KR20010012869A - 무연땜납합금 - Google Patents

무연땜납합금 Download PDF

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Publication number
KR20010012869A
KR20010012869A KR1019997010835A KR19997010835A KR20010012869A KR 20010012869 A KR20010012869 A KR 20010012869A KR 1019997010835 A KR1019997010835 A KR 1019997010835A KR 19997010835 A KR19997010835 A KR 19997010835A KR 20010012869 A KR20010012869 A KR 20010012869A
Authority
KR
South Korea
Prior art keywords
lead
free solder
solder alloy
alloy
free
Prior art date
Application number
KR1019997010835A
Other languages
English (en)
Other versions
KR100377232B1 (ko
Inventor
니시무라테츠로
Original Assignee
니시무라 테츠로
니혼 슈페리어 샤 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27309154&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20010012869(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 니시무라 테츠로, 니혼 슈페리어 샤 가부시키 가이샤 filed Critical 니시무라 테츠로
Publication of KR20010012869A publication Critical patent/KR20010012869A/ko
Application granted granted Critical
Publication of KR100377232B1 publication Critical patent/KR100377232B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
KR10-1999-7010835A 1998-03-26 1999-03-15 무연땜납합금 KR100377232B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP??10-100141 1998-03-26
JP10014198 1998-03-26
JP32448398 1998-10-28
JP??10-324483 1998-10-28
JP??10-324482 1998-10-28
JP32448298 1998-10-28

Publications (2)

Publication Number Publication Date
KR20010012869A true KR20010012869A (ko) 2001-02-26
KR100377232B1 KR100377232B1 (ko) 2003-03-26

Family

ID=27309154

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7010835A KR100377232B1 (ko) 1998-03-26 1999-03-15 무연땜납합금

Country Status (13)

Country Link
US (1) US6180055B1 (ko)
EP (1) EP0985486B1 (ko)
JP (2) JP3152945B2 (ko)
KR (1) KR100377232B1 (ko)
AU (1) AU757312B2 (ko)
CA (1) CA2288817C (ko)
DE (1) DE69918758T2 (ko)
ES (1) ES2224609T3 (ko)
HK (1) HK1026390A1 (ko)
ID (1) ID22854A (ko)
MY (1) MY114845A (ko)
TW (1) TW411731B (ko)
WO (1) WO1999048639A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453074B1 (ko) * 2002-03-18 2004-10-15 삼성전자주식회사 무연 솔더 합금
KR100659890B1 (ko) * 2001-06-28 2006-12-20 센주긴조쿠고교 가부시키가이샤 무연 땜납합금

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JP3312618B2 (ja) * 2000-02-03 2002-08-12 千住金属工業株式会社 はんだ槽へのはんだの追加供給方法
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
KR100621387B1 (ko) * 2001-08-30 2006-09-13 스미다 코포레이션 무납 땜납 합금 및 이를 사용한 전자부품
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
US6840434B2 (en) 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US20040141873A1 (en) * 2003-01-22 2004-07-22 Tadashi Takemoto Solder composition substantially free of lead
US7193326B2 (en) * 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
TWI465312B (zh) 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4569423B2 (ja) 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
JP4890221B2 (ja) * 2006-12-06 2012-03-07 株式会社日本スペリア社 ダイボンド材
JP4364928B2 (ja) 2007-04-13 2009-11-18 積水化学工業株式会社 導電性微粒子、異方性導電材料及び導電接続構造体
EP2139009B1 (en) * 2007-04-13 2013-06-26 Sekisui Chemical Co., Ltd. Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
JP5331322B2 (ja) * 2007-09-20 2013-10-30 株式会社日立製作所 半導体装置
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
EP2243590B1 (en) * 2008-02-22 2020-04-15 Nihon Superior Sha Co., Ltd Method of regulating nickel concentration in lead-free solder containing nickel
CN102017111B (zh) * 2008-03-05 2013-01-16 千住金属工业株式会社 无铅焊料连接构造体和焊料球
JP2011044624A (ja) 2009-08-24 2011-03-03 Hitachi Ltd 半導体装置および車載用交流発電機
US20110210283A1 (en) * 2010-02-24 2011-09-01 Ainissa G. Ramirez Low melting temperature alloys with magnetic dispersions
TWI461252B (zh) * 2010-12-24 2014-11-21 Murata Manufacturing Co A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
CN103476539B (zh) * 2011-02-04 2016-08-17 安塔亚技术公司 无铅焊料组合物
WO2012137901A1 (ja) 2011-04-08 2012-10-11 株式会社日本スペリア社 はんだ合金
US9642275B2 (en) 2012-12-25 2017-05-02 Mitsubishi Materials Corporation Power module
JPWO2014142153A1 (ja) * 2013-03-13 2017-02-16 株式会社日本スペリア社 はんだ接合物及びはんだ接合方法
KR102273620B1 (ko) * 2013-10-31 2021-07-06 알파 어셈블리 솔루션스 인크. 무연, 무은 솔더 합금
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN104972241B (zh) * 2015-07-30 2017-11-10 好利来（中国）电子科技股份有限公司 锡锌铜系高温无铅焊锡
JP6330786B2 (ja) 2015-11-16 2018-05-30 トヨタ自動車株式会社 半導体装置の製造方法
JP6234488B2 (ja) * 2016-02-05 2017-11-22 株式会社リソー技研 無鉛はんだ
JP6203894B1 (ja) 2016-03-31 2017-09-27 株式会社寺岡製作所 粘着テープ及びその製造方法
JP7287606B2 (ja) * 2018-08-10 2023-06-06 株式会社日本スペリア社 鉛フリーはんだ合金
TW202403062A (zh) * 2018-12-27 2024-01-16 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手
KR20220038675A (ko) * 2019-08-05 2022-03-29 가부시키가이샤 니혼슈페리어샤 땜납-금속메시 복합재 및 그 제조방법
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手

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US3481795A (en) * 1965-08-09 1969-12-02 Westinghouse Electric Corp Thermoelectric device including tin solder with particles of iron,cobalt or nickel
US4248905A (en) * 1980-01-21 1981-02-03 General Motors Corporation Tin-base body solder
US4358884A (en) * 1980-10-20 1982-11-16 General Motors Corporation Tin-base body solder
US4506822A (en) * 1982-03-18 1985-03-26 The United States Of America As Represented By The United States Department Of Energy Method for brazing together planar and nonplanar metal members
JPS62230493A (ja) * 1986-03-31 1987-10-09 Taruchin Kk はんだ合金
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JPH0234295A (ja) * 1988-07-19 1990-02-05 Jw Harris Co Inc ソルダーコンポジション及びその使用方法
US5094700A (en) * 1990-03-22 1992-03-10 University Of Cincinnati Solder and brazing alloys having improved properties and method of preparation
US5066544A (en) * 1990-08-27 1991-11-19 U.S. Philips Corporation Dispersion strengthened lead-tin alloy solder
US5125574A (en) * 1990-10-09 1992-06-30 Iowa State University Research Foundation Atomizing nozzle and process
JP3186178B2 (ja) * 1992-03-06 2001-07-11 田中電子工業株式会社 半導体素子用のはんだバンプ形成材料
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5429689A (en) * 1993-09-07 1995-07-04 Ford Motor Company Lead-free solder alloys
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100659890B1 (ko) * 2001-06-28 2006-12-20 센주긴조쿠고교 가부시키가이샤 무연 땜납합금
KR100453074B1 (ko) * 2002-03-18 2004-10-15 삼성전자주식회사 무연 솔더 합금

Also Published As

Publication number Publication date
CA2288817A1 (en) 1999-09-30
HK1026390A1 (en) 2000-12-15
KR100377232B1 (ko) 2003-03-26
EP0985486B1 (en) 2004-07-21
AU4119799A (en) 1999-10-18
JP3152945B2 (ja) 2001-04-03
ID22854A (id) 1999-12-09
US6180055B1 (en) 2001-01-30
EP0985486A1 (en) 2000-03-15
DE69918758T2 (de) 2004-11-25
EP0985486A4 (en) 2003-01-02
DE69918758D1 (de) 2004-08-26
MY114845A (en) 2003-01-31
JP2007203373A (ja) 2007-08-16
CA2288817C (en) 2005-07-26
AU757312B2 (en) 2003-02-13
WO1999048639A1 (fr) 1999-09-30
ES2224609T3 (es) 2005-03-01
TW411731B (en) 2000-11-11

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