IL115501A0 - Alloy solder clad substrate - Google Patents

Alloy solder clad substrate

Info

Publication number
IL115501A0
IL115501A0 IL11550195A IL11550195A IL115501A0 IL 115501 A0 IL115501 A0 IL 115501A0 IL 11550195 A IL11550195 A IL 11550195A IL 11550195 A IL11550195 A IL 11550195A IL 115501 A0 IL115501 A0 IL 115501A0
Authority
IL
Israel
Prior art keywords
alloy solder
clad substrate
solder clad
substrate
alloy
Prior art date
Application number
IL11550195A
Other versions
IL115501A (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IL115501A0 publication Critical patent/IL115501A0/en
Publication of IL115501A publication Critical patent/IL115501A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IL115501A 1994-12-02 1995-10-02 Alloy solder clad substrate IL115501A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/348,427 US5623127A (en) 1994-12-02 1994-12-02 Single alloy solder clad substrate

Publications (2)

Publication Number Publication Date
IL115501A0 true IL115501A0 (en) 1996-01-19
IL115501A IL115501A (en) 1998-04-05

Family

ID=23368005

Family Applications (1)

Application Number Title Priority Date Filing Date
IL115501A IL115501A (en) 1994-12-02 1995-10-02 Alloy solder clad substrate

Country Status (7)

Country Link
US (1) US5623127A (en)
EP (1) EP0797908B1 (en)
JP (1) JPH10509842A (en)
DE (1) DE69523175T2 (en)
IL (1) IL115501A (en)
TW (1) TW365108B (en)
WO (1) WO1996017502A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957370A (en) * 1997-01-10 1999-09-28 Integrated Device Technology, Inc. Plating process for fine pitch die in wafer form
JP2007044701A (en) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd Lead-free solder material
WO2016208006A1 (en) 2015-06-24 2016-12-29 株式会社メイコー Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
EP3226282A1 (en) 2016-03-31 2017-10-04 Techni Holding AS Non-eutectic bonding method with formation of a solid solution with a porous structure with a second phase dispersed therein and corresponding joint
DE102016225239B4 (en) 2016-12-16 2024-09-12 Vitesco Technologies Germany Gmbh Method for producing an electronic component and electronic component

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
CA964891A (en) * 1972-01-24 1975-03-25 Frederick H. Driscoll Germanium infrared window seals
US4767471A (en) * 1986-10-03 1988-08-30 Texas Instruments Incorporated Delayed reflow alloy mix solder paste
JPH01266987A (en) * 1988-04-19 1989-10-24 Senju Metal Ind Co Ltd Creamy solder and its soldering method
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5233504A (en) * 1990-12-06 1993-08-03 Motorola, Inc. Noncollapsing multisolder interconnection
US5154341A (en) * 1990-12-06 1992-10-13 Motorola Inc. Noncollapsing multisolder interconnection
US5178965A (en) * 1992-02-14 1993-01-12 Rockwell International Corporation Uniform solder coating on roughened substrate
US5458281A (en) * 1994-06-30 1995-10-17 International Business Machines Corporation Method for removing meltable material from a substrate

Also Published As

Publication number Publication date
JPH10509842A (en) 1998-09-22
IL115501A (en) 1998-04-05
TW365108B (en) 1999-07-21
EP0797908B1 (en) 2001-10-10
EP0797908A1 (en) 1997-10-01
EP0797908A4 (en) 1999-05-06
WO1996017502A1 (en) 1996-06-06
DE69523175T2 (en) 2002-06-06
US5623127A (en) 1997-04-22
DE69523175D1 (en) 2001-11-15

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees