SG98429A1 - Lead-free solders - Google Patents

Lead-free solders

Info

Publication number
SG98429A1
SG98429A1 SG200005828A SG200005828A SG98429A1 SG 98429 A1 SG98429 A1 SG 98429A1 SG 200005828 A SG200005828 A SG 200005828A SG 200005828 A SG200005828 A SG 200005828A SG 98429 A1 SG98429 A1 SG 98429A1
Authority
SG
Singapore
Prior art keywords
lead
free solders
solders
free
Prior art date
Application number
SG200005828A
Other languages
English (en)
Inventor
S Hwang Jennie
Guo Zhenfeng
Original Assignee
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/417,169 external-priority patent/US6176947B1/en
Application filed by Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Singapore Asahi Chemical & Solder Ind Pte Ltd
Publication of SG98429A1 publication Critical patent/SG98429A1/en

Links

SG200005828A 1999-10-12 2000-10-11 Lead-free solders SG98429A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/417,169 US6176947B1 (en) 1998-12-31 1999-10-12 Lead-free solders

Publications (1)

Publication Number Publication Date
SG98429A1 true SG98429A1 (en) 2003-09-19

Family

ID=23652856

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200005828A SG98429A1 (en) 1999-10-12 2000-10-11 Lead-free solders

Country Status (4)

Country Link
CN (1) CN1208168C (zh)
HK (1) HK1039916B (zh)
SG (1) SG98429A1 (zh)
TW (1) TW528638B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040187976A1 (en) 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
TWI242866B (en) 2003-08-21 2005-11-01 Siliconware Precision Industries Co Ltd Process of forming lead-free bumps on electronic component
CN100351035C (zh) * 2005-10-28 2007-11-28 亚通电子有限公司 无铅焊料
CN101357423B (zh) * 2005-12-16 2011-03-09 浙江亚通焊材有限公司 无铅锡焊料
CN1803381A (zh) * 2006-01-11 2006-07-19 黄守友 无铅焊料及其制备方法
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
CN103146955B (zh) * 2013-03-22 2015-01-07 天津百瑞杰焊接材料有限公司 198℃保险丝熔断芯的无铅低温合金及其制备方法
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
CN103341699A (zh) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 一种取代锡铅钎料的Sn-In-Ag无铅钎料
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
CN107990708B (zh) * 2017-11-28 2020-09-29 乐山新天源太阳能科技有限公司 硅片烧结炉内烘干区的传送装置
JP6936926B1 (ja) * 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手
CN113070606A (zh) * 2021-04-15 2021-07-06 云南锡业锡材有限公司 一种Sn-Ag-Cu高性能无铅焊料及其制备方法
CN115476069A (zh) * 2022-10-28 2022-12-16 云南锡业集团（控股）有限责任公司研发中心 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料
CN117139917B (zh) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 一种汽车玻璃用无铅焊料及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JPH10193169A (ja) * 1997-01-17 1998-07-28 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JPH10193171A (ja) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd 半田付け物品
JPH10314980A (ja) * 1997-05-14 1998-12-02 Sony Corp はんだ材料
EP0953400A1 (en) * 1998-04-03 1999-11-03 Delphi Technologies, Inc. Fatigue-resistant lead-free alloy

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JPH10193171A (ja) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd 半田付け物品
JPH10193169A (ja) * 1997-01-17 1998-07-28 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JPH10314980A (ja) * 1997-05-14 1998-12-02 Sony Corp はんだ材料
EP0953400A1 (en) * 1998-04-03 1999-11-03 Delphi Technologies, Inc. Fatigue-resistant lead-free alloy

Also Published As

Publication number Publication date
TW528638B (en) 2003-04-21
HK1039916B (zh) 2005-10-14
CN1314229A (zh) 2001-09-26
HK1039916A1 (en) 2002-05-17
CN1208168C (zh) 2005-06-29

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