CN1463294A - 无铅焊剂 - Google Patents

无铅焊剂 Download PDF

Info

Publication number
CN1463294A
CN1463294A CN02802046A CN02802046A CN1463294A CN 1463294 A CN1463294 A CN 1463294A CN 02802046 A CN02802046 A CN 02802046A CN 02802046 A CN02802046 A CN 02802046A CN 1463294 A CN1463294 A CN 1463294A
Authority
CN
China
Prior art keywords
solder flux
flux
accounts
solder
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN02802046A
Other languages
English (en)
Chinese (zh)
Inventor
派特雷·兰布里奇特
马库斯·雷顿梅尔
克里斯托弗·特斯库蒂恩
索德·阿萨莱尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading AG filed Critical Esec Trading AG
Publication of CN1463294A publication Critical patent/CN1463294A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
CN02802046A 2001-06-12 2002-06-04 无铅焊剂 Pending CN1463294A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP01810566 2001-06-12
EP01810566.8 2001-06-12
EP01810612A EP1266975A1 (de) 2001-06-12 2001-06-22 Bleifreies Lötmittel
EP01810612.0 2001-06-22

Publications (1)

Publication Number Publication Date
CN1463294A true CN1463294A (zh) 2003-12-24

Family

ID=26077386

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02802046A Pending CN1463294A (zh) 2001-06-12 2002-06-04 无铅焊剂

Country Status (5)

Country Link
US (1) US20040170524A1 (enExample)
EP (1) EP1266975A1 (enExample)
JP (1) JP2004528992A (enExample)
CN (1) CN1463294A (enExample)
WO (1) WO2002101105A1 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101380701B (zh) * 2008-10-31 2010-11-03 河南科技大学 一种高温无铅软钎料及制备方法
CN101232967B (zh) * 2005-08-11 2010-12-08 千住金属工业株式会社 电子部件用无铅焊膏、钎焊方法以及电子部件
CN102321829A (zh) * 2011-10-24 2012-01-18 南京信息工程大学 一种无银低熔点锡铋系无铅焊料合金及其制备方法
CN103038020A (zh) * 2010-06-28 2013-04-10 住友金属矿山股份有限公司 无铅焊料合金
CN103084750A (zh) * 2013-02-25 2013-05-08 重庆科技学院 一种电子封装用高熔点无铅钎料及其制备方法
CN104703749A (zh) * 2013-01-28 2015-06-10 日本半田株式会社 用于芯片焊接的钎焊合金
CN106392366A (zh) * 2016-12-02 2017-02-15 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法
CN111132794A (zh) * 2018-08-31 2020-05-08 Ｊｘ金属株式会社 焊料合金
CN114905183A (zh) * 2022-05-11 2022-08-16 湘潭大学 一种Bi-Ag-Zn系无铅焊料及其制备方法和应用

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040099958A1 (en) * 2002-11-21 2004-05-27 Schildgen William R. Crack resistant interconnect module
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
KR101088658B1 (ko) * 2005-11-11 2011-12-01 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트와 땜납 이음매
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
JP5224430B2 (ja) * 2006-03-17 2013-07-03 株式会社豊田中央研究所 パワー半導体モジュール
JP4692491B2 (ja) * 2007-01-15 2011-06-01 パナソニック株式会社 接合材料
WO2007136009A1 (ja) * 2006-05-24 2007-11-29 Panasonic Corporation 接合材料、電子部品、接合構造体および電子機器
JP4692480B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合構造体および電子機器
JP3886144B1 (ja) * 2006-05-24 2007-02-28 松下電器産業株式会社 接合材料、電子部品および接合構造体
KR20090050072A (ko) * 2006-09-13 2009-05-19 허니웰 인터내셔널 인코포레이티드 전기적 상호 연결부를 위한 개선된 솔더 합금, 그 생산 방법 및 용도
JP4822526B2 (ja) * 2006-09-15 2011-11-24 株式会社豊田中央研究所 接合体
JP4692479B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合材料およびモジュール構造体
JP2009158725A (ja) * 2007-12-27 2009-07-16 Panasonic Corp 半導体装置およびダイボンド材
US20100294550A1 (en) * 2007-12-27 2010-11-25 Akio Furusawa Bonding material, electronic component and bonded structure
CN102017107B (zh) 2008-06-23 2013-05-08 松下电器产业株式会社 接合结构以及电子器件
JP5526720B2 (ja) * 2009-11-13 2014-06-18 株式会社村田製作所 樹脂回路基板およびその製造方法
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP5716332B2 (ja) * 2010-09-22 2015-05-13 住友金属鉱山株式会社 Ｐｂフリーはんだ合金
JP5093373B2 (ja) * 2011-03-08 2012-12-12 住友金属鉱山株式会社 Ｐｂフリーはんだペースト
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
EP3078446B1 (en) * 2013-12-03 2020-02-05 Hiroshima University Method of manufacturing a solder material and joining structure
JP6543890B2 (ja) * 2014-04-14 2019-07-17 富士電機株式会社 高温はんだ合金
EP3797565A1 (en) 2018-05-20 2021-03-31 Abeyatech, LLC Light emitting diode for low temperature applications
CN113874159B (zh) * 2019-05-27 2023-06-02 千住金属工业株式会社 焊料合金、焊膏、焊球、焊料预制件、焊接接头和基板
CN112775580A (zh) * 2019-11-07 2021-05-11 罗伯特·博世有限公司 焊料、基板组件及其装配方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101232967B (zh) * 2005-08-11 2010-12-08 千住金属工业株式会社 电子部件用无铅焊膏、钎焊方法以及电子部件
CN101380701B (zh) * 2008-10-31 2010-11-03 河南科技大学 一种高温无铅软钎料及制备方法
CN103038020A (zh) * 2010-06-28 2013-04-10 住友金属矿山股份有限公司 无铅焊料合金
CN103038020B (zh) * 2010-06-28 2014-05-14 住友金属矿山股份有限公司 无铅焊料合金及使用其的电子基板
CN102321829B (zh) * 2011-10-24 2012-09-19 南京信息工程大学 一种无银低熔点锡铋系无铅焊料合金及其制备方法
CN102321829A (zh) * 2011-10-24 2012-01-18 南京信息工程大学 一种无银低熔点锡铋系无铅焊料合金及其制备方法
CN104703749A (zh) * 2013-01-28 2015-06-10 日本半田株式会社 用于芯片焊接的钎焊合金
CN103084750A (zh) * 2013-02-25 2013-05-08 重庆科技学院 一种电子封装用高熔点无铅钎料及其制备方法
CN103084750B (zh) * 2013-02-25 2016-07-06 重庆科技学院 一种电子封装用高熔点无铅钎料的制备方法
CN106392366A (zh) * 2016-12-02 2017-02-15 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法
CN106392366B (zh) * 2016-12-02 2019-07-19 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法
CN111132794A (zh) * 2018-08-31 2020-05-08 Ｊｘ金属株式会社 焊料合金
CN114905183A (zh) * 2022-05-11 2022-08-16 湘潭大学 一种Bi-Ag-Zn系无铅焊料及其制备方法和应用
CN114905183B (zh) * 2022-05-11 2024-04-09 湘潭大学 一种Bi-Ag-Zn系无铅焊料及其制备方法和应用

Also Published As

Publication number Publication date
US20040170524A1 (en) 2004-09-02
WO2002101105A1 (de) 2002-12-19
EP1266975A1 (de) 2002-12-18
JP2004528992A (ja) 2004-09-24

Similar Documents

Publication Publication Date Title
CN1463294A (zh) 无铅焊剂
TWI655052B (zh) 無鉛、無銻焊接合金、彼之用途、包含彼之焊接點，以及形成焊接點之方法
EP3062956B1 (en) Lead-free, silver-free solder alloys
KR100867871B1 (ko) 솔더 페이스트, 및 전자장치
JP4428448B2 (ja) 鉛フリーはんだ合金
RU2254971C2 (ru) Бессвинцовый припой
CN105393347B (zh) 接合体及功率模块用基板
JP5943066B2 (ja) 接合方法および接合構造体の製造方法
WO2018067426A1 (en) Advanced solder alloys for electronic enterconnects
CN114340835A (zh) 高温超高可靠性合金
KR102002675B1 (ko) 무연 땜납 합금
CN1188439A (zh) 焊料、用焊接法贴装的电子元件及电路板
KR101345940B1 (ko) 땜납, 납땜 방법 및 반도체 장치
JP5614507B2 (ja) Ｓｎ−Ｃｕ系鉛フリーはんだ合金
CN1905985A (zh) 无铅焊锡合金
HK1039916A1 (en) Lead-free solders
CN1445049A (zh) 焊锡膏、焊接成品及焊接方法
CN1558960A (zh) 用于高温无铅焊料的改良的组成物、方法和装置
JP3878978B2 (ja) 鉛非含有はんだ、および鉛非含有の継手
CN100589918C (zh) 焊锡及使用它的电路基板装置
CN1519076A (zh) 焊接方法、通过该焊接方法连接的元件和连接结构
JP2005052869A (ja) 高温はんだ付用ろう材とそれを用いた半導体装置
CN112951786B (zh) 焊料材料、层结构及其形成方法、芯片封装及其形成方法、芯片布置及其形成方法
CN1943030A (zh) 用于电互连的掺杂合金、其制造方法及其用途
CN1541804A (zh) 焊料膜制造方法，装备有焊料膜的散热装置，以及半导体器件与散热装置的连接体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication