CN1208168C - Lead-free welding material - Google Patents
Lead-free welding material Download PDFInfo
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- CN1208168C CN1208168C CN 00135326 CN00135326A CN1208168C CN 1208168 C CN1208168 C CN 1208168C CN 00135326 CN00135326 CN 00135326 CN 00135326 A CN00135326 A CN 00135326A CN 1208168 C CN1208168 C CN 1208168C
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Abstract
Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215 DEG C.
Description
Technical field
The application is that the part of the sequence number US No.09/224323 of submission on December 31st, 1998 continues.
The leadless welding alloy that the present invention relates to be used to weld and weld mutually.Particularly relate to the no lead composition that comprises effective dose tin, copper, silver, bismuth, antimony and/or indium and have the fusion temperature between 175-215 ℃.This alloy is specially adapted to microelectronics and electronic applications.
Background technology
Although the Pb-Sn solder alloy is successful at present in electronics industry, because the plumbous toxicity and the whole world are controlled or banned use of lead, it is faced with a restricted future.So the whole world is initiated many instrument of advocating and is sought suitable leadless welding alloy replacement Pb-Sn solder alloy.Simultaneously, need the lead-free alloy of high-intensity high antifatigue, satisfy the needs of integrated circuit (IC) and the development of IC package technique with the performance that improves solder joint.
At fabricated electronic system, solder alloy is welded into nude film or assembling sheet the substrate of next level by the intermetallic band metallurgy of form wishing.Generally be used for welding zone, form the prerequisite of reliable solder joint as the instantaneous mobile and rationally moistening suitable solder flux that is the use electronic system allows in High-Speed Automatic process for making of Cu, Ag, Au, Pd, Ni and other metallized solder alloy in metal surface.
Surface-mounted technology is littler, finer and close, the demanding manufacturing technology in the printed circuit board (PCB) (PCB) faster can make hyundai electronics producing.The Pb-Sn quick solder of 63Sn/37 Pb is widely used in electronic device assembling, particularly surface-mounted printed circuit board (PCB).This scolder provides other critical physical property, i.e. Shi Du fusion temperature.Particularly be lower than 210 ℃.Except eutectic composition, the fusion temperature of alloy is usually in the scope of liquidus curve and solidus temperature regulation.Alloy begins to soften and melt fully at its liquidus temperature in its solidus temperature.Welding must be carried out in the temperature on the liquidus temperature of solder alloy.
The actual welding technological temperature of surface-mounted manufacturing environment can reach the above temperature at least about 25 ℃ of solder alloy liquidus temperature, and for example, the solder alloy that liquidus temperature is 210 ℃ is minimum should be 235 ℃ of welding.The fusion temperature of solder alloy is conditional, will destroy electronic instrument and polymer base PCB at weld period because fusion temperature is too high, and the too low long-term reliability that will sacrifice welding of fusion temperature.For comprising typical polymers base PCB, as the circuit board manufacturing of FR-4, in fact technological temperature is no more than 240 ℃.Therefore, can replace 63Sn/37Pb and the leadless welding alloy that works must have and is lower than 215 ℃, preferably about 210 ℃ liquidus temperature in surface-mounted technology.
In electronic system, as doing electricity, heat, mechanically interconnected will the welding in telecommunication, computer, aviation electronics and the autoelectrinic instrument.In length of life, solder joint is subjected to resulting from the thermal stress of temperature change, electric power on/off and/or rigorous environment condition inevitably.The thermal expansion that is accompanied by in the interconnection material of semiconductor, pottery, metal and polymer in this system does not match, and causes the solder joint thermal mechanical fatigue.Because circuit is fine and close further and the microcomputer impulse speed reaches the frequency of more increasing continuously, be exactly to suppress the heat dissipation to increase therefore to electronic system design and one of obvious influence that is used for the electronic system material.
In addition, the solder joint number on each PCB continues to increase.It is unrare that several thousand or several ten thousand solder joints are arranged on PCB.But any one solder joint damage can cause system failure.Therefore, need to improve the intensity and the fatigue resistance of solder joint.Present high pin joint integrated circuit (IC) assembling as ball grillages row (BGA), chip level assembling (CSP) and direct sheet interconnection technique, needs the more solder alloy of high antifatigue more as the development of flip-chip.
Many lead-free solders have been proposed in the prior art.The summary of these lead-free alloys is summarized in 15 chapters of " Modern Solder Technology for Competitive Electronics Manufacturing " book.
U.S. Patent No. 5328660 (people such as Gonya, LEAD-FREE, HIGHTEMPERATURE, TIN BASED, MULTI-COMPONENT SOLDER) has been narrated composition 78.4Sn 2Ag 9.8Bi 9.8In.But the fatigue resistance of this alloy is poor.
U.S. Patent No. 5527628 (people such as Anderson, PB-FREE SN-AG-CUTERNARY EUTECTIC SOLDER) has been narrated composition 93.6Sn 4.7Ag 1.7Cu, and its fusion temperature is 217 ℃.Also high relatively and its fatigue resistance reduction of the fusion temperature of this alloy.
U.S. Patent No. 5520752 (people such as Lucey, COMPOSITE SOLDERS) has been narrated a kind of 86-97%Sn of comprising, 0.3-4.5%Ag, the leadless welding alloy of 0-9.3%B and 0-5%Cu.This alloy fatigue resistance reduces.
U.S. Patent No. 5538686 (people such as Chen, ARTICLE COMPRISING a PB-FREESOLDER HAVING IMPROVED MECHANICAL PROPERTIES) having narrated a kind of fusion temperature is 173-197 ℃, comprise＞70%Sn, 6-10%Zn, 3-10%In,＜10%Bi,＞5%Ag and＜leadless welding alloy of 5%Cu.This alloy is not moistening substrate commonly used under electronic mounting and assembly environment.
U.S. Patent No. 5580520 (people such as Slattery, LEAD-FREE ALLOYCONTAINING TIN, SILVER AND INDIUM) has been narrated composition 77.2Sn 2.8Ag 20In, and its fusion temperature is 179-189 ℃.The fatigue resistance of this alloy is low.
In a word, these formerly each of lead-free solder can not fully work so that in electronic mounting and assembly industry, form in the reliable solder joint at least a field deficiency.
Summary of the invention
Therefore, first purpose of the present invention provides a kind of lead-free solder.An advantage of the invention is provides a kind of lead-free solder, and it gives high strength and high antifatigue, so that stand more harmful in microelectronics and electronic applications and exacting terms.
Additional benefit of the present invention provides a kind of lead-free solder, and it has for being mainly used in electronics makes appropriate melting temperature scope (175-210 ℃).
Another advantage of the present invention provides a kind of lead-free solder, and it can easily moistening common metal substrate such as Sn, Cu, Ag, Au, Pd and Ni in microelectronics and electronics are made, and to form safe and reliable solder joint, does not have electronics to make unacceptable solder flux.
Another advantage of the present invention provides a kind of lead-free solder, and it can adapt to the electronic fabrication processes and the structure of formulation, does not need material, technology and component that big variation is arranged.
Another object of the present invention and advantage are that part as described below shows and conspicuous or can be put into practice by the present invention and acquire from this narration part.The object of the invention and advantage can reach by means of method and the combination thereof that claims particularly point out.
Achieve the above object and according to target of the present invention, comprise and summarize narration as this paper, solder alloy of the present invention has as the Cu of the Sn of principal component and effective dose, Ag, Bi, In and Sb.This scolder demonstrates compatible fusion temperature, good wettability, high intensity and high fatigue resistance.
Description of drawings
Fig. 1 illustrates solder alloy: 82.3Sn 0.5Cu 3Ag 2.2Bi 12In is at the function of 235 ℃ of wetting powers (mN) on the Cu sample as the moistening time.
The specific embodiment of the present invention
When of the present invention, understanding to the invention is not restricted to embodiment with embodiment preferred narration.
The invention provides and have with the fusion temperature of regulation printed circuit board (PCB) manufacturing structure compatibility, the leadless welding alloy of high strength, high antifatigue, high humidity lubricant nature.Solder alloy of the present invention comprises about 76-96 weight %Sn, 0.2-2.5 weight %Cu, 2-4.5 weight %Ag, 0-12 weight %In, 0-5 weight %Bi and 0-2 weight %Sb.Preferably this composition comprises at least 2.0 weight %In.Preferably this composition comprises at least 0.5 weight %Bi, and better this composition comprises greater than 0 weight %Sb, more preferably greater than 0.01 weight %Sb.
In a particularly preferred form, the present invention comprises about 81-93%Sn, 0.2-1.0%Cu, 2.5-4.5%Ag and 6-12%In.In the further preferred form of the present invention, this composition comprises about 81-90%Sn,＞0-1.0%Cu, 2.5-4.5Ag, 6-12In and＞0%Sb.Another embodiment of the invention composition comprises 81-85%Sn,＞0-1.0%Cu, 2.5-4.5%Ag, 6-12%In and 0.5-3.5%Bi.An other embodiments composition comprises 90-96%Sn,＞0-2.5Cu, 2.0-3.5%Ag, and 0.5-5.0%Bi.Unless otherwise prescribed, whole percentage are weight percent in specification and claims.
Have now found that suitable amounts Cu and Ag combination not only improve fatigue resistance, and reduce fusion temperature.In the preferred form of the present invention, having only 0.5%Cu is the effective dose that reduces the alloy melting temperature.The variation of the fusion temperature of the alloy of 0.5-2.5%Cu is within 1 ℃.Cu greater than 2.5% suppresses the liquation flowability, so that cause the castability deficiency.For example, the fusion temperature of the alloy of 0.5%Cu (83.4Sn/0.5Cu/4.1Ag/12In) (185-195 ℃) is hanged down about 5 ℃ than the fusion temperature (190-200 ℃) of no Cu alloy (83.9Sn/4.1Ag/12In).Fusion temperature 195-201 ℃ of the alloy of 0.5%Cu (87.4Sn/0.5Cu/4.1Ag/8In)) fusion temperature (195-201 ℃) with the alloy (87Sn/2Cu/3Ag/8In) of 2%Cu is identical.Have only 0.5%Cu still to improve the effective dose of fatigue resistance.Along with Cu further being improved up to about 2%, the plasticity straight line reduces, and fatigue life, index descended.For example, the plasticity of the alloy (86.1Sn/1.6Cu/4.3Ag/8In) of the plasticity of the alloy of 0.5%Cu (87.4Sn/0.5Cu/4.1Ag/8In) and fatigue life ratio 1.6%Cu and fatigue life distinguish high 206% and 146%.The plasticity of the plasticity of the alloy of 0.5%Cu (83.4Sn/0.5Cu/4.1Ag/12In) and fatigue life ratio 1.5%Cu alloy (82.4Sn/1.5Cu/4.1Ag/12In) and fatigue life distinguish high 250% and 174%.
The 3%Ag that only has an appointment is the effective dose that reduces the alloy melting temperature.3-4.5Ag the variation of fusion temperature of alloy within 1 ℃.For example, the fusion temperature of the alloy of 3%Ag (88.5Sn/0.5Cu/3Ag/8In) (196-202 ℃) is hanged down about 10 ℃ than the fusion temperature (208-212 ℃) of no Ag alloy (91.5Sn/0.5Cu/8In), but identical approximately with the fusion temperature (190-201 ℃) of the alloy (87.4Sn/0.5Cu/4.1Ag/8In) of 4.1%Ag.
Add In and can reduce fusion temperature by the about 1.8 ℃ speed straight line of every percetage by weight up to about 12%.Along with In up to about 8%, the intensity straight line of alloy increases, fatigue life, index increased.For a superior fatigue resistance, 8-10%In is an optimum content.For example, the alloy of 8%In (87.4Sn/0.5Cu/4.1Ag/8In) hangs down 6 ℃ than alloy (91.4Sn/0.5Cu/4.1Ag/4In) fusion temperature of 4%In, and intensity is high by 126%, and fatigue life is high by 175%.12%In is the critical point that more softening In second phase obviously occurs at 113 ℃.For example, the alloy of 12%In (83.4Sn/0.5Cu/4.1Ag/12In) is than the alloy (85.4Sn/0.5Cu/4.1Ag/12In) of 10%In, and fatigue life is low by 219%, intensity low 118%.
For minimum may fusion temperature and have the fatigue resistance that some high request purposes are satisfied with.The alloy of In content high relatively (6-12%) can further be strengthened by Bi.For example, the alloy of 12%In and 2.2%Bi (82.3Sn/0.5Cu/3Ag/2.2Bi/12In) is higher by 130% than alloy (83.4Sn/0.5Cu/4.1Ag/12In) intensity that 12%In does not have Bi, low about 2 ℃ of fusion temperature (183-193 ℃).For acceptable plasticity and fatigue resistance, Bi maximum possible content should be less than 5%.For example, significantly are reduced to the plasticity of alloy (79.5Sn/0.5Cu/3Ag/5Bi/12In) and fatigue life the level such as low of 63Sn/37Pb alloy.
Contain the In solder alloy and also can pass through a small amount of Sb, for example 0.5% further strengthens, and does not significantly improve fusion temperature to reach high antifatigue.For example, the alloy of 12%In and 0.5%Sb (84Sn/0.5Cu/3Ag/2.2Bi/12In/0.5%Sb) does not have the alloy (83.4Sn/0.5Cu/4.1Ag/12In) of Sb than 12%In, and intensity is high by 113%, and fatigue life is high by 160%.But In alloy Sb is too high will to improve fusion temperature for containing, and reduce plasticity and fatigue life, and reduce the wettability to Cu.For example, 12%In and 0.5%Sb alloy (84Sn/0.5Cu/3Ag/12In/0.5Sb) are than 2%Sb alloy (82.5Sn/0.5Cu/4.1Ag/12In/2Sb), and fusion temperature is hanged down 4 ℃, and plasticity is high by 212%, and fatigue life is high by 125%.
According to basic theory, Cu, Ag and Sb are the metals that forms intermetallic compound with Sn.Cu forms Cu
6Sn
5Particle, Ag forms Ag
3The Sn particle, and Sb forms SnSb cube of brilliant particle.These intermetallic compound particles itself are more much higher than Sn matrix strength, and are the effective obstructions to crack Propagation.Say that indirectly the formation of the particle of multiple intermetallic compound is partitioned into a more tiny Sn matrix grain tissue.The more tiny crystal grain that intermetallic compound causes in the Sn matrix promotes crystal boundary to move and prolongs fatigue life.
In enters in the Sn matrix lattice to replace solute atoms.This solute In can strengthen solid solution and promote good slipping property, so that improve the fatigue rupture ability.
Bi enters in the Sn matrix lattice up to about 1 weight % to replace solute atoms.Exceed about 1 weight %, Bi can be used as the second phase particle and separates out.So Bi can provide solution strengthening and precipitation-hardening.Bi solute reinforced portion also promotes good slipping property, so that improve the fatigue rupture ability of Sn matrix.
Comparing with the 2.5-4.5%Ag of other system of any In of containing, is critical value for the Ag of the solder alloy 2.5-3.5% of Sn/Ag/Bi system content.Ag content causes alloy embrittlement above 3.5% in the Sn/Cu/Ag/Bi system.For example, the alloy (90.5Sn/1.7Cu/4.7Ag/3.1Bi) of the fatigue life of the alloy of 3.1Ag (93.3Sn/0.5Cu/3.1Ag/3.1Bi) and plasticity ratio 4.7%Ag difference high about 152% and 138%.Ag content 2.5% provides the minimum of a value of superior fatigue resistance.Be lower than 2.5%, fatigue resistance reduces.For example, the alloy (93Sn/2Cu/2Ag/3Bi) of alloy (93.3Sn/0.5Cu/3.1Ag/3.1Bi), (92.2Sn/1.5Cu/3.2Ag/3.1Bi) and fatigue life ratio 2%Ag (91.5Sn/2Cu/3.4Ag/3.1Bi) difference high about 538%/366% and 281%.
But in office what it contains in the system of In, and In will or absorb some Ag with the Ag reaction and form AgIn
2Intermetallic compound, even compd A g Sn In between ternary metal.So for good plasticity and fatigue life, what its maximum level of containing Ag in the In system in office can allow for 4.5%.Any higher consumption will further not reduce fusion temperature, and will increase fragility.For example, under identical fusion temperature, alloy (84Sn/0.5Cu/3.1Ag/12In/0.5Sb) is higher by 131% than the plasticity of alloy (81.1Sn/1.7Cu/4.7Ag/12In/0.5Sb).
For datum target, think the fusion temperature of 63Sn/37Pb scolder at about 183 ℃, ultimate tensile strength is 47Mpa, is 3650 weeks at the low-cycle fatigue life of 0.2% strain.Be respectively 227 ℃, 24Mpa and 1125 weeks fusion temperature, tensile strength and the fatigue life of known 99.3Sn0.7Cu solder alloy.Be respectively 221 ℃, 35Mpa and 4186 weeks fusion temperature, tensile strength and the fatigue life of known 96.5Sn3.5Ag solder alloy.
Solder alloy tensile strength of the present invention is 50Mpa at least, better 60Mpa, at the low-cycle fatigue life of 0.2% strain at least about 5000 weeks, better about 10000 weeks, the solidus fusion temperature is between about 175-215 ℃, better less than 210 ℃, and the liquidus curve fusion temperature is between about 185-215 ℃, better less than 210 ℃.
In an embodiment preferred of the present invention, provide a kind of (solder alloy of 87.4%Sn, 0.5%Cu, 4.1%Ag and 8%In approximately that comprises.About 195-201 ℃ of this alloy melting temperature.Are respectively this tensile strength of alloys and fatigue life 63Mpa and 17152 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 470%, and tensile strength high by 134% than 63Sn/37Pb.
In another embodiment preferred of the present invention, provide a kind of about 85.4%Sn that comprises, 0.5%Cu, the solder alloy of 4.1%Ag and 10%In.About 194-199 ℃ of this alloy melting temperature.Are respectively this tensile strength of alloys and fatigue life 66Mpa and 17378 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 476%, and tensile strength high by 140% than 63Sn/37Pb.
In another embodiment preferred of the present invention, provide a kind of about 84%Sn that comprises, 0.5%Cu, 3%Ag, the solder alloy of 0.5%Sb and 12%In.This alloy melting temperature is 186-196 ℃.Are respectively this tensile strength of alloys and fatigue life 58Mpa and 12345 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 338%, and tensile strength high by 123% than 63Sn/37Pb.
In another embodiment preferred of the present invention, provide a kind of about 82.3%Sn that comprises, 0.5%Cu, 3%Ag, the solder alloy of 2.2%Bi and 12%In.This alloy melting temperature is about 183-193 ℃.Are respectively this tensile strength of alloys and fatigue life 77Mpa and 8722 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 239%, and tensile strength high by 164% than 63Sn/37Pb.
In another embodiment preferred of the present invention, provide a kind of about 92%Sn that comprises, 2%Cu, the solder alloy of 3%Ag and 3%Bi.The fusion temperature of this alloy is about 209-212 ℃.Are respectively this tensile strength of alloys and fatigue life 89Mpa and 8135 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 223%, and tensile strength high by 189% than 63Sn/37Pb.
In another embodiment preferred of the present invention, provide a kind of about 83.4%Sn that comprises, 0.5%Cu, the solder alloy of 4.1%Ag and 12%In.This alloy melting temperature is about 185-195 ℃.Are respectively this tensile strength of alloys and fatigue life 56Mpa and 7950 weeks.The fatigue life ratio 63Sn/37Pb's of alloy of the present invention is high by 218%, and tensile strength high by 119% than 63Sn/37Pb.
Prove as wet balanced test (Fig. 1), the instantaneous mobile and welding rationally that occurs in above-mentioned each embodiment is better than according to industrial standard, as American Nationa 1 Standard Institute, ANSI-STD-002 and ANSI-STD-003 are to the requirement of wetting power.Moistening auxiliary agent is disactivation rosin or little activation rosin or non-pure auxiliary agent.
According to the wettability of ANSI-STD-002 and ANSI-STD-003, at 2.0 seconds (F
1) and 5.0 seconds wetting power surpass 4.809mN, and the moistening time (t2/3) that reaches 2/3 maximum wetting power is not more than 1.0 seconds.The dewetting area is less than 5%.Embodiment as shown in Figure 1, the solder alloy of composition 82.3%Sn of the present invention, 0.5%Cu, 3%Ag, 2.2%Bi, 12%In shows:
F
1＝5.98mN
F
2＝6.10mN
T2/3=0.72 second
Dewetting=0%
Under the main component molten state, can prepare the above-mentioned leadless welding alloy of the present invention by general heating technique well known in the prior art.This alloy can also various physical form, use as paste, powder, rod and silk, or in any welding procedure, and add hot weld, use in fluctuate mechanical welding and the manual welding as backflow, or in any materials processing, as using in various spraying platings and the coating technology.
When the present invention narrates according to embodiment preferred, know that very its changes and improvements are conspicuous for those of skill in the art of the prior art.The above-mentioned open scope of the invention that do not limit.
Claims (2)
1. leadless welding alloy, it consists of 76-96%Sn, 0.2-2.5%Cu, 4.1%Ag and＞2-12%In, and have the liquidus curve fusion temperature that is lower than 215 ℃.
2. leadless welding alloy, it consists of 76-96%Sn, 0.2%-0.5%Cu, 2.5-4.5%Ag,＞0-12%In, 0.5%-5.0%Bi and 0.01%-2%Sb.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/417,169 US6176947B1 (en) | 1998-12-31 | 1999-10-12 | Lead-free solders |
| US09/417169 | 1999-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1314229A CN1314229A (en) | 2001-09-26 |
| CN1208168C true CN1208168C (en) | 2005-06-29 |
Family
ID=23652856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00135326 Expired - Lifetime CN1208168C (en) | 1999-10-12 | 2000-10-12 | Lead-free welding material |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN1208168C (en) |
| HK (1) | HK1039916B (en) |
| SG (1) | SG98429A1 (en) |
| TW (1) | TW528638B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107990708A (en) * | 2017-11-28 | 2018-05-04 | 乐山新天源太阳能科技有限公司 | The transmission device of baking zone in silicon wafer sintering stove |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040187976A1 (en) | 2003-03-31 | 2004-09-30 | Fay Hua | Phase change lead-free super plastic solders |
| TWI242866B (en) | 2003-08-21 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Process of forming lead-free bumps on electronic component |
| CN100351035C (en) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | Lead free solder |
| CN101357423B (en) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | Lead-free welding material |
| CN1803381A (en) * | 2006-01-11 | 2006-07-19 | 黄守友 | Leadless soldering material and its preparation method |
| US8598464B2 (en) | 2009-04-20 | 2013-12-03 | Panasonic Corporation | Soldering material and electronic component assembly |
| CN103146955B (en) * | 2013-03-22 | 2015-01-07 | 天津百瑞杰焊接材料有限公司 | 198-DEG C lead-free low-temperature alloy for fuse burned-out core and preparation method thereof |
| JP2015077601A (en) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | Lead-free solder alloy |
| CN103341699A (en) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal |
| JP6135885B2 (en) * | 2015-05-19 | 2017-05-31 | パナソニックＩｐマネジメント株式会社 | Solder alloy and mounting structure using the same |
| JP6230737B1 (en) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | Lead-free solder alloy, solder paste and electronic circuit board |
| US11577343B2 (en) * | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
| JP6936926B1 (en) | 2021-03-10 | 2021-09-22 | 千住金属工業株式会社 | Solder alloys, solder powders, solder pastes, and solder fittings |
| CN113070606A (en) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | Sn-Ag-Cu high-performance lead-free solder and preparation method thereof |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
| CN117139917B (en) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | Lead-free solder for automobile glass and preparation method and application thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
| JPH10193171A (en) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | Soldering article |
| JP3736819B2 (en) * | 1997-01-17 | 2006-01-18 | 株式会社豊田中央研究所 | Lead-free solder alloy |
| JPH10314980A (en) * | 1997-05-14 | 1998-12-02 | Sony Corp | Solder material |
| US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
-
2000
- 2000-10-11 SG SG200005828A patent/SG98429A1/en unknown
- 2000-10-12 TW TW089121619A patent/TW528638B/en not_active IP Right Cessation
- 2000-10-12 CN CN 00135326 patent/CN1208168C/en not_active Expired - Lifetime
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2002
- 2002-02-27 HK HK02101537.6A patent/HK1039916B/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107990708A (en) * | 2017-11-28 | 2018-05-04 | 乐山新天源太阳能科技有限公司 | The transmission device of baking zone in silicon wafer sintering stove |
| CN107990708B (en) * | 2017-11-28 | 2020-09-29 | 乐山新天源太阳能科技有限公司 | Conveying device for drying area in silicon wafer sintering furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1039916B (en) | 2005-10-14 |
| CN1314229A (en) | 2001-09-26 |
| HK1039916A1 (en) | 2002-05-17 |
| TW528638B (en) | 2003-04-21 |
| SG98429A1 (en) | 2003-09-19 |
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