CN1602652B - 基板清洁装置 - Google Patents
基板清洁装置 Download PDFInfo
- Publication number
- CN1602652B CN1602652B CN02824823.6A CN02824823A CN1602652B CN 1602652 B CN1602652 B CN 1602652B CN 02824823 A CN02824823 A CN 02824823A CN 1602652 B CN1602652 B CN 1602652B
- Authority
- CN
- China
- Prior art keywords
- substrate
- adsorption roller
- aforementioned
- base plate
- aforesaid base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 207
- 238000004140 cleaning Methods 0.000 claims abstract description 65
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 238000001179 sorption measurement Methods 0.000 claims description 96
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract 4
- 238000009736 wetting Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 18
- 230000003068 static effect Effects 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000007639 printing Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2002/010612 WO2004034757A1 (ja) | 2002-10-11 | 2002-10-11 | 基板クリーニング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1602652A CN1602652A (zh) | 2005-03-30 |
CN1602652B true CN1602652B (zh) | 2010-06-09 |
Family
ID=32089056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02824823.6A Expired - Lifetime CN1602652B (zh) | 2002-10-11 | 2002-10-11 | 基板清洁装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4326472B2 (ja) |
CN (1) | CN1602652B (ja) |
AU (1) | AU2002338178A1 (ja) |
WO (1) | WO2004034757A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100542700C (zh) * | 2004-12-24 | 2009-09-23 | 鸿富锦精密工业(深圳)有限公司 | 玻璃基板清洗用载具 |
US8079105B2 (en) | 2005-11-10 | 2011-12-20 | Datacard Corporation | Card cleaning mechanism |
KR20080051961A (ko) | 2006-12-07 | 2008-06-11 | 한국전자통신연구원 | 플렉시블 기판의 세정 방법 |
JP4406652B2 (ja) * | 2007-05-22 | 2010-02-03 | 株式会社松栄工機 | 搬送装置 |
JP2009157247A (ja) * | 2007-12-27 | 2009-07-16 | Orc Mfg Co Ltd | 露光装置 |
JP5253481B2 (ja) * | 2010-11-04 | 2013-07-31 | ユニテク株式会社 | 基板クリーニング装置 |
KR20160011201A (ko) * | 2013-06-18 | 2016-01-29 | 애플 인크. | 적층 시스템을 위한 압력-감지 롤러 |
JP6382622B2 (ja) * | 2014-02-25 | 2018-08-29 | バンドー化学株式会社 | クリーニング装置、粘着ローラユニット及び粘着ローラ |
CN110813930A (zh) * | 2019-11-23 | 2020-02-21 | 湖南东神自动化设备有限公司 | 一种电路板表面清洁装置 |
CN112140633A (zh) * | 2020-09-21 | 2020-12-29 | 昆山市天丰印刷包装有限公司 | 全自动水性印刷开槽模切机 |
CN114364153B (zh) * | 2021-12-15 | 2023-12-08 | 上海羽默电子科技有限公司 | 一种电路板印刷工艺 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1344131A (zh) * | 2000-09-18 | 2002-04-10 | 华通电脑股份有限公司 | 印刷电路板暨基板的激光钻孔方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0614860Y2 (ja) * | 1990-04-04 | 1994-04-20 | 住友金属工業株式会社 | 帯状極低張力シートの異物除去装置 |
JPH0763685B2 (ja) * | 1991-09-10 | 1995-07-12 | 都ローラー工業株式会社 | 除塵用ローラーとそれを用いた除塵装置 |
JP2002153825A (ja) * | 2000-11-17 | 2002-05-28 | Taiyo Kogyo Kk | ゴミ取り粘着ローラ |
JP3078286U (ja) * | 2000-12-12 | 2001-06-29 | 榮華 葉 | 回路基板用清掃機 |
-
2002
- 2002-10-11 WO PCT/JP2002/010612 patent/WO2004034757A1/ja active Application Filing
- 2002-10-11 CN CN02824823.6A patent/CN1602652B/zh not_active Expired - Lifetime
- 2002-10-11 JP JP2004542798A patent/JP4326472B2/ja not_active Expired - Lifetime
- 2002-10-11 AU AU2002338178A patent/AU2002338178A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1344131A (zh) * | 2000-09-18 | 2002-04-10 | 华通电脑股份有限公司 | 印刷电路板暨基板的激光钻孔方法 |
Non-Patent Citations (3)
Title |
---|
JP平3-78286U 1991.08.07 |
JP特开平6-14860A 1994.01.25 |
JP特开平6-91236A 1994.04.05 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004034757A1 (ja) | 2006-02-16 |
WO2004034757A1 (ja) | 2004-04-22 |
CN1602652A (zh) | 2005-03-30 |
AU2002338178A1 (en) | 2004-05-04 |
JP4326472B2 (ja) | 2009-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20100609 |