DE69623443T2 (de) * | 1995-02-06 | 2003-01-23 | Idemitsu Kosan Co | Vielfarbige lichtemissionsvorrichtung und verfahren zur herstellung derselben |
JP3401356B2 (ja) * | 1995-02-21 | 2003-04-28 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
US5585695A (en) | 1995-06-02 | 1996-12-17 | Adrian Kitai | Thin film electroluminescent display module |
US5644327A (en) * | 1995-06-07 | 1997-07-01 | David Sarnoff Research Center, Inc. | Tessellated electroluminescent display having a multilayer ceramic substrate |
JPH09120062A (ja) * | 1995-08-18 | 1997-05-06 | Toshiba Electron Eng Corp | カラーフィルタ基板及びその製造方法、それを用いた液晶表示素子及びその製造方法 |
US5697825A (en) | 1995-09-29 | 1997-12-16 | Micron Display Technology, Inc. | Method for evacuating and sealing field emission displays |
US5889568A (en) * | 1995-12-12 | 1999-03-30 | Rainbow Displays Inc. | Tiled flat panel displays |
JPH09181491A (ja) * | 1995-12-27 | 1997-07-11 | Toshiba Corp | 半導体装置の実装方法及び実装構造 |
JP3343642B2 (ja) * | 1996-04-26 | 2002-11-11 | シャープ株式会社 | テープキャリアパッケージ及び液晶表示装置 |
US5827102A (en) | 1996-05-13 | 1998-10-27 | Micron Technology, Inc. | Low temperature method for evacuating and sealing field emission displays |
US5867236A (en) | 1996-05-21 | 1999-02-02 | Rainbow Displays, Inc. | Construction and sealing of tiled, flat-panel displays |
US5703394A (en) * | 1996-06-10 | 1997-12-30 | Motorola | Integrated electro-optical package |
US5781258A (en) * | 1996-06-13 | 1998-07-14 | Rainbow Displays, Inc. | Assembling and sealing large, hermetic and semi-hermetic, h-tiled, flat-paneled displays |
JPH10153785A (ja) * | 1996-09-26 | 1998-06-09 | Toshiba Corp | 液晶表示装置 |
JP3361947B2 (ja) * | 1997-01-30 | 2003-01-07 | シャープ株式会社 | 液晶表示装置 |
JP3483730B2 (ja) * | 1997-05-21 | 2004-01-06 | シャープ株式会社 | 液晶表示装置 |
EP2098958A1 (en) * | 2008-03-03 | 2009-09-09 | British Telecommunications Public Limited Company | Data management method for a mobile device |
WO2010114855A1 (en) * | 2009-03-31 | 2010-10-07 | Commvault Systems, Inc. | Information management systems and methods for heterogeneous data sources |
-
1999
- 1999-02-16 US US09/250,329 patent/US6370019B1/en not_active Expired - Lifetime
- 1999-02-17 AU AU27695/99A patent/AU757997B2/en not_active Ceased
- 1999-02-17 WO PCT/US1999/003381 patent/WO1999041787A1/en active IP Right Grant
- 1999-02-17 CN CNA2004100565516A patent/CN1607676A/zh active Pending
- 1999-02-17 CN CNB998030546A patent/CN1181544C/zh not_active Expired - Lifetime
- 1999-02-17 JP JP2000531872A patent/JP4421773B2/ja not_active Expired - Lifetime
- 1999-02-17 KR KR1020007009021A patent/KR100698737B1/ko not_active IP Right Cessation
- 1999-02-17 EP EP99908203.5A patent/EP1057216B1/en not_active Expired - Lifetime
-
2009
- 2009-09-08 JP JP2009207392A patent/JP4961000B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1057216A1 (en) | 2000-12-06 |
EP1057216B1 (en) | 2016-06-29 |
CN1291351A (zh) | 2001-04-11 |
JP2009288810A (ja) | 2009-12-10 |
AU757997B2 (en) | 2003-03-13 |
WO1999041787A1 (en) | 1999-08-19 |
JP4421773B2 (ja) | 2010-02-24 |
KR20010041000A (ko) | 2001-05-15 |
AU2769599A (en) | 1999-08-30 |
CN1607676A (zh) | 2005-04-20 |
JP2002503836A (ja) | 2002-02-05 |
KR100698737B1 (ko) | 2007-03-23 |
CN1181544C (zh) | 2004-12-22 |
US6370019B1 (en) | 2002-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4961000B2 (ja) | 広い面積のディスプレイ構造のシール | |
US7394194B2 (en) | Tiled display | |
CN100524798C (zh) | 有机发光显示装置 | |
KR100846581B1 (ko) | 듀얼형 유기전자발광소자와 그 제조방법 | |
US8593604B2 (en) | Electrode structure which supports self alignment of liquid deposition of materials | |
US6541919B1 (en) | Electrical interconnection of light-emitting fibers, and method therefor | |
KR20170070664A (ko) | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 | |
CN104134679A (zh) | 有机发光二极管显示装置及其制造方法 | |
KR20180015940A (ko) | 반도체 발광 소자를 이용한 디스플레이 장치 | |
US20030197475A1 (en) | Flat-panel display, manufacturing method thereof, and portable terminal | |
KR20200095210A (ko) | 반도체 발광 소자, 이의 제조 방법, 및 이를 포함하는 디스플레이 장치 | |
US6914379B2 (en) | Thermal management in electronic displays | |
USRE41914E1 (en) | Thermal management in electronic displays | |
JP2004362788A (ja) | 有機el表示装置およびその製造方法 | |
CN111596479B (zh) | 一种显示面板及其制造方法、显示装置 | |
JPH1174075A (ja) | 有機el表示装置 | |
KR20060122598A (ko) | 평판표시장치용 테이프 기판 및 이를 구비한 평판표시장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100615 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120224 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120323 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150330 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |