CN1691501A - 天线双工器和电子设备 - Google Patents
天线双工器和电子设备 Download PDFInfo
- Publication number
- CN1691501A CN1691501A CNA2005100696428A CN200510069642A CN1691501A CN 1691501 A CN1691501 A CN 1691501A CN A2005100696428 A CNA2005100696428 A CN A2005100696428A CN 200510069642 A CN200510069642 A CN 200510069642A CN 1691501 A CN1691501 A CN 1691501A
- Authority
- CN
- China
- Prior art keywords
- layer
- terminated line
- line pattern
- ground plane
- acoustic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims abstract description 40
- 238000005538 encapsulation Methods 0.000 claims description 52
- 230000000295 complement effect Effects 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 179
- 238000003475 lamination Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 230000005764 inhibitory process Effects 0.000 description 9
- 238000002955 isolation Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
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- 229910018182 Al—Cu Inorganic materials 0.000 description 3
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- 238000012512 characterization method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241000826860 Trapezium Species 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65F—GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE
- B65F1/00—Refuse receptacles; Accessories therefor
- B65F1/14—Other constructional features; Accessories
- B65F1/1405—Compressing means incorporated in, or specially adapted for, refuse receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D51/00—Closures not otherwise provided for
- B65D51/24—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65F—GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE
- B65F1/00—Refuse receptacles; Accessories therefor
- B65F1/14—Other constructional features; Accessories
- B65F1/16—Lids or covers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65F—GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE
- B65F1/00—Refuse receptacles; Accessories therefor
- B65F1/14—Other constructional features; Accessories
- B65F2001/1653—Constructional features of lids or covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65F—GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE
- B65F2210/00—Equipment of refuse receptacles
- B65F2210/132—Draining means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65F—GATHERING OR REMOVAL OF DOMESTIC OR LIKE REFUSE
- B65F2210/00—Equipment of refuse receptacles
- B65F2210/162—Pressing means
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
封装A | 封装B | 封装C | |
L1 | 0.325mm | 0.350mm | 0.375mm |
L2 | 0.375mm | 0.350mm | 0.325mm |
封装D | 封装E | |
L1 | 0.350mm | 0.400mm |
L2 | 0.350mm | 0.350mm |
封装D | 封装E | |
L1 | 0.350mm | 0.350mm |
L2 | 0.350mm | 0.300mm |
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004132126 | 2004-04-27 | ||
JP2004132126A JP3910187B2 (ja) | 2004-04-27 | 2004-04-27 | 分波器及び電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1691501A true CN1691501A (zh) | 2005-11-02 |
CN100481725C CN100481725C (zh) | 2009-04-22 |
Family
ID=35135826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100696428A Expired - Fee Related CN100481725C (zh) | 2004-04-27 | 2005-04-27 | 天线双工器和电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7276992B2 (zh) |
JP (1) | JP3910187B2 (zh) |
KR (1) | KR100697767B1 (zh) |
CN (1) | CN100481725C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101467349B (zh) * | 2006-06-12 | 2011-06-01 | 株式会社村田制作所 | 弹性波分波器 |
CN103718469A (zh) * | 2011-08-01 | 2014-04-09 | 株式会社村田制作所 | 高频模块 |
CN103973256A (zh) * | 2013-01-29 | 2014-08-06 | 太阳诱电株式会社 | 模块 |
CN109379056A (zh) * | 2018-12-03 | 2019-02-22 | 全讯射频科技(无锡)有限公司 | 一种声表面波滤波器 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7528797B2 (en) * | 2005-08-29 | 2009-05-05 | Kyocera Wireless Corp. | Electrical connector with frequency-tuned groundplane |
WO2006137248A1 (ja) * | 2005-06-21 | 2006-12-28 | Murata Manufacturing Co., Ltd. | Saw分波器 |
WO2008029641A1 (fr) * | 2006-08-30 | 2008-03-13 | Kyocera Corporation | Carte de circuit pour dispositif séparateur d'onde, séparateur d'onde et dispositif de communication |
WO2009001170A2 (en) * | 2006-11-16 | 2008-12-31 | Nortel Networks Limited | Filter having impedance matching circuits |
US7602106B2 (en) * | 2007-08-23 | 2009-10-13 | Mueller Timothy J | Piezoelectric device package and method for downhole applications |
US8710714B2 (en) | 2010-07-22 | 2014-04-29 | Hm Energy, Llc | Surface acoustic wave resonator for down-hole applications |
US9019119B2 (en) | 2010-07-22 | 2015-04-28 | Hm Energy Llc | Surface acoustic wave transponder package for down-hole applications |
US9035789B2 (en) * | 2010-07-22 | 2015-05-19 | Hm Energy, Llc | Method and apparatus for automatic down-hole asset monitoring |
WO2012012696A2 (en) * | 2010-07-22 | 2012-01-26 | Hm Energy, Llc | Surface acoustic wave transponder package for down-hole applications |
JP5823168B2 (ja) * | 2011-05-24 | 2015-11-25 | 太陽誘電株式会社 | 通信モジュール |
WO2016068096A1 (ja) * | 2014-10-30 | 2016-05-06 | 株式会社村田製作所 | 受動素子付フィルタ部品および高周波モジュール |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04103209A (ja) | 1990-08-22 | 1992-04-06 | Tdk Corp | 磁界結合型ディプレクサ |
JP3433430B2 (ja) | 1992-09-14 | 2003-08-04 | 富士通株式会社 | 分波器 |
JP2905094B2 (ja) * | 1994-07-01 | 1999-06-14 | 富士通株式会社 | 分波器パッケージ |
JPH1075153A (ja) | 1996-08-30 | 1998-03-17 | Oki Electric Ind Co Ltd | 分波器パッケージ |
JP3222072B2 (ja) | 1996-10-15 | 2001-10-22 | 富士通株式会社 | 分波器パッケージ |
JP3224129B2 (ja) * | 1999-04-19 | 2001-10-29 | 富士通株式会社 | 分波器 |
JP3375936B2 (ja) * | 2000-05-10 | 2003-02-10 | 富士通株式会社 | 分波器デバイス |
JP3363870B2 (ja) | 2000-05-29 | 2003-01-08 | 沖電気工業株式会社 | 弾性表面波分波器 |
JP4000960B2 (ja) | 2001-10-19 | 2007-10-31 | 株式会社村田製作所 | 分波器、通信装置 |
JP3818896B2 (ja) * | 2001-11-26 | 2006-09-06 | 富士通メディアデバイス株式会社 | 分波器及びこれを用いた電子装置 |
JP3778902B2 (ja) * | 2003-04-28 | 2006-05-24 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
JP2005039407A (ja) * | 2003-07-17 | 2005-02-10 | Tdk Corp | 分波器 |
US7196594B2 (en) * | 2004-01-29 | 2007-03-27 | Triquint, Inc. | Surface acoustic wave duplexer having enhanced isolation performance |
-
2004
- 2004-04-27 JP JP2004132126A patent/JP3910187B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-26 US US11/114,090 patent/US7276992B2/en active Active
- 2005-04-26 KR KR1020050034609A patent/KR100697767B1/ko not_active IP Right Cessation
- 2005-04-27 CN CNB2005100696428A patent/CN100481725C/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101467349B (zh) * | 2006-06-12 | 2011-06-01 | 株式会社村田制作所 | 弹性波分波器 |
CN103718469A (zh) * | 2011-08-01 | 2014-04-09 | 株式会社村田制作所 | 高频模块 |
US11245386B2 (en) | 2011-08-01 | 2022-02-08 | Murata Manufacturing | High-frequency module |
CN103973256A (zh) * | 2013-01-29 | 2014-08-06 | 太阳诱电株式会社 | 模块 |
US9571062B2 (en) | 2013-01-29 | 2017-02-14 | Taiyo Yuden Co., Ltd. | Module |
CN109379056A (zh) * | 2018-12-03 | 2019-02-22 | 全讯射频科技(无锡)有限公司 | 一种声表面波滤波器 |
Also Published As
Publication number | Publication date |
---|---|
JP2005318128A (ja) | 2005-11-10 |
US20050237130A1 (en) | 2005-10-27 |
US7276992B2 (en) | 2007-10-02 |
KR100697767B1 (ko) | 2007-03-22 |
CN100481725C (zh) | 2009-04-22 |
JP3910187B2 (ja) | 2007-04-25 |
KR20060047471A (ko) | 2006-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100804 Address after: Kanagawa Co-patentee after: Taiyo Yuden Co., Ltd. Patentee after: Fujitsu Media Devices Ltd Address before: Kanagawa Co-patentee before: Fujitsu Ltd. Patentee before: Fujitsu Media Devices Ltd |
|
ASS | Succession or assignment of patent right |
Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD Effective date: 20101201 Free format text: FORMER OWNER: TAIYO YUDEN CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: KANAGAWA PREFECTURE, JAPAN TO: TOKYO, JAPAN |
|
TR01 | Transfer of patent right |
Effective date of registration: 20101201 Address after: Tokyo, Japan, Japan Patentee after: Taiyo Yuden Co., Ltd. Address before: Kanagawa Co-patentee before: Taiyo Yuden Co., Ltd. Patentee before: Fujitsu Media Devices Ltd |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20120427 |