CN1314229A - 无铅焊料 - Google Patents
无铅焊料 Download PDFInfo
- Publication number
- CN1314229A CN1314229A CN 00135326 CN00135326A CN1314229A CN 1314229 A CN1314229 A CN 1314229A CN 00135326 CN00135326 CN 00135326 CN 00135326 A CN00135326 A CN 00135326A CN 1314229 A CN1314229 A CN 1314229A
- Authority
- CN
- China
- Prior art keywords
- alloy
- solder
- fusion temperature
- fatigue life
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims description 27
- 239000000463 material Substances 0.000 title description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 109
- 239000000956 alloy Substances 0.000 claims abstract description 109
- 229910000679 solder Inorganic materials 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 229910052738 indium Inorganic materials 0.000 claims abstract description 37
- 229910052709 silver Inorganic materials 0.000 claims abstract description 37
- 229910052718 tin Inorganic materials 0.000 claims abstract description 28
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 16
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000004927 fusion Effects 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 abstract description 35
- 239000011135 tin Substances 0.000 abstract description 30
- 238000009736 wetting Methods 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002929 anti-fatigue Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 229910001245 Sb alloy Inorganic materials 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910006913 SnSb Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/417169 | 1999-10-12 | ||
US09/417,169 US6176947B1 (en) | 1998-12-31 | 1999-10-12 | Lead-free solders |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1314229A true CN1314229A (zh) | 2001-09-26 |
CN1208168C CN1208168C (zh) | 2005-06-29 |
Family
ID=23652856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 00135326 Expired - Lifetime CN1208168C (zh) | 1999-10-12 | 2000-10-12 | 无铅焊料 |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN1208168C (zh) |
HK (1) | HK1039916B (zh) |
SG (1) | SG98429A1 (zh) |
TW (1) | TW528638B (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007079671A1 (fr) * | 2006-01-11 | 2007-07-19 | Thousand Island Metal Foil Co., Ltd | Brasure sans plomb et son procede de preparation |
CN100351035C (zh) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | 无铅焊料 |
CN101357423B (zh) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
CN102066044A (zh) * | 2009-04-20 | 2011-05-18 | 松下电器产业株式会社 | 焊锡材料及电子部件接合体 |
CN103146955A (zh) * | 2013-03-22 | 2013-06-12 | 天津百瑞杰焊接材料有限公司 | 198℃保险丝熔断芯的无铅低温合金及其制备方法 |
CN103341699A (zh) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | 一种取代锡铅钎料的Sn-In-Ag无铅钎料 |
CN106715040A (zh) * | 2015-05-19 | 2017-05-24 | 松下知识产权经营株式会社 | 焊料合金以及使用其的安装结构体 |
CN108581266A (zh) * | 2013-04-02 | 2018-09-28 | 千住金属工业株式会社 | 无铅软钎料合金和车载电子电路 |
CN110392621A (zh) * | 2017-03-10 | 2019-10-29 | 株式会社田村制作所 | 无铅软钎料合金、焊膏及电子电路基板 |
CN111542624A (zh) * | 2017-11-09 | 2020-08-14 | 凯斯特有限责任公司 | 用于高可靠性应用的标准sac合金的低银锡基替代焊料合金 |
CN113070606A (zh) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | 一种Sn-Ag-Cu高性能无铅焊料及其制备方法 |
CN115476069A (zh) * | 2022-10-28 | 2022-12-16 | 云南锡业集团(控股)有限责任公司研发中心 | 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料 |
CN117139917A (zh) * | 2023-10-31 | 2023-12-01 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040187976A1 (en) | 2003-03-31 | 2004-09-30 | Fay Hua | Phase change lead-free super plastic solders |
TWI242866B (en) | 2003-08-21 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Process of forming lead-free bumps on electronic component |
CN107990708B (zh) * | 2017-11-28 | 2020-09-29 | 乐山新天源太阳能科技有限公司 | 硅片烧结炉内烘干区的传送装置 |
JP6936926B1 (ja) * | 2021-03-10 | 2021-09-22 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
JPH10193171A (ja) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | 半田付け物品 |
JP3736819B2 (ja) * | 1997-01-17 | 2006-01-18 | 株式会社豊田中央研究所 | 無鉛はんだ合金 |
JPH10314980A (ja) * | 1997-05-14 | 1998-12-02 | Sony Corp | はんだ材料 |
US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
-
2000
- 2000-10-11 SG SG200005828A patent/SG98429A1/en unknown
- 2000-10-12 TW TW089121619A patent/TW528638B/zh not_active IP Right Cessation
- 2000-10-12 CN CN 00135326 patent/CN1208168C/zh not_active Expired - Lifetime
-
2002
- 2002-02-27 HK HK02101537.6A patent/HK1039916B/zh unknown
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100351035C (zh) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | 无铅焊料 |
CN101357423B (zh) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
WO2007079671A1 (fr) * | 2006-01-11 | 2007-07-19 | Thousand Island Metal Foil Co., Ltd | Brasure sans plomb et son procede de preparation |
CN102066044A (zh) * | 2009-04-20 | 2011-05-18 | 松下电器产业株式会社 | 焊锡材料及电子部件接合体 |
US8598464B2 (en) | 2009-04-20 | 2013-12-03 | Panasonic Corporation | Soldering material and electronic component assembly |
CN102066044B (zh) * | 2009-04-20 | 2014-05-21 | 松下电器产业株式会社 | 焊锡材料及电子部件接合体 |
CN103962744A (zh) * | 2009-04-20 | 2014-08-06 | 松下电器产业株式会社 | 焊锡材料及电子部件接合体 |
CN103962744B (zh) * | 2009-04-20 | 2016-05-18 | 松下知识产权经营株式会社 | 焊锡材料及电子部件接合体 |
CN103146955A (zh) * | 2013-03-22 | 2013-06-12 | 天津百瑞杰焊接材料有限公司 | 198℃保险丝熔断芯的无铅低温合金及其制备方法 |
CN103146955B (zh) * | 2013-03-22 | 2015-01-07 | 天津百瑞杰焊接材料有限公司 | 198℃保险丝熔断芯的无铅低温合金及其制备方法 |
CN108581266A (zh) * | 2013-04-02 | 2018-09-28 | 千住金属工业株式会社 | 无铅软钎料合金和车载电子电路 |
CN103341699A (zh) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | 一种取代锡铅钎料的Sn-In-Ag无铅钎料 |
CN106715040A (zh) * | 2015-05-19 | 2017-05-24 | 松下知识产权经营株式会社 | 焊料合金以及使用其的安装结构体 |
CN106715040B (zh) * | 2015-05-19 | 2019-09-24 | 松下知识产权经营株式会社 | 焊料合金以及使用其的安装结构体 |
CN110392621A (zh) * | 2017-03-10 | 2019-10-29 | 株式会社田村制作所 | 无铅软钎料合金、焊膏及电子电路基板 |
KR20190126276A (ko) * | 2017-03-10 | 2019-11-11 | 가부시키가이샤 다무라 세이사쿠쇼 | 납 프리 땜납 합금, 솔더 페이스트 및 전자 회로 기판 |
KR102494488B1 (ko) * | 2017-03-10 | 2023-02-01 | 가부시키가이샤 다무라 세이사쿠쇼 | 납 프리 땜납 합금, 솔더 페이스트 및 전자 회로 기판 |
CN111542624A (zh) * | 2017-11-09 | 2020-08-14 | 凯斯特有限责任公司 | 用于高可靠性应用的标准sac合金的低银锡基替代焊料合金 |
CN113070606A (zh) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | 一种Sn-Ag-Cu高性能无铅焊料及其制备方法 |
CN115476069A (zh) * | 2022-10-28 | 2022-12-16 | 云南锡业集团(控股)有限责任公司研发中心 | 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料 |
CN117139917A (zh) * | 2023-10-31 | 2023-12-01 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
CN117139917B (zh) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
TW528638B (en) | 2003-04-21 |
SG98429A1 (en) | 2003-09-19 |
HK1039916B (zh) | 2005-10-14 |
CN1208168C (zh) | 2005-06-29 |
HK1039916A1 (en) | 2002-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SINGAPORE ZHAORI CHEMICAL AND SOLDER INDUSTRIAL S Free format text: FORMER OWNER: HIGH-TECH. GROUP Free format text: FORMER OWNER: SINGAPORE ZHAORI CHEMICAL AND SOLDER INDUSTRIAL STOCK CO., LTD. Effective date: 20020614 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020614 Address after: Singapore Applicant after: Singapore Asahi Chemicals & Solder Industries Co.,Ltd. Address before: Ohio, USA Applicant before: HIGH SCIENCE AND TECHNOLOGY GR Co-applicant before: Singapore Asahi Chemicals & Solder Industries Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20050629 |