CN1551500A - 使用表面声波滤波器的双工器及配备该双工器的电子装置 - Google Patents
使用表面声波滤波器的双工器及配备该双工器的电子装置 Download PDFInfo
- Publication number
- CN1551500A CN1551500A CNA2004100456773A CN200410045677A CN1551500A CN 1551500 A CN1551500 A CN 1551500A CN A2004100456773 A CNA2004100456773 A CN A2004100456773A CN 200410045677 A CN200410045677 A CN 200410045677A CN 1551500 A CN1551500 A CN 1551500A
- Authority
- CN
- China
- Prior art keywords
- duplexer
- layer
- phase matched
- multilayer
- acoustic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
- B61L29/00—Safety means for rail/road crossing traffic
- B61L29/02—Guards or obstacles for preventing access to the route
- B61L29/023—Special gates
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/50—Circuits using different frequencies for the two directions of communication
- H04B1/52—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
- B61L29/00—Safety means for rail/road crossing traffic
- B61L29/08—Operation of gates; Combined operation of gates and signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F13/00—Arrangements for obstructing or restricting traffic, e.g. gates, barricades ; Preventing passage of vehicles of selected category or dimensions
- E01F13/04—Arrangements for obstructing or restricting traffic, e.g. gates, barricades ; Preventing passage of vehicles of selected category or dimensions movable to allow or prevent passage
- E01F13/044—Arrangements for obstructing or restricting traffic, e.g. gates, barricades ; Preventing passage of vehicles of selected category or dimensions movable to allow or prevent passage the barrier being formed by obstructing members situated on, flush with, or below the traffic surface, e.g. with inflatable members on the surface
- E01F13/046—Arrangements for obstructing or restricting traffic, e.g. gates, barricades ; Preventing passage of vehicles of selected category or dimensions movable to allow or prevent passage the barrier being formed by obstructing members situated on, flush with, or below the traffic surface, e.g. with inflatable members on the surface the obstructing members moving up in a translatory motion, e.g. telescopic barrier posts
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F19/00—Advertising or display means not otherwise provided for
- G09F19/02—Advertising or display means not otherwise provided for incorporating moving display members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003126089A JP3967289B2 (ja) | 2003-04-30 | 2003-04-30 | 分波器及び電子装置 |
JP126089/2003 | 2003-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1551500A true CN1551500A (zh) | 2004-12-01 |
Family
ID=33308185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004100456773A Pending CN1551500A (zh) | 2003-04-30 | 2004-04-30 | 使用表面声波滤波器的双工器及配备该双工器的电子装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7684764B2 (zh) |
JP (1) | JP3967289B2 (zh) |
KR (1) | KR100745953B1 (zh) |
CN (1) | CN1551500A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102265515A (zh) * | 2008-12-26 | 2011-11-30 | 太阳诱电株式会社 | 双工器以及电子装置 |
CN103441746A (zh) * | 2013-09-02 | 2013-12-11 | 扬州大学 | 声表面波滤波器集成封装结构及其封装方法 |
CN102318188B (zh) * | 2007-08-23 | 2014-09-24 | 太阳诱电株式会社 | 滤波器、分波器以及包括分波器的模块、通信设备 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4446922B2 (ja) | 2005-04-21 | 2010-04-07 | 富士通メディアデバイス株式会社 | フィルタおよび分波器 |
JP4585431B2 (ja) * | 2005-11-15 | 2010-11-24 | 富士通メディアデバイス株式会社 | 分波器 |
JP5041285B2 (ja) * | 2007-04-24 | 2012-10-03 | 日立金属株式会社 | 高周波部品 |
KR101027593B1 (ko) * | 2007-05-29 | 2011-04-06 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 분파기 |
US20090003470A1 (en) * | 2007-06-29 | 2009-01-01 | Waltho Alan E | OFDM OOB emission suppression at specific frequencies |
JP5584274B2 (ja) * | 2007-08-23 | 2014-09-03 | 太陽誘電株式会社 | フィルタ、分波器、および分波器を含むモジュール、通信機器 |
JP5189097B2 (ja) * | 2007-08-23 | 2013-04-24 | 太陽誘電株式会社 | フィルタ、分波器、および分波器を含むモジュール、通信機器 |
JP5441095B2 (ja) * | 2008-01-31 | 2014-03-12 | 太陽誘電株式会社 | 弾性波デバイス、デュープレクサ、通信モジュール、および通信装置 |
CN101594729B (zh) * | 2008-05-27 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 一种可补偿过孔残端电容特性的电路板 |
JP5355958B2 (ja) * | 2008-07-31 | 2013-11-27 | 太陽誘電株式会社 | フィルタ、分波器および通信機器 |
JP5215767B2 (ja) * | 2008-07-31 | 2013-06-19 | 太陽誘電株式会社 | フィルタ、分波器、および通信機器 |
JP5183459B2 (ja) * | 2008-12-26 | 2013-04-17 | 太陽誘電株式会社 | 分波器、分波器用基板および電子装置 |
JP4809448B2 (ja) * | 2009-02-02 | 2011-11-09 | 日本電波工業株式会社 | デュプレクサ |
JP2012049434A (ja) * | 2010-08-30 | 2012-03-08 | Sony Corp | 電子部品、給電装置、受電装置、およびワイヤレス給電システム |
JP5805506B2 (ja) * | 2011-11-29 | 2015-11-04 | 京セラ株式会社 | 分波器 |
US9369163B2 (en) * | 2013-03-15 | 2016-06-14 | Marcellus Chen | Radio frequency transmission device with reduced power consumption |
RU205909U1 (ru) * | 2021-03-18 | 2021-08-12 | Общество с ограниченной ответственностью "БУТИС" | Дуплексерный фильтр на поверхностных акустических волнах |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0724289B2 (ja) | 1987-02-16 | 1995-03-15 | 日本電気株式会社 | 高周波用混成集積回路 |
JP2937421B2 (ja) | 1990-06-13 | 1999-08-23 | 株式会社村田製作所 | ディレイライン |
JPH07226607A (ja) | 1994-02-10 | 1995-08-22 | Hitachi Ltd | 分波器、分波器モジュールおよび無線通信装置 |
JP2905094B2 (ja) | 1994-07-01 | 1999-06-14 | 富士通株式会社 | 分波器パッケージ |
JPH1075153A (ja) | 1996-08-30 | 1998-03-17 | Oki Electric Ind Co Ltd | 分波器パッケージ |
JP3222072B2 (ja) | 1996-10-15 | 2001-10-22 | 富士通株式会社 | 分波器パッケージ |
KR100328882B1 (ko) * | 1998-10-31 | 2002-08-28 | 전자부품연구원 | 표면탄성파듀플렉서패키지 |
JP3375936B2 (ja) * | 2000-05-10 | 2003-02-10 | 富士通株式会社 | 分波器デバイス |
KR100425878B1 (ko) * | 2000-05-25 | 2004-04-03 | 동양물산기업 주식회사 | 트랙터의 트랜스미션 |
JP3363870B2 (ja) | 2000-05-29 | 2003-01-08 | 沖電気工業株式会社 | 弾性表面波分波器 |
JP2002176337A (ja) | 2000-12-08 | 2002-06-21 | Matsushita Electric Ind Co Ltd | Sawデュプレクサ |
JP3532158B2 (ja) | 2001-02-09 | 2004-05-31 | 富士通株式会社 | 分波器デバイス |
JP3818896B2 (ja) * | 2001-11-26 | 2006-09-06 | 富士通メディアデバイス株式会社 | 分波器及びこれを用いた電子装置 |
JP3833569B2 (ja) * | 2001-12-21 | 2006-10-11 | 富士通メディアデバイス株式会社 | 分波器及びこれを用いた電子装置 |
JP2003304139A (ja) | 2002-02-07 | 2003-10-24 | Ngk Spark Plug Co Ltd | 弾性表面波分波器用パッケージ及び弾性表面波分波器用パッケージの製造方法 |
-
2003
- 2003-04-30 JP JP2003126089A patent/JP3967289B2/ja not_active Expired - Lifetime
-
2004
- 2004-04-29 US US10/834,273 patent/US7684764B2/en active Active
- 2004-04-29 KR KR1020040030085A patent/KR100745953B1/ko active IP Right Grant
- 2004-04-30 CN CNA2004100456773A patent/CN1551500A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102318188B (zh) * | 2007-08-23 | 2014-09-24 | 太阳诱电株式会社 | 滤波器、分波器以及包括分波器的模块、通信设备 |
CN102265515A (zh) * | 2008-12-26 | 2011-11-30 | 太阳诱电株式会社 | 双工器以及电子装置 |
CN102265515B (zh) * | 2008-12-26 | 2014-07-09 | 太阳诱电株式会社 | 双工器以及电子装置 |
CN103441746A (zh) * | 2013-09-02 | 2013-12-11 | 扬州大学 | 声表面波滤波器集成封装结构及其封装方法 |
CN103441746B (zh) * | 2013-09-02 | 2017-03-15 | 扬州大学 | 声表面波滤波器集成封装结构及其封装方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2004336181A (ja) | 2004-11-25 |
US20040219888A1 (en) | 2004-11-04 |
US7684764B2 (en) | 2010-03-23 |
JP3967289B2 (ja) | 2007-08-29 |
KR100745953B1 (ko) | 2007-08-02 |
KR20040094352A (ko) | 2004-11-09 |
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Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU LTD. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20100819 Address after: Kanagawa Applicant after: Fujitsu Media Devices Ltd Co-applicant after: Taiyo Yuden Co., Ltd. Address before: Kanagawa Applicant before: Fujitsu Media Devices Ltd Co-applicant before: Fujitsu Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD Effective date: 20101201 Free format text: FORMER OWNER: TAIYO YUDEN CO., LTD. |
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C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Open date: 20041201 |
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Application publication date: 20041201 |