CN1336754A - 数字像素传感器的改进设计 - Google Patents

数字像素传感器的改进设计 Download PDF

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Publication number
CN1336754A
CN1336754A CN 01129500 CN01129500A CN1336754A CN 1336754 A CN1336754 A CN 1336754A CN 01129500 CN01129500 CN 01129500 CN 01129500 A CN01129500 A CN 01129500A CN 1336754 A CN1336754 A CN 1336754A
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China
Prior art keywords
substrate
optical sensor
circuit
pixel
sensor
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Pending
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CN 01129500
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English (en)
Chinese (zh)
Inventor
杨晓东
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PICKEHIM CORP
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PICKEHIM CORP
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Publication of CN1336754A publication Critical patent/CN1336754A/zh
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/766Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/79Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/93Interconnections
    • H10F77/933Interconnections for devices having potential barriers

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN 01129500 2000-06-22 2001-06-21 数字像素传感器的改进设计 Pending CN1336754A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/603,113 2000-06-22
US09/603,113 US6809769B1 (en) 2000-06-22 2000-06-22 Designs of digital pixel sensors

Publications (1)

Publication Number Publication Date
CN1336754A true CN1336754A (zh) 2002-02-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01129500 Pending CN1336754A (zh) 2000-06-22 2001-06-21 数字像素传感器的改进设计

Country Status (5)

Country Link
US (1) US6809769B1 (enExample)
EP (1) EP1168450A3 (enExample)
JP (1) JP4686060B2 (enExample)
KR (1) KR100801181B1 (enExample)
CN (1) CN1336754A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550994C (zh) * 2003-10-22 2009-10-14 伊斯曼柯达公司 具有替换电路分布的图像传感器阵列
CN102006427A (zh) * 2009-08-28 2011-04-06 索尼公司 成像器件和相机系统
CN104502946A (zh) * 2014-12-16 2015-04-08 华中师范大学 基于cmos芯片的射线探测装置及探测方法
CN106158896A (zh) * 2010-11-11 2016-11-23 索尼公司 固态成像设备和电子装置

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6963370B2 (en) * 2001-09-24 2005-11-08 The Board Of Trustees Of The Leland Stanford Junior University Method for improving SNR in low illumination conditions in a CMOS video sensor system using a self-resetting digital pixel
JP4236152B2 (ja) * 2002-07-29 2009-03-11 富士フイルム株式会社 固体撮像素子
TW580828B (en) * 2002-09-16 2004-03-21 Pixart Imaging Inc Signal readout circuit having on-sensor-chip two-dimensional interpolation
JP4414646B2 (ja) * 2002-11-18 2010-02-10 浜松ホトニクス株式会社 光検出装置
US7460165B2 (en) * 2004-01-09 2008-12-02 Aptina Imaging Corporation Photo-array layout for monitoring image statistics
CN1910902A (zh) * 2004-01-12 2007-02-07 皇家飞利浦电子股份有限公司 半导体基图像传感器
JP4403396B2 (ja) * 2004-07-13 2010-01-27 ソニー株式会社 撮像装置及び撮像素子の集積回路
US7894174B2 (en) * 2004-08-23 2011-02-22 Monolithic Power Systems, Inc. Method and apparatus for fault detection scheme for cold cathode fluorescent lamp (CCFL) integrated circuits
JP4744828B2 (ja) * 2004-08-26 2011-08-10 浜松ホトニクス株式会社 光検出装置
JP4277216B2 (ja) * 2005-01-13 2009-06-10 ソニー株式会社 撮像装置及び撮像結果の処理方法
US8049293B2 (en) 2005-03-07 2011-11-01 Sony Corporation Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
JP4232755B2 (ja) * 2005-04-05 2009-03-04 株式会社デンソー イメージセンサ及びイメージセンサの制御方法
TWI429066B (zh) * 2005-06-02 2014-03-01 新力股份有限公司 Semiconductor image sensor module and manufacturing method thereof
JP2007228460A (ja) * 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
WO2008153831A2 (en) * 2007-06-06 2008-12-18 Luna Innovations Incorporated Method and apparatus for acoustically enhanced removal of bubbles from a fluid
CN101453818B (zh) 2007-11-29 2014-03-19 杭州茂力半导体技术有限公司 放电灯的电路保护和调节装置
US7781716B2 (en) * 2008-03-17 2010-08-24 Eastman Kodak Company Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array
JP5685898B2 (ja) * 2010-01-08 2015-03-18 ソニー株式会社 半導体装置、固体撮像装置、およびカメラシステム
JP2011204797A (ja) 2010-03-24 2011-10-13 Sony Corp 固体撮像装置とその製造方法、及び電子機器
JP5810493B2 (ja) 2010-09-03 2015-11-11 ソニー株式会社 半導体集積回路、電子機器、固体撮像装置、撮像装置
FR2970598B1 (fr) * 2011-01-17 2013-08-16 Commissariat Energie Atomique Dispositif imageur a grande gamme dynamique
US8637800B2 (en) * 2011-04-19 2014-01-28 Altasens, Inc. Image sensor with hybrid heterostructure
US8749686B2 (en) 2011-04-29 2014-06-10 Truesense Imaging, Inc. CCD image sensors and methods
US8890047B2 (en) 2011-09-21 2014-11-18 Aptina Imaging Corporation Stacked-chip imaging systems
US9013615B2 (en) 2011-09-21 2015-04-21 Semiconductor Components Industries, Llc Image sensor with flexible interconnect capabilities
WO2013110022A1 (en) * 2012-01-20 2013-07-25 Rjs Technology, Inc. System and method for a high dynamic range array of sensitive image sensor blocks
US9185307B2 (en) * 2012-02-21 2015-11-10 Semiconductor Components Industries, Llc Detecting transient signals using stacked-chip imaging systems
WO2013164915A1 (ja) * 2012-05-02 2013-11-07 株式会社ニコン 撮像装置
US9343497B2 (en) * 2012-09-20 2016-05-17 Semiconductor Components Industries, Llc Imagers with stacked integrated circuit dies
JP6413235B2 (ja) * 2013-12-06 2018-10-31 株式会社ニコン 撮像素子および撮像装置
WO2015133350A1 (ja) * 2014-03-01 2015-09-11 江藤 剛治 撮像素子、撮影装置、及び計測装置
JP6065046B2 (ja) * 2015-04-20 2017-01-25 ソニー株式会社 半導体集積回路、電子機器、固体撮像装置、撮像装置
RU2603333C1 (ru) * 2015-05-14 2016-11-27 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" Гибридный пиксельный фотоприемник - детектор излучений, конструкция и способ изготовления
EP3444843B8 (en) * 2017-08-14 2021-03-24 ams International AG Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation
US10692179B2 (en) * 2017-11-17 2020-06-23 Semiconductor Components Industries, Llc Methods and apparatus for signal distribution in an image sensor
JP7242194B2 (ja) * 2018-04-27 2023-03-20 キヤノン電子株式会社 原稿搬送装置
US11025848B2 (en) * 2018-08-31 2021-06-01 Canon Kabushiki Kaisha Photoelectric conversion device, imaging system, moving body, and stackable semiconductor device
KR102587895B1 (ko) * 2018-09-13 2023-10-12 삼성전자주식회사 픽셀 어레이와 메모리 셀 어레이가 병합된 이미지 센서 및 이를 포함하는 전자 장치
JP7055727B2 (ja) * 2018-09-20 2022-04-18 株式会社ニコン 撮像素子およびカメラ
KR102759366B1 (ko) 2019-06-14 2025-01-24 삼성전자주식회사 Cis, 및 그 cis에서 픽셀별 ae 방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193678A (ja) * 1987-02-05 1988-08-10 Fujitsu Ltd 二次元固体撮像装置
CA2095366C (en) * 1992-05-21 1999-09-14 Timothy C. Collins Hybridized semiconductor pixel detector arrays for use in digital radiography
US5336879A (en) 1993-05-28 1994-08-09 David Sarnoff Research Center, Inc. Pixel array having image forming pixel elements integral with peripheral circuit elements
US5751049A (en) * 1993-08-16 1998-05-12 Texas Instruments Incorporated Two-color infrared detector
JPH07192663A (ja) * 1993-12-27 1995-07-28 Hitachi Ltd 撮像装置
US5461425A (en) * 1994-02-15 1995-10-24 Stanford University CMOS image sensor with pixel level A/D conversion
JP3579455B2 (ja) * 1994-05-06 2004-10-20 ペンタックス株式会社 画像入力装置
GB2289983B (en) * 1994-06-01 1996-10-16 Simage Oy Imaging devices,systems and methods
JPH07335694A (ja) * 1994-06-15 1995-12-22 Shimadzu Corp 電子デバイス
US5529197A (en) 1994-12-20 1996-06-25 Siemens Aktiengesellschaft Polysilicon/polycide etch process for sub-micron gate stacks
US5734156A (en) 1994-12-22 1998-03-31 Santa Barbara Research Center Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components
US5665959A (en) * 1995-01-13 1997-09-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration Solid-state image sensor with focal-plane digital photon-counting pixel array
WO1996038980A1 (en) * 1995-05-31 1996-12-05 Sony Corporation Image pickup device, method of manufacturing the device, image pickup adapter, signal processor, signal processing method, information processor, and information processing method
US5610404A (en) * 1995-09-05 1997-03-11 General Electric Company Flat panel imaging device with ground plane electrode
US5781233A (en) * 1996-03-14 1998-07-14 Tritech Microelectronics, Ltd. MOS FET camera chip and methods of manufacture and operation thereof
US5721429A (en) 1996-07-23 1998-02-24 Hughes Electronics Self-focusing detector pixel structure having improved sensitivity
GB2319394B (en) * 1996-12-27 1998-10-28 Simage Oy Bump-bonded semiconductor imaging device
US6452632B1 (en) * 1997-01-31 2002-09-17 Kabushiki Kaisha Toshiba Solid state image sensor and video system using the same
US5904495A (en) 1997-06-11 1999-05-18 Massachusetts Institute Of Technology Interconnection technique for hybrid integrated devices
US5986693A (en) * 1997-10-06 1999-11-16 Adair; Edwin L. Reduced area imaging devices incorporated within surgical instruments
US6721008B2 (en) * 1998-01-22 2004-04-13 Eastman Kodak Company Integrated CMOS active pixel digital camera
US6466265B1 (en) * 1998-06-22 2002-10-15 Eastman Kodak Company Parallel output architectures for CMOS active pixel sensors
JP3854729B2 (ja) * 1998-09-02 2006-12-06 キヤノン株式会社 撮像装置およびそれを用いた撮像システム

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100550994C (zh) * 2003-10-22 2009-10-14 伊斯曼柯达公司 具有替换电路分布的图像传感器阵列
CN102006427A (zh) * 2009-08-28 2011-04-06 索尼公司 成像器件和相机系统
CN102006427B (zh) * 2009-08-28 2013-08-28 索尼公司 成像器件和相机系统
CN106158896A (zh) * 2010-11-11 2016-11-23 索尼公司 固态成像设备和电子装置
CN106252370A (zh) * 2010-11-11 2016-12-21 索尼公司 固态成像设备和电子装置
CN106158896B (zh) * 2010-11-11 2019-04-12 索尼公司 固态成像设备和电子装置
CN106252370B (zh) * 2010-11-11 2019-07-05 索尼公司 固态成像设备和电子装置
CN104502946A (zh) * 2014-12-16 2015-04-08 华中师范大学 基于cmos芯片的射线探测装置及探测方法
CN104502946B (zh) * 2014-12-16 2017-06-13 华中师范大学 基于cmos芯片的射线探测装置及探测方法

Also Published As

Publication number Publication date
EP1168450A2 (en) 2002-01-02
JP4686060B2 (ja) 2011-05-18
KR100801181B1 (ko) 2008-02-05
JP2002044527A (ja) 2002-02-08
EP1168450A3 (en) 2004-04-14
US6809769B1 (en) 2004-10-26
KR20020002447A (ko) 2002-01-09

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