CN1577859A - 半导体集成电路 - Google Patents

半导体集成电路 Download PDF

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Publication number
CN1577859A
CN1577859A CNA2004100544416A CN200410054441A CN1577859A CN 1577859 A CN1577859 A CN 1577859A CN A2004100544416 A CNA2004100544416 A CN A2004100544416A CN 200410054441 A CN200410054441 A CN 200410054441A CN 1577859 A CN1577859 A CN 1577859A
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CN
China
Prior art keywords
region
drain region
source region
semiconductor integrated
mos transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100544416A
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English (en)
Chinese (zh)
Inventor
森下泰之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CN1577859A publication Critical patent/CN1577859A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
    • H10D84/406—Combinations of FETs or IGBTs with vertical BJTs and with one or more of diodes, resistors or capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNA2004100544416A 2003-07-22 2004-07-22 半导体集成电路 Pending CN1577859A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP277461/2003 2003-07-22
JP2003277461A JP2005045016A (ja) 2003-07-22 2003-07-22 半導体集積回路

Publications (1)

Publication Number Publication Date
CN1577859A true CN1577859A (zh) 2005-02-09

Family

ID=34074639

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004100544416A Pending CN1577859A (zh) 2003-07-22 2004-07-22 半导体集成电路

Country Status (5)

Country Link
US (1) US20050017306A1 (enExample)
JP (1) JP2005045016A (enExample)
KR (1) KR20050011681A (enExample)
CN (1) CN1577859A (enExample)
TW (1) TW200509372A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101926004B (zh) * 2008-01-31 2013-01-23 飞思卡尔半导体公司 静电放电保护
WO2014113970A1 (en) * 2013-01-25 2014-07-31 Suzhou Red Maple Wind Blade Mould Co., Ltd Electrostatic elimination from a mould
CN104079271A (zh) * 2013-03-25 2014-10-01 株式会社东芝 静电保护电路
CN109063289A (zh) * 2018-07-19 2018-12-21 北京顿思集成电路设计有限责任公司 半导体器件的评估方法
CN110120390A (zh) * 2018-02-07 2019-08-13 英飞凌科技股份有限公司 半导体设备及其构造方法
CN113258920A (zh) * 2021-05-08 2021-08-13 华润微集成电路(无锡)有限公司 一种信号电平转换电路

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7595245B2 (en) * 2005-08-12 2009-09-29 Texas Instruments Incorporated Semiconductor device having a gate electrode material feature located adjacent a gate width side of its gate electrode and a method of manufacture therefor
JP4995455B2 (ja) 2005-11-30 2012-08-08 ルネサスエレクトロニクス株式会社 半導体装置
JP5586819B2 (ja) * 2006-04-06 2014-09-10 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP5171412B2 (ja) * 2007-10-01 2013-03-27 株式会社ジャパンディスプレイウェスト 液晶表示装置及び電子機器
KR100952245B1 (ko) * 2007-12-26 2010-04-09 주식회사 동부하이텍 정전기 방전 보호회로 및 그 제조 방법
CN102386218B (zh) * 2010-08-31 2013-10-23 上海华虹Nec电子有限公司 BiCMOS工艺中的垂直寄生型PNP器件及其制造方法
JP5581907B2 (ja) * 2010-09-01 2014-09-03 株式会社リコー 半導体集積回路及び半導体集積回路装置
CN102437180B (zh) * 2011-11-21 2013-09-11 上海华虹Nec电子有限公司 超高压锗硅hbt器件及其制造方法
US9553011B2 (en) 2012-12-28 2017-01-24 Texas Instruments Incorporated Deep trench isolation with tank contact grounding
US9472948B2 (en) * 2013-09-30 2016-10-18 Infineon Technologies Ag On chip reverse polarity protection compliant with ISO and ESD requirements
TWI720867B (zh) * 2020-04-08 2021-03-01 新唐科技股份有限公司 半導體裝置
CN112366202B (zh) * 2020-10-23 2024-06-07 长江存储科技有限责任公司 静电放电保护结构及其制作方法
JP7765268B2 (ja) * 2021-09-14 2025-11-06 キオクシア株式会社 半導体装置、保護回路、及び半導体装置の製造方法
CN115148786A (zh) * 2022-06-30 2022-10-04 深圳朗田亩半导体科技有限公司 一种ggnmos器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US58027A (en) * 1866-09-11 Improved roller for wringers
US5019888A (en) * 1987-07-23 1991-05-28 Texas Instruments Incorporated Circuit to improve electrostatic discharge protection
US5440162A (en) * 1994-07-26 1995-08-08 Rockwell International Corporation ESD protection for submicron CMOS circuits
US5635737A (en) * 1994-09-23 1997-06-03 Aspec Technology, Inc. Symmetrical multi-layer metal logic array with extension portions for increased gate density and a testability area
US6232165B1 (en) * 1998-12-09 2001-05-15 Winbond Electronics Corporation Buried guard rings and method for forming the same
US6466423B1 (en) * 2000-01-06 2002-10-15 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic discharge protection device for mixed voltage application
JP3983067B2 (ja) * 2001-03-19 2007-09-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路の静電保護回路
US6444511B1 (en) * 2001-05-31 2002-09-03 Taiwan Semiconductor Manufacturing Company CMOS output circuit with enhanced ESD protection using drain side implantation

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101926004B (zh) * 2008-01-31 2013-01-23 飞思卡尔半导体公司 静电放电保护
WO2014113970A1 (en) * 2013-01-25 2014-07-31 Suzhou Red Maple Wind Blade Mould Co., Ltd Electrostatic elimination from a mould
CN104079271A (zh) * 2013-03-25 2014-10-01 株式会社东芝 静电保护电路
CN110120390A (zh) * 2018-02-07 2019-08-13 英飞凌科技股份有限公司 半导体设备及其构造方法
CN109063289A (zh) * 2018-07-19 2018-12-21 北京顿思集成电路设计有限责任公司 半导体器件的评估方法
CN109063289B (zh) * 2018-07-19 2022-12-30 北京顿思集成电路设计有限责任公司 半导体器件的评估方法
CN113258920A (zh) * 2021-05-08 2021-08-13 华润微集成电路(无锡)有限公司 一种信号电平转换电路
CN113258920B (zh) * 2021-05-08 2023-12-22 华润微集成电路(无锡)有限公司 一种信号电平转换电路

Also Published As

Publication number Publication date
TW200509372A (en) 2005-03-01
US20050017306A1 (en) 2005-01-27
JP2005045016A (ja) 2005-02-17
KR20050011681A (ko) 2005-01-29

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