HK1039916A1 - Lead-free solders. - Google Patents

Lead-free solders.

Info

Publication number
HK1039916A1
HK1039916A1 HK02101537A HK02101537A HK1039916A1 HK 1039916 A1 HK1039916 A1 HK 1039916A1 HK 02101537 A HK02101537 A HK 02101537A HK 02101537 A HK02101537 A HK 02101537A HK 1039916 A1 HK1039916 A1 HK 1039916A1
Authority
HK
Hong Kong
Prior art keywords
lead
free solders
solders
free
Prior art date
Application number
HK02101537A
Other versions
HK1039916B (en
Inventor
Jennie S Hwang
Zhenfeng Guo
Original Assignee
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/417,169 external-priority patent/US6176947B1/en
Application filed by Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Singapore Asahi Chemical & Solder Ind Pte Ltd
Publication of HK1039916A1 publication Critical patent/HK1039916A1/en
Publication of HK1039916B publication Critical patent/HK1039916B/en

Links

HK02101537.6A 1999-10-12 2002-02-27 Lead-free solders HK1039916B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/417,169 US6176947B1 (en) 1998-12-31 1999-10-12 Lead-free solders

Publications (2)

Publication Number Publication Date
HK1039916A1 true HK1039916A1 (en) 2002-05-17
HK1039916B HK1039916B (en) 2005-10-14

Family

ID=23652856

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101537.6A HK1039916B (en) 1999-10-12 2002-02-27 Lead-free solders

Country Status (4)

Country Link
CN (1) CN1208168C (en)
HK (1) HK1039916B (en)
SG (1) SG98429A1 (en)
TW (1) TW528638B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040187976A1 (en) 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
TWI242866B (en) 2003-08-21 2005-11-01 Siliconware Precision Industries Co Ltd Process of forming lead-free bumps on electronic component
CN100351035C (en) * 2005-10-28 2007-11-28 亚通电子有限公司 Lead free solder
CN101357423B (en) * 2005-12-16 2011-03-09 浙江亚通焊材有限公司 Lead-free welding material
CN1803381A (en) * 2006-01-11 2006-07-19 黄守友 Leadless soldering material and its preparation method
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
CN103146955B (en) * 2013-03-22 2015-01-07 天津百瑞杰焊接材料有限公司 198-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof
JP2015077601A (en) * 2013-04-02 2015-04-23 千住金属工業株式会社 Lead-free solder alloy
CN103341699A (en) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal
JP6135885B2 (en) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 Solder alloy and mounting structure using the same
JP6230737B1 (en) * 2017-03-10 2017-11-15 株式会社タムラ製作所 Lead-free solder alloy, solder paste and electronic circuit board
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
CN107990708B (en) * 2017-11-28 2020-09-29 乐山新天源太阳能科技有限公司 Conveying device for drying area in silicon wafer sintering furnace
JP6936926B1 (en) 2021-03-10 2021-09-22 千住金属工業株式会社 Solder alloys, solder powders, solder pastes, and solder fittings
CN113070606A (en) * 2021-04-15 2021-07-06 云南锡业锡材有限公司 Sn-Ag-Cu high-performance lead-free solder and preparation method thereof
CN115476069A (en) * 2022-10-28 2022-12-16 云南锡业集团（控股）有限责任公司研发中心 Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness
CN117139917B (en) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 Lead-free solder for automobile glass and preparation method and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JPH10193171A (en) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd Soldering article
JP3736819B2 (en) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 Lead-free solder alloy
JPH10314980A (en) * 1997-05-14 1998-12-02 Sony Corp Solder material
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy

Also Published As

Publication number Publication date
HK1039916B (en) 2005-10-14
SG98429A1 (en) 2003-09-19
CN1314229A (en) 2001-09-26
CN1208168C (en) 2005-06-29
TW528638B (en) 2003-04-21

Similar Documents

Publication Publication Date Title
HUP0301858A3 (en) Lead-free solders
MXPA01013362A (en) ANTI-alphav.
HK1052037A1 (en) Structural member.
ZA200200477B (en) 2-pyrazolin-5-ones.
AU6055098A (en) Lead-free solder
ZA200204283B (en) Novel antidiabetic agents.
EG24361A (en) 4-pyrimiding1-n-acy1.l.phenlalanines
ZA200108687B (en) Enhanced herbicide compositions.
ZA200202537B (en) Pour-on-formulations.
SG97811A1 (en) Fluxing adhesive
HK1039916A1 (en) Lead-free solders.
ZA200203762B (en) 4-pyridinyl-IN-acyl-L-phenylalanines.
HK1029502A1 (en) Slider-pull-assembling unit.
ZA200204325B (en) Area Denial.
IL132555A0 (en) Lead-free solder
HK1034298A1 (en) Scaffolding.
HK1032814A1 (en) Absorber.
ZA200202486B (en) Set defence means.
ZA200108481B (en) 8A- and 9A-15-membered lactams.
MXPA02000261A (en) Novel aminoindanes.
GB0029720D0 (en) I.S machine7544232001
GB2345453B (en) Laminated reflow soldering
GB9914192D0 (en) Soldering flux
ZA200204581B (en) Nitro-sulfobenzamides.
HK1031254A1 (en) Tachogragh.