CN1421999A - 双工器和使用此双工器的电子设备 - Google Patents
双工器和使用此双工器的电子设备 Download PDFInfo
- Publication number
- CN1421999A CN1421999A CN02152882A CN02152882A CN1421999A CN 1421999 A CN1421999 A CN 1421999A CN 02152882 A CN02152882 A CN 02152882A CN 02152882 A CN02152882 A CN 02152882A CN 1421999 A CN1421999 A CN 1421999A
- Authority
- CN
- China
- Prior art keywords
- duplexer
- multilayer encapsulation
- phase matched
- grounding pattern
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 86
- 238000010897 surface acoustic wave method Methods 0.000 claims description 63
- 238000009434 installation Methods 0.000 claims description 21
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- 238000004519 manufacturing process Methods 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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- 230000005236 sound signal Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP359567/2001 | 2001-11-26 | ||
JP2001359567A JP3818896B2 (ja) | 2001-11-26 | 2001-11-26 | 分波器及びこれを用いた電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1421999A true CN1421999A (zh) | 2003-06-04 |
CN100397782C CN100397782C (zh) | 2008-06-25 |
Family
ID=19170549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021528829A Expired - Fee Related CN100397782C (zh) | 2001-11-26 | 2002-11-26 | 双工器和使用此双工器的电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6919778B2 (zh) |
JP (1) | JP3818896B2 (zh) |
KR (1) | KR100593339B1 (zh) |
CN (1) | CN100397782C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7579927B2 (en) | 2004-12-22 | 2009-08-25 | Fujitsu Media Devices Limited | Duplexer |
CN1638274B (zh) * | 2004-01-08 | 2011-06-15 | 太阳诱电株式会社 | 表面声波器件 |
CN109300881A (zh) * | 2017-07-25 | 2019-02-01 | 矽品精密工业股份有限公司 | 电子封装件暨基板结构与制法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030087869A (ko) * | 2002-05-10 | 2003-11-15 | 엘지이노텍 주식회사 | 세라믹 패키지 |
JP3778902B2 (ja) * | 2003-04-28 | 2006-05-24 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP3967289B2 (ja) * | 2003-04-30 | 2007-08-29 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP4381113B2 (ja) * | 2003-11-27 | 2009-12-09 | 三洋電機株式会社 | アンテナ共用器 |
JP2005260915A (ja) | 2004-02-09 | 2005-09-22 | Murata Mfg Co Ltd | 分波器、通信機 |
JP3910187B2 (ja) * | 2004-04-27 | 2007-04-25 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JPWO2005107068A1 (ja) | 2004-04-30 | 2008-03-21 | 三洋電機株式会社 | フィルターデバイス用基体及びフィルターデバイス |
JP4634861B2 (ja) * | 2004-05-27 | 2011-02-16 | 京セラ株式会社 | 弾性表面波装置及び通信機器 |
WO2006040923A1 (ja) * | 2004-10-08 | 2006-04-20 | Murata Manufacturing Co., Ltd. | 分波器 |
DE102007046728B4 (de) | 2007-09-28 | 2013-08-22 | Epcos Ag | Elektrisches Bauelement |
KR101032809B1 (ko) * | 2009-10-23 | 2011-05-04 | 신동구 | 가변 구동 축선의 커터를 갖는 장식장 문짝의 유리 끼움 홈 가공장치 |
JP5018858B2 (ja) | 2009-10-27 | 2012-09-05 | 株式会社村田製作所 | 高周波モジュール |
JP5583612B2 (ja) | 2011-01-31 | 2014-09-03 | 太陽誘電株式会社 | 分波器 |
CN103441746B (zh) * | 2013-09-02 | 2017-03-15 | 扬州大学 | 声表面波滤波器集成封装结构及其封装方法 |
JP2014082800A (ja) * | 2014-02-12 | 2014-05-08 | Kyocera Corp | 弾性波装置、実装体および携帯電話端末装置 |
EP2978069B1 (en) | 2014-07-24 | 2023-11-01 | Ignion, S.L. | Slim radiating systems for electronic devices |
US10200013B2 (en) * | 2016-02-18 | 2019-02-05 | X-Celeprint Limited | Micro-transfer-printed acoustic wave filter device |
US10361677B2 (en) | 2016-02-18 | 2019-07-23 | X-Celeprint Limited | Transverse bulk acoustic wave filter |
JP6673764B2 (ja) * | 2016-03-29 | 2020-03-25 | 京セラ株式会社 | 半導体素子実装用基板および半導体装置 |
WO2018212025A1 (ja) * | 2017-05-16 | 2018-11-22 | 株式会社村田製作所 | マルチプレクサ、送信装置および受信装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03206653A (ja) * | 1990-01-08 | 1991-09-10 | Shinko Electric Ind Co Ltd | 電子部品用セラミック端子 |
JPH0435202A (ja) | 1990-05-25 | 1992-02-06 | Sharp Corp | マイクロ波回路 |
JP3161831B2 (ja) | 1992-09-09 | 2001-04-25 | 株式会社日立製作所 | 回路素子モジュール |
JP3433430B2 (ja) | 1992-09-14 | 2003-08-04 | 富士通株式会社 | 分波器 |
JPH06310979A (ja) | 1993-04-26 | 1994-11-04 | Fujitsu Ltd | 分波器パッケージ |
JPH07226607A (ja) * | 1994-02-10 | 1995-08-22 | Hitachi Ltd | 分波器、分波器モジュールおよび無線通信装置 |
JP2905094B2 (ja) * | 1994-07-01 | 1999-06-14 | 富士通株式会社 | 分波器パッケージ |
JP3198252B2 (ja) | 1995-05-31 | 2001-08-13 | 富士通株式会社 | 分波器及びその製造方法 |
US5786738A (en) * | 1995-05-31 | 1998-07-28 | Fujitsu Limited | Surface acoustic wave filter duplexer comprising a multi-layer package and phase matching patterns |
TW325607B (en) * | 1995-08-24 | 1998-01-21 | Fujitsu Ltd | Filter device and dual-band radio system in which the filter device is used |
JP3227645B2 (ja) * | 1996-09-17 | 2001-11-12 | 株式会社村田製作所 | 弾性表面波装置 |
JP3222072B2 (ja) | 1996-10-15 | 2001-10-22 | 富士通株式会社 | 分波器パッケージ |
JP3982876B2 (ja) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | 弾性表面波装置 |
JP2000059176A (ja) * | 1998-08-06 | 2000-02-25 | Toshiba Corp | 弾性表面波素子 |
JP3375936B2 (ja) * | 2000-05-10 | 2003-02-10 | 富士通株式会社 | 分波器デバイス |
-
2001
- 2001-11-26 JP JP2001359567A patent/JP3818896B2/ja not_active Expired - Fee Related
-
2002
- 2002-11-18 US US10/295,910 patent/US6919778B2/en not_active Expired - Lifetime
- 2002-11-25 KR KR1020020073496A patent/KR100593339B1/ko active IP Right Grant
- 2002-11-26 CN CNB021528829A patent/CN100397782C/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1638274B (zh) * | 2004-01-08 | 2011-06-15 | 太阳诱电株式会社 | 表面声波器件 |
US7579927B2 (en) | 2004-12-22 | 2009-08-25 | Fujitsu Media Devices Limited | Duplexer |
CN1812260B (zh) * | 2004-12-22 | 2011-08-03 | 太阳诱电株式会社 | 双工器 |
CN109300881A (zh) * | 2017-07-25 | 2019-02-01 | 矽品精密工业股份有限公司 | 电子封装件暨基板结构与制法 |
TWI672840B (zh) * | 2017-07-25 | 2019-09-21 | 矽品精密工業股份有限公司 | 電子封裝件暨基板結構與製法 |
Also Published As
Publication number | Publication date |
---|---|
US6919778B2 (en) | 2005-07-19 |
KR20030043706A (ko) | 2003-06-02 |
JP2003163570A (ja) | 2003-06-06 |
CN100397782C (zh) | 2008-06-25 |
US20030098757A1 (en) | 2003-05-29 |
JP3818896B2 (ja) | 2006-09-06 |
KR100593339B1 (ko) | 2006-06-26 |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD Effective date: 20101201 Free format text: FORMER OWNER: FUJITSU LTD. |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: FUJITSU MEDIA DEVICES LTD Free format text: FORMER NAME: FUJITSU MEDIUM DEVICE CO., LTD. |
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COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: KANAGAWA PREFECTURE, JAPAN TO: TOKYO, JAPAN |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Co-patentee after: FUJITSU Ltd. Patentee after: Fujitsu Media Devices Ltd. Address before: Kanagawa Co-patentee before: Fujitsu Ltd. Patentee before: Fujitsu Media Devices Ltd. |
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Effective date of registration: 20101201 Address after: Tokyo, Japan Patentee after: TAIYO YUDEN Co.,Ltd. Address before: Kanagawa Co-patentee before: Fujitsu Ltd. Patentee before: Fujitsu Media Devices Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080625 Termination date: 20181126 |
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CF01 | Termination of patent right due to non-payment of annual fee |