CN1446742A - 基板的输送方法及其装置 - Google Patents

基板的输送方法及其装置 Download PDF

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Publication number
CN1446742A
CN1446742A CN02142211A CN02142211A CN1446742A CN 1446742 A CN1446742 A CN 1446742A CN 02142211 A CN02142211 A CN 02142211A CN 02142211 A CN02142211 A CN 02142211A CN 1446742 A CN1446742 A CN 1446742A
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China
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mentioned
travel line
individual
substrate
conveying
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Pending
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CN02142211A
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English (en)
Chinese (zh)
Inventor
内牧阳一
江川优子
加治哲德
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Publication of CN1446742A publication Critical patent/CN1446742A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
CN02142211A 2002-03-26 2002-08-23 基板的输送方法及其装置 Pending CN1446742A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002086199A JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法
JP086199/2002 2002-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNA2004100644876A Division CN1583532A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Publications (1)

Publication Number Publication Date
CN1446742A true CN1446742A (zh) 2003-10-08

Family

ID=28449293

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2004100644876A Pending CN1583532A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置
CN02142211A Pending CN1446742A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNA2004100644876A Pending CN1583532A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置

Country Status (5)

Country Link
US (1) US6979168B2 (enExample)
JP (1) JP4220173B2 (enExample)
KR (2) KR20030077922A (enExample)
CN (2) CN1583532A (enExample)
TW (1) TW583129B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
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CN100409273C (zh) * 2004-02-13 2008-08-06 爱德牌工程有限公司 用于制造平板显示器的设备
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
CN102122610A (zh) * 2009-12-10 2011-07-13 奥博泰克Lt太阳能公司 自动排序的流水线处理设备
CN1929107B (zh) * 2005-09-08 2012-05-30 周星工程股份有限公司 可移动转移腔室和包括可移动转移腔室的衬底处理装置
CN104600003A (zh) * 2013-10-31 2015-05-06 细美事有限公司 基板处理设备
US9462921B2 (en) 2011-05-24 2016-10-11 Orbotech LT Solar, LLC. Broken wafer recovery system
CN114220754A (zh) * 2021-12-14 2022-03-22 拓荆科技股份有限公司 一种基片处理装置
CN115943113A (zh) * 2020-06-22 2023-04-07 克朗斯股份公司 用于在容器处理设备中缓冲容器的方法和装置

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WO2006046580A1 (ja) 2004-10-25 2006-05-04 Tokyo Electron Limited 搬送システム、基板処理装置、及び搬送方法
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JP4221603B2 (ja) * 2005-03-31 2009-02-12 村田機械株式会社 天井走行車システム
JP4805258B2 (ja) * 2005-04-22 2011-11-02 ローツェ株式会社 カセット搬送システム
US7798759B2 (en) * 2005-05-16 2010-09-21 Muratec Automation Co., Ltd. Modular terminal for high-throughput AMHS
US7798758B2 (en) * 2005-11-07 2010-09-21 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
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JP4200387B2 (ja) 2006-04-14 2008-12-24 村田機械株式会社 搬送システム
KR101841753B1 (ko) * 2006-08-18 2018-03-23 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7925502B2 (en) * 2007-03-01 2011-04-12 Microsoft Corporation Pitch model for noise estimation
CN101835922B (zh) * 2007-10-24 2012-05-02 Oc欧瑞康巴尔斯公司 用于制造工件的方法和装置
TWI368271B (en) * 2008-07-02 2012-07-11 Powertech Technology Inc Equipment and method for cutting big size wafer
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
JP5361002B2 (ja) 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
KR101649810B1 (ko) * 2012-04-16 2016-08-30 아르멘 바르다니얀 중력 컨베이어
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
CN103101704B (zh) * 2013-02-28 2015-10-21 上海和辉光电有限公司 自动派工方法
US9411332B2 (en) * 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
JP6539558B2 (ja) * 2015-10-05 2019-07-03 リンテック株式会社 処理装置
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
JP6987693B2 (ja) * 2018-04-27 2022-01-05 株式会社荏原製作所 検査方法、検査装置、及びこれを備えためっき装置
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KR102483600B1 (ko) * 2020-02-05 2022-12-30 가부시키가이샤 야스카와덴키 반송 시스템, 반송 방법 및 반송 장치
WO2021234928A1 (ja) 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100409273C (zh) * 2004-02-13 2008-08-06 爱德牌工程有限公司 用于制造平板显示器的设备
US8328940B2 (en) 2004-03-24 2012-12-11 Jusung Engineering Co., Ltd. Apparatus for transferring a substrate
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
CN1929107B (zh) * 2005-09-08 2012-05-30 周星工程股份有限公司 可移动转移腔室和包括可移动转移腔室的衬底处理装置
US9287152B2 (en) 2009-12-10 2016-03-15 Orbotech LT Solar, LLC. Auto-sequencing multi-directional inline processing method
CN102122610A (zh) * 2009-12-10 2011-07-13 奥博泰克Lt太阳能公司 自动排序的流水线处理设备
CN102122610B (zh) * 2009-12-10 2016-06-15 奥博泰克Lt太阳能公司 自动排序的流水线处理设备
US9462921B2 (en) 2011-05-24 2016-10-11 Orbotech LT Solar, LLC. Broken wafer recovery system
CN104600003A (zh) * 2013-10-31 2015-05-06 细美事有限公司 基板处理设备
US9685357B2 (en) 2013-10-31 2017-06-20 Semes Co., Ltd. Apparatus for treating substrate
CN115943113A (zh) * 2020-06-22 2023-04-07 克朗斯股份公司 用于在容器处理设备中缓冲容器的方法和装置
CN114220754A (zh) * 2021-12-14 2022-03-22 拓荆科技股份有限公司 一种基片处理装置
CN114220754B (zh) * 2021-12-14 2025-04-22 拓荆科技股份有限公司 一种基片处理装置

Also Published As

Publication number Publication date
JP2003282669A (ja) 2003-10-03
KR20030077922A (ko) 2003-10-04
US20030185655A1 (en) 2003-10-02
CN1583532A (zh) 2005-02-23
US6979168B2 (en) 2005-12-27
KR20050010998A (ko) 2005-01-28
TW583129B (en) 2004-04-11
JP4220173B2 (ja) 2009-02-04
KR100599987B1 (ko) 2006-07-13

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