CN1330227C - 电磁屏蔽型柔性电路基板 - Google Patents

电磁屏蔽型柔性电路基板 Download PDF

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Publication number
CN1330227C
CN1330227C CNB2004100816868A CN200410081686A CN1330227C CN 1330227 C CN1330227 C CN 1330227C CN B2004100816868 A CNB2004100816868 A CN B2004100816868A CN 200410081686 A CN200410081686 A CN 200410081686A CN 1330227 C CN1330227 C CN 1330227C
Authority
CN
China
Prior art keywords
flexible circuit
air vent
circuit board
circuit substrate
vent hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100816868A
Other languages
English (en)
Chinese (zh)
Other versions
CN1638618A (zh
Inventor
越智真也
住友聪
星野容史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
PHC Corp
Original Assignee
Nippon Mektron KK
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK, Matsushita Electric Industrial Co Ltd filed Critical Nippon Mektron KK
Publication of CN1638618A publication Critical patent/CN1638618A/zh
Application granted granted Critical
Publication of CN1330227C publication Critical patent/CN1330227C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CNB2004100816868A 2003-12-24 2004-12-24 电磁屏蔽型柔性电路基板 Expired - Fee Related CN1330227C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP427432/2003 2003-12-24
JP427432/03 2003-12-24
JP2003427432A JP4163098B2 (ja) 2003-12-24 2003-12-24 電磁シールド型可撓性回路基板

Publications (2)

Publication Number Publication Date
CN1638618A CN1638618A (zh) 2005-07-13
CN1330227C true CN1330227C (zh) 2007-08-01

Family

ID=34786710

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100816868A Expired - Fee Related CN1330227C (zh) 2003-12-24 2004-12-24 电磁屏蔽型柔性电路基板

Country Status (4)

Country Link
JP (1) JP4163098B2 (ja)
KR (1) KR100698496B1 (ja)
CN (1) CN1330227C (ja)
TW (1) TW200522858A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100640659B1 (ko) * 2005-08-01 2006-11-01 삼성전자주식회사 가요성 인쇄회로 및 이의 제조방법
KR100737098B1 (ko) * 2006-03-16 2007-07-06 엘지이노텍 주식회사 전자파 차폐장치 및 그 제조 공정
JP4852442B2 (ja) * 2007-02-15 2012-01-11 日本オプネクスト株式会社 光送信モジュール
JP5161617B2 (ja) 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
JP5487477B2 (ja) * 2012-08-20 2014-05-07 タツタ電線株式会社 シールド層付リジッド配線基板及びその製造方法
CN204377241U (zh) * 2013-10-24 2015-06-03 信越聚合物株式会社 电磁波屏蔽膜
TWI653031B (zh) 2016-03-28 2019-03-11 鉅旺生技股份有限公司 無線壓力檢測儀
CN108738226B (zh) * 2018-05-04 2020-11-13 华显光电技术（惠州）有限公司 柔性电路板结构、背光组件与移动终端
CN110691500B (zh) * 2018-07-06 2024-04-26 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN113766095B (zh) * 2020-06-04 2023-08-15 三赢科技（深圳）有限公司 相机模组及电子装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224587A (ja) * 1993-01-27 1994-08-12 Nippon Mektron Ltd シ−ルド層を有する可撓性回路基板
JPH08125380A (ja) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd シールド付きフレキシブル配線板及びその製造方法
JP2002033556A (ja) * 2000-07-18 2002-01-31 Nippon Mektron Ltd 可撓性回路基板
CN1391429A (zh) * 2001-06-07 2003-01-15 明碁电通股份有限公司 软性电路板的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0363969U (ja) * 1989-10-25 1991-06-21
JPH04207099A (ja) * 1990-11-30 1992-07-29 Nitto Denko Corp 多層プリント基板
JPH05326644A (ja) * 1992-05-19 1993-12-10 Hitachi Cable Ltd 両面配線フィルムキャリア及びその製造方法
JP3191517B2 (ja) * 1993-08-04 2001-07-23 富士ゼロックス株式会社 フレキシブル印刷配線板のシールド装置
JPH11214805A (ja) * 1998-01-20 1999-08-06 Sony Corp フレキシブルプリント配線基板
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP2003007769A (ja) * 2001-06-26 2003-01-10 Toshiba Corp 半導体チップの実装構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224587A (ja) * 1993-01-27 1994-08-12 Nippon Mektron Ltd シ−ルド層を有する可撓性回路基板
JPH08125380A (ja) * 1994-10-19 1996-05-17 Sumitomo Electric Ind Ltd シールド付きフレキシブル配線板及びその製造方法
JP2002033556A (ja) * 2000-07-18 2002-01-31 Nippon Mektron Ltd 可撓性回路基板
CN1391429A (zh) * 2001-06-07 2003-01-15 明碁电通股份有限公司 软性电路板的制造方法

Also Published As

Publication number Publication date
TWI378764B (ja) 2012-12-01
JP4163098B2 (ja) 2008-10-08
KR100698496B1 (ko) 2007-03-23
KR20050065291A (ko) 2005-06-29
CN1638618A (zh) 2005-07-13
TW200522858A (en) 2005-07-01
JP2005191076A (ja) 2005-07-14

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: PANASONIC HEALTHCARE + MEDICAL EQUIPMENT CO., LTD.

Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD.

Effective date: 20140425

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20140425

Address after: Tokyo, Japan, Japan

Patentee after: Nippon Mektron, Ltd.

Patentee after: Panasonic Healthcare Co., Ltd

Address before: Tokyo, Japan, Japan

Patentee before: Nippon Mektron, Ltd.

Patentee before: Matsushita Electric Industrial Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070801

Termination date: 20141224

EXPY Termination of patent right or utility model