CN1364309A - 半导体晶片及其制造方法 - Google Patents

半导体晶片及其制造方法 Download PDF

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Publication number
CN1364309A
CN1364309A CN01800521A CN01800521A CN1364309A CN 1364309 A CN1364309 A CN 1364309A CN 01800521 A CN01800521 A CN 01800521A CN 01800521 A CN01800521 A CN 01800521A CN 1364309 A CN1364309 A CN 1364309A
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China
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crystal layer
crystal
substrate
sigec
mentioned
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Pending
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CN01800521A
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English (en)
Chinese (zh)
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神泽好彦
能泽克弥
斋藤彻
久保实
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN1364309A publication Critical patent/CN1364309A/zh
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/52—Alloys
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82—Heterojunctions
    • H10D62/822—Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3208—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3211—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3248—Layer structure consisting of two layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3256—Microstructure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Recrystallisation Techniques (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CN01800521A 2000-03-27 2001-03-27 半导体晶片及其制造方法 Pending CN1364309A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP086117/00 2000-03-27
JP2000086117A JP4406995B2 (ja) 2000-03-27 2000-03-27 半導体基板および半導体基板の製造方法

Publications (1)

Publication Number Publication Date
CN1364309A true CN1364309A (zh) 2002-08-14

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CN01800521A Pending CN1364309A (zh) 2000-03-27 2001-03-27 半导体晶片及其制造方法

Country Status (8)

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US (2) US6645836B2 (enExample)
EP (1) EP1197992B1 (enExample)
JP (1) JP4406995B2 (enExample)
KR (1) KR20020019037A (enExample)
CN (1) CN1364309A (enExample)
DE (1) DE60135425D1 (enExample)
TW (1) TW495845B (enExample)
WO (1) WO2001073827A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232743B2 (en) 2003-01-29 2007-06-19 S.O.I.Tec Silicon On Insulator Technologies S.A. Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
CN100364052C (zh) * 2002-09-03 2008-01-23 阿德弗西斯有限公司 晶格调谐半导体衬底的形成
CN100446270C (zh) * 2003-04-03 2008-12-24 台湾积体电路制造股份有限公司 半导体结构
US7560326B2 (en) 2006-05-05 2009-07-14 International Business Machines Corporation Silicon/silcion germaninum/silicon body device with embedded carbon dopant
CN100536167C (zh) * 2003-08-05 2009-09-02 富士通微电子株式会社 半导体装置及其制造方法
CN114000120A (zh) * 2022-01-05 2022-02-01 武汉大学 一种基于cvd法的应变金刚石生长掺杂方法

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744079B2 (en) * 2002-03-08 2004-06-01 International Business Machines Corporation Optimized blocking impurity placement for SiGe HBTs
WO2002101833A1 (en) * 2001-06-07 2002-12-19 Amberwave Systems Corporation Multiple gate insulators with strained semiconductor heterostructures
WO2004012243A2 (en) 2002-07-29 2004-02-05 Amberwave Systems Selective placement of dislocation arrays
CN1286157C (zh) * 2002-10-10 2006-11-22 松下电器产业株式会社 半导体装置及其制造方法
US6707106B1 (en) * 2002-10-18 2004-03-16 Advanced Micro Devices, Inc. Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer
US6730576B1 (en) * 2002-12-31 2004-05-04 Advanced Micro Devices, Inc. Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer
EP1439570A1 (en) * 2003-01-14 2004-07-21 Interuniversitair Microelektronica Centrum ( Imec) SiGe strain relaxed buffer for high mobility devices and a method of fabricating it
US7238595B2 (en) * 2003-03-13 2007-07-03 Asm America, Inc. Epitaxial semiconductor deposition methods and structures
US7682947B2 (en) * 2003-03-13 2010-03-23 Asm America, Inc. Epitaxial semiconductor deposition methods and structures
US20060225642A1 (en) * 2003-03-31 2006-10-12 Yoshihiko Kanzawa Method of forming semiconductor crystal
US7517768B2 (en) * 2003-03-31 2009-04-14 Intel Corporation Method for fabricating a heterojunction bipolar transistor
DE10344986B4 (de) * 2003-09-27 2008-10-23 Forschungszentrum Dresden - Rossendorf E.V. Verfahren zur Erzeugung verbesserter heteroepitaktischer gewachsener Siliziumkarbidschichten auf Siliziumsubstraten
US7183593B2 (en) * 2003-12-05 2007-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Heterostructure resistor and method of forming the same
US7064037B2 (en) * 2004-01-12 2006-06-20 Chartered Semiconductor Manufacturing Ltd. Silicon-germanium virtual substrate and method of fabricating the same
EP1763893A2 (en) * 2004-02-27 2007-03-21 ASM America, Inc. Germanium deposition
US20060071213A1 (en) * 2004-10-04 2006-04-06 Ce Ma Low temperature selective epitaxial growth of silicon germanium layers
KR100708942B1 (ko) * 2005-12-22 2007-04-17 매그나칩 반도체 유한회사 반도체 웨이퍼 및 그 제조방법
US7648853B2 (en) 2006-07-11 2010-01-19 Asm America, Inc. Dual channel heterostructure
JP4916247B2 (ja) * 2006-08-08 2012-04-11 トヨタ自動車株式会社 炭化珪素半導体装置及びその製造方法
US20080206965A1 (en) * 2007-02-27 2008-08-28 International Business Machines Corporation STRAINED SILICON MADE BY PRECIPITATING CARBON FROM Si(1-x-y)GexCy ALLOY
US20090108291A1 (en) * 2007-10-26 2009-04-30 United Microelectronics Corp. Semiconductor device and method for fabricating the same
US8187955B2 (en) 2009-08-24 2012-05-29 International Business Machines Corporation Graphene growth on a carbon-containing semiconductor layer
US8466502B2 (en) 2011-03-24 2013-06-18 United Microelectronics Corp. Metal-gate CMOS device
US8445363B2 (en) 2011-04-21 2013-05-21 United Microelectronics Corp. Method of fabricating an epitaxial layer
US8324059B2 (en) 2011-04-25 2012-12-04 United Microelectronics Corp. Method of fabricating a semiconductor structure
US8426284B2 (en) 2011-05-11 2013-04-23 United Microelectronics Corp. Manufacturing method for semiconductor structure
US8481391B2 (en) 2011-05-18 2013-07-09 United Microelectronics Corp. Process for manufacturing stress-providing structure and semiconductor device with such stress-providing structure
US8431460B2 (en) 2011-05-27 2013-04-30 United Microelectronics Corp. Method for fabricating semiconductor device
US8716750B2 (en) 2011-07-25 2014-05-06 United Microelectronics Corp. Semiconductor device having epitaxial structures
US8575043B2 (en) 2011-07-26 2013-11-05 United Microelectronics Corp. Semiconductor device and manufacturing method thereof
US8647941B2 (en) 2011-08-17 2014-02-11 United Microelectronics Corp. Method of forming semiconductor device
US8674433B2 (en) 2011-08-24 2014-03-18 United Microelectronics Corp. Semiconductor process
US8476169B2 (en) 2011-10-17 2013-07-02 United Microelectronics Corp. Method of making strained silicon channel semiconductor structure
US8691659B2 (en) 2011-10-26 2014-04-08 United Microelectronics Corp. Method for forming void-free dielectric layer
US8754448B2 (en) 2011-11-01 2014-06-17 United Microelectronics Corp. Semiconductor device having epitaxial layer
US8647953B2 (en) 2011-11-17 2014-02-11 United Microelectronics Corp. Method for fabricating first and second epitaxial cap layers
US8709930B2 (en) 2011-11-25 2014-04-29 United Microelectronics Corp. Semiconductor process
US9127345B2 (en) 2012-03-06 2015-09-08 Asm America, Inc. Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent
US9136348B2 (en) 2012-03-12 2015-09-15 United Microelectronics Corp. Semiconductor structure and fabrication method thereof
US9202914B2 (en) 2012-03-14 2015-12-01 United Microelectronics Corporation Semiconductor device and method for fabricating the same
US8664069B2 (en) 2012-04-05 2014-03-04 United Microelectronics Corp. Semiconductor structure and process thereof
US8866230B2 (en) 2012-04-26 2014-10-21 United Microelectronics Corp. Semiconductor devices
US8835243B2 (en) 2012-05-04 2014-09-16 United Microelectronics Corp. Semiconductor process
US8951876B2 (en) 2012-06-20 2015-02-10 United Microelectronics Corp. Semiconductor device and manufacturing method thereof
US8796695B2 (en) 2012-06-22 2014-08-05 United Microelectronics Corp. Multi-gate field-effect transistor and process thereof
US9171715B2 (en) 2012-09-05 2015-10-27 Asm Ip Holding B.V. Atomic layer deposition of GeO2
US8710632B2 (en) 2012-09-07 2014-04-29 United Microelectronics Corp. Compound semiconductor epitaxial structure and method for fabricating the same
US9117925B2 (en) 2013-01-31 2015-08-25 United Microelectronics Corp. Epitaxial process
US8753902B1 (en) 2013-03-13 2014-06-17 United Microelectronics Corp. Method of controlling etching process for forming epitaxial structure
US9034705B2 (en) 2013-03-26 2015-05-19 United Microelectronics Corp. Method of forming semiconductor device
US9064893B2 (en) 2013-05-13 2015-06-23 United Microelectronics Corp. Gradient dopant of strained substrate manufacturing method of semiconductor device
US9076652B2 (en) 2013-05-27 2015-07-07 United Microelectronics Corp. Semiconductor process for modifying shape of recess
US8853060B1 (en) 2013-05-27 2014-10-07 United Microelectronics Corp. Epitaxial process
US8765546B1 (en) 2013-06-24 2014-07-01 United Microelectronics Corp. Method for fabricating fin-shaped field-effect transistor
US8895396B1 (en) 2013-07-11 2014-11-25 United Microelectronics Corp. Epitaxial Process of forming stress inducing epitaxial layers in source and drain regions of PMOS and NMOS structures
US8981487B2 (en) 2013-07-31 2015-03-17 United Microelectronics Corp. Fin-shaped field-effect transistor (FinFET)
US9224822B2 (en) 2013-09-10 2015-12-29 Globalfoundries Inc. High percentage silicon germanium alloy fin formation
US9218963B2 (en) 2013-12-19 2015-12-22 Asm Ip Holding B.V. Cyclical deposition of germanium
TWI620558B (zh) 2016-12-20 2018-04-11 富伯生醫科技股份有限公司 穿戴式手部復健輔具系統

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798576B2 (ja) * 1993-01-27 1998-09-17 日本電気株式会社 シリコン膜の成長方法
JPH0722330A (ja) * 1993-06-29 1995-01-24 Oki Electric Ind Co Ltd 歪ヘテロエピタキシャル層の形成方法
EP0799495A4 (en) * 1994-11-10 1999-11-03 Lawrence Semiconductor Researc Silicon-germanium-carbon compositions and processes thereof
JPH11233440A (ja) * 1998-02-13 1999-08-27 Toshiba Corp 半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100364052C (zh) * 2002-09-03 2008-01-23 阿德弗西斯有限公司 晶格调谐半导体衬底的形成
US7232743B2 (en) 2003-01-29 2007-06-19 S.O.I.Tec Silicon On Insulator Technologies S.A. Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same
CN100446270C (zh) * 2003-04-03 2008-12-24 台湾积体电路制造股份有限公司 半导体结构
CN100536167C (zh) * 2003-08-05 2009-09-02 富士通微电子株式会社 半导体装置及其制造方法
US7560326B2 (en) 2006-05-05 2009-07-14 International Business Machines Corporation Silicon/silcion germaninum/silicon body device with embedded carbon dopant
CN114000120A (zh) * 2022-01-05 2022-02-01 武汉大学 一种基于cvd法的应变金刚石生长掺杂方法
CN114000120B (zh) * 2022-01-05 2022-03-15 武汉大学 一种基于cvd法的应变金刚石生长掺杂方法
US11519097B1 (en) 2022-01-05 2022-12-06 Wuhan University Strained diamond growing and doping method based on chemical vapor deposition (CVD) method

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DE60135425D1 (enExample) 2008-10-02
EP1197992B1 (en) 2008-08-20
US6930026B2 (en) 2005-08-16
US20020160584A1 (en) 2002-10-31
US20030203599A1 (en) 2003-10-30
WO2001073827A1 (en) 2001-10-04
KR20020019037A (ko) 2002-03-09
US6645836B2 (en) 2003-11-11
JP4406995B2 (ja) 2010-02-03
EP1197992A4 (en) 2004-12-29
EP1197992A1 (en) 2002-04-17
TW495845B (en) 2002-07-21
JP2001274090A (ja) 2001-10-05

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