CN1595608A - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
- Publication number
- CN1595608A CN1595608A CNA2004100851537A CN200410085153A CN1595608A CN 1595608 A CN1595608 A CN 1595608A CN A2004100851537 A CNA2004100851537 A CN A2004100851537A CN 200410085153 A CN200410085153 A CN 200410085153A CN 1595608 A CN1595608 A CN 1595608A
- Authority
- CN
- China
- Prior art keywords
- semiconductor device
- monitoring
- wafer
- manufacturing process
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP316591/03 | 2003-09-09 | ||
JP316589/2003 | 2003-09-09 | ||
JP316590/03 | 2003-09-09 | ||
JP2003316590 | 2003-09-09 | ||
JP2003316589 | 2003-09-09 | ||
JP316590/2003 | 2003-09-09 | ||
JP316589/03 | 2003-09-09 | ||
JP316591/2003 | 2003-09-09 | ||
JP2003316588 | 2003-09-09 | ||
JP316588/03 | 2003-09-09 | ||
JP316588/2003 | 2003-09-09 | ||
JP2003316591 | 2003-09-09 | ||
JP2004259656A JP4732726B2 (ja) | 2003-09-09 | 2004-09-07 | 半導体装置の製造方法 |
JP259656/2004 | 2004-09-07 | ||
JP259656/04 | 2004-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1595608A true CN1595608A (zh) | 2005-03-16 |
CN100394537C CN100394537C (zh) | 2008-06-11 |
Family
ID=34557748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100851537A Expired - Fee Related CN100394537C (zh) | 2003-09-09 | 2004-09-09 | 半导体器件的制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7129099B2 (zh) |
JP (1) | JP4732726B2 (zh) |
CN (1) | CN100394537C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094144A (zh) * | 2011-10-31 | 2013-05-08 | 无锡华润上华科技有限公司 | 一种用于预估mos管的阈值电压的方法 |
CN103489806A (zh) * | 2012-06-14 | 2014-01-01 | 无锡华润上华科技有限公司 | 一种在线监测离子损伤的方法 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8366316B2 (en) | 2006-04-14 | 2013-02-05 | Deka Products Limited Partnership | Sensor apparatus systems, devices and methods |
US8273049B2 (en) | 2007-02-27 | 2012-09-25 | Deka Products Limited Partnership | Pumping cassette |
US8292594B2 (en) | 2006-04-14 | 2012-10-23 | Deka Products Limited Partnership | Fluid pumping systems, devices and methods |
US10537671B2 (en) | 2006-04-14 | 2020-01-21 | Deka Products Limited Partnership | Automated control mechanisms in a hemodialysis apparatus |
US8357298B2 (en) | 2007-02-27 | 2013-01-22 | Deka Products Limited Partnership | Hemodialysis systems and methods |
US8425471B2 (en) | 2007-02-27 | 2013-04-23 | Deka Products Limited Partnership | Reagent supply for a hemodialysis system |
US8409441B2 (en) | 2007-02-27 | 2013-04-02 | Deka Products Limited Partnership | Blood treatment systems and methods |
US8393690B2 (en) | 2007-02-27 | 2013-03-12 | Deka Products Limited Partnership | Enclosure for a portable hemodialysis system |
US8562834B2 (en) | 2007-02-27 | 2013-10-22 | Deka Products Limited Partnership | Modular assembly for a portable hemodialysis system |
US8042563B2 (en) | 2007-02-27 | 2011-10-25 | Deka Products Limited Partnership | Cassette system integrated apparatus |
US8491184B2 (en) | 2007-02-27 | 2013-07-23 | Deka Products Limited Partnership | Sensor apparatus systems, devices and methods |
MX357266B (es) | 2007-02-27 | 2018-07-03 | Deka Products Lp | Sistemas y metodos de hemodialisis. |
US9028691B2 (en) | 2007-02-27 | 2015-05-12 | Deka Products Limited Partnership | Blood circuit assembly for a hemodialysis system |
US20090107335A1 (en) | 2007-02-27 | 2009-04-30 | Deka Products Limited Partnership | Air trap for a medical infusion device |
US8105265B2 (en) * | 2007-10-12 | 2012-01-31 | Deka Products Limited Partnership | Systems, devices and methods for cardiopulmonary treatment and procedures |
US8771508B2 (en) | 2008-08-27 | 2014-07-08 | Deka Products Limited Partnership | Dialyzer cartridge mounting arrangement for a hemodialysis system |
US9078971B2 (en) | 2008-01-23 | 2015-07-14 | Deka Products Limited Partnership | Medical treatment system and methods using a plurality of fluid lines |
EP4279096A3 (en) | 2008-01-23 | 2024-03-06 | DEKA Products Limited Partnership | Disposable components for fluid line autoconnect systems and methods |
US7895008B2 (en) * | 2008-03-17 | 2011-02-22 | International Business Machines Corporation | Method of performing measurement sampling of lots in a manufacturing process |
CA2779296C (en) | 2009-10-30 | 2018-02-13 | Deka Products Limited Partnership | Apparatus and method for detecting disconnection of an intravascular access device |
MX2013000212A (es) | 2010-07-07 | 2013-05-09 | Deka Products Lp | Sistema de tratamiento médico y métodos que utilizan una pluralidad de líneas de fluido. |
MX344664B (es) | 2011-05-24 | 2017-01-04 | Deka Products Lp | Sistemas y metodos de tratamiento de la sangre. |
CA2837200C (en) | 2011-05-24 | 2020-07-07 | Deka Products Limited Partnership | Hemodialysis system |
JP6027129B2 (ja) | 2011-11-04 | 2016-11-16 | デカ・プロダクツ・リミテッド・パートナーシップ | 複数の流体ラインを使用する医療システム |
CN109417019B (zh) * | 2016-07-04 | 2023-12-05 | 三菱电机株式会社 | 半导体装置的制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2520870B2 (ja) * | 1985-08-13 | 1996-07-31 | 沖電気工業株式会社 | 半導体装置の製造方法 |
JPH05347295A (ja) * | 1992-06-16 | 1993-12-27 | Fuji Electric Co Ltd | 半導体ウェーハのプロセス処理装置 |
US5399229A (en) * | 1993-05-13 | 1995-03-21 | Texas Instruments Incorporated | System and method for monitoring and evaluating semiconductor wafer fabrication |
US5943552A (en) * | 1997-02-06 | 1999-08-24 | Seh America, Inc. | Schottky metal detection method |
JP3758366B2 (ja) * | 1998-05-20 | 2006-03-22 | 富士通株式会社 | 半導体装置 |
JP3244057B2 (ja) * | 1998-07-16 | 2002-01-07 | 日本電気株式会社 | 基準電圧源回路 |
US7069101B1 (en) * | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
JP3381693B2 (ja) * | 1999-12-17 | 2003-03-04 | 日本電気株式会社 | 半導体装置の製造方法 |
JP4524720B2 (ja) * | 1999-12-28 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | プロセス制御装置 |
US6485990B1 (en) * | 2000-01-04 | 2002-11-26 | Advanced Micro Devices, Inc. | Feed-forward control of an etch processing tool |
JP2001332723A (ja) * | 2000-05-19 | 2001-11-30 | Nec Corp | 半導体装置の製造方法 |
JP2001333856A (ja) * | 2000-05-29 | 2001-12-04 | Matsushita Electric Ind Co Ltd | 誘導加熱式炊飯器 |
JP2001338856A (ja) * | 2000-05-30 | 2001-12-07 | Tokyo Seimitsu Co Ltd | 半導体製造システムのプロセスコントローラ |
JP2002076082A (ja) * | 2000-08-31 | 2002-03-15 | Shin Etsu Handotai Co Ltd | シリコンウエーハの検査方法及び製造方法、半導体デバイスの製造方法及びシリコンウエーハ |
JP2002359289A (ja) * | 2001-03-29 | 2002-12-13 | Mitsubishi Electric Corp | プロセスモニタ回路を備えた半導体装置、その試験方法、並びにその製造方法 |
JP3900340B2 (ja) * | 2001-04-05 | 2007-04-04 | 川崎マイクロエレクトロニクス株式会社 | 半導体集積回路の製造工程管理用テスト回路および半導体集積回路の製造工程の管理方法 |
US6950716B2 (en) * | 2001-08-13 | 2005-09-27 | Applied Materials, Inc. | Dynamic control of wafer processing paths in semiconductor manufacturing processes |
JP3445603B2 (ja) * | 2002-10-25 | 2003-09-08 | 株式会社東芝 | 映像情報を含むデジタル情報の管理システム |
-
2004
- 2004-09-07 JP JP2004259656A patent/JP4732726B2/ja not_active Expired - Fee Related
- 2004-09-08 US US10/936,737 patent/US7129099B2/en active Active
- 2004-09-09 CN CNB2004100851537A patent/CN100394537C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094144A (zh) * | 2011-10-31 | 2013-05-08 | 无锡华润上华科技有限公司 | 一种用于预估mos管的阈值电压的方法 |
CN103094144B (zh) * | 2011-10-31 | 2015-11-25 | 无锡华润上华科技有限公司 | 一种用于预估mos管的阈值电压的方法 |
CN103489806A (zh) * | 2012-06-14 | 2014-01-01 | 无锡华润上华科技有限公司 | 一种在线监测离子损伤的方法 |
CN103489806B (zh) * | 2012-06-14 | 2016-08-03 | 无锡华润上华科技有限公司 | 一种在线监测离子损伤的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100394537C (zh) | 2008-06-11 |
US7129099B2 (en) | 2006-10-31 |
JP2005109457A (ja) | 2005-04-21 |
JP4732726B2 (ja) | 2011-07-27 |
US20050130332A1 (en) | 2005-06-16 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160311 Address after: Chiba County, Japan Patentee after: SEIKO INSTR INC Address before: Chiba County, Japan Patentee before: Seiko Instruments Inc. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Patentee after: EPPs Lingke Co. Ltd. Address before: Chiba County, Japan Patentee before: SEIKO INSTR INC |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080611 Termination date: 20200909 |