DE69918758D1 - Bleifreies lot - Google Patents

Bleifreies lot

Info

Publication number
DE69918758D1
DE69918758D1 DE69918758T DE69918758T DE69918758D1 DE 69918758 D1 DE69918758 D1 DE 69918758D1 DE 69918758 T DE69918758 T DE 69918758T DE 69918758 T DE69918758 T DE 69918758T DE 69918758 D1 DE69918758 D1 DE 69918758D1
Authority
DE
Germany
Prior art keywords
lead
lot
free
free lot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918758T
Other languages
English (en)
Other versions
DE69918758T2 (de
Inventor
Tetsuro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27309154&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69918758(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of DE69918758D1 publication Critical patent/DE69918758D1/de
Application granted granted Critical
Publication of DE69918758T2 publication Critical patent/DE69918758T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Conductive Materials (AREA)
DE69918758T 1998-03-26 1999-03-15 Bleifreie Lötlegierung Expired - Lifetime DE69918758T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP10014198 1998-03-26
JP10014198 1998-03-26
JP32448298 1998-10-28
JP32448398 1998-10-28
JP32448298 1998-10-28
JP32448398 1998-10-28
PCT/JP1999/001229 WO1999048639A1 (fr) 1998-03-26 1999-03-15 Soudure sans plomb

Publications (2)

Publication Number Publication Date
DE69918758D1 true DE69918758D1 (de) 2004-08-26
DE69918758T2 DE69918758T2 (de) 2004-11-25

Family

ID=27309154

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918758T Expired - Lifetime DE69918758T2 (de) 1998-03-26 1999-03-15 Bleifreie Lötlegierung

Country Status (13)

Country Link
US (1) US6180055B1 (de)
EP (1) EP0985486B1 (de)
JP (2) JP3152945B2 (de)
KR (1) KR100377232B1 (de)
AU (1) AU757312B2 (de)
CA (1) CA2288817C (de)
DE (1) DE69918758T2 (de)
ES (1) ES2224609T3 (de)
HK (1) HK1026390A1 (de)
ID (1) ID22854A (de)
MY (1) MY114845A (de)
TW (1) TW411731B (de)
WO (1) WO1999048639A1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP3036636B1 (ja) * 1999-02-08 2000-04-24 日本アルミット株式会社 無鉛半田合金
JP3312618B2 (ja) * 2000-02-03 2002-08-12 千住金属工業株式会社 はんだ槽へのはんだの追加供給方法
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
EP1439024B1 (de) * 2001-08-30 2005-03-30 Sumida Corporation Bleifreie lötlegierung und diese verwendende elektronischen teile
US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
KR100453074B1 (ko) * 2002-03-18 2004-10-15 삼성전자주식회사 무연 솔더 합금
US6840434B2 (en) * 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US20040141873A1 (en) * 2003-01-22 2004-07-22 Tadashi Takemoto Solder composition substantially free of lead
US7193326B2 (en) * 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4569423B2 (ja) 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
JP4890221B2 (ja) * 2006-12-06 2012-03-07 株式会社日本スペリア社 ダイボンド材
JP4364928B2 (ja) 2007-04-13 2009-11-18 積水化学工業株式会社 導電性微粒子、異方性導電材料及び導電接続構造体
EP2139009B1 (de) * 2007-04-13 2013-06-26 Sekisui Chemical Co., Ltd. Elektroleitfähige feinpartikel, anisotropes elektroleitfähiges material und elektroleitfähige verbindungsstruktur
JP5331322B2 (ja) * 2007-09-20 2013-10-30 株式会社日立製作所 半導体装置
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
EP2243590B1 (de) * 2008-02-22 2020-04-15 Nihon Superior Sha Co., Ltd Verfahren zur regulierung der nickelkonzentration in einem bleifreien nickelhaltigen lot
KR20120102803A (ko) * 2008-03-05 2012-09-18 센주긴조쿠고교 가부시키가이샤 납프리 땜납 접속 구조체 및 땜납 볼
JP2011044624A (ja) 2009-08-24 2011-03-03 Hitachi Ltd 半導体装置および車載用交流発電機
US20110210283A1 (en) * 2010-02-24 2011-09-01 Ainissa G. Ramirez Low melting temperature alloys with magnetic dispersions
TWI461252B (zh) * 2010-12-24 2014-11-21 Murata Manufacturing Co A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
JP2014509944A (ja) * 2011-02-04 2014-04-24 アンタヤ・テクノロジーズ・コープ 無鉛はんだ組成物
WO2012137901A1 (ja) 2011-04-08 2012-10-11 株式会社日本スペリア社 はんだ合金
JP5598592B2 (ja) * 2012-12-25 2014-10-01 三菱マテリアル株式会社 パワーモジュール
US10329642B2 (en) * 2013-03-13 2019-06-25 Nihon Superior Co., Ltd. Solder alloy and joint thereof
BR112016009750B1 (pt) * 2013-10-31 2021-05-25 Alpha Metals, Inc. ligas de solda livres de prata, livres de chumbo
CN114161023A (zh) 2014-04-30 2022-03-11 日本斯倍利亚股份有限公司 无铅焊料合金
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN104972241B (zh) * 2015-07-30 2017-11-10 好利来（中国）电子科技股份有限公司 锡锌铜系高温无铅焊锡
JP6330786B2 (ja) 2015-11-16 2018-05-30 トヨタ自動車株式会社 半導体装置の製造方法
JP6234488B2 (ja) * 2016-02-05 2017-11-22 株式会社リソー技研 無鉛はんだ
JP6203894B1 (ja) 2016-03-31 2017-09-27 株式会社寺岡製作所 粘着テープ及びその製造方法
JP7287606B2 (ja) * 2018-08-10 2023-06-06 株式会社日本スペリア社 鉛フリーはんだ合金
TWI820277B (zh) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手
US20220281035A1 (en) * 2019-08-05 2022-09-08 Nihon Superior Co., Ltd. Solder-metal mesh composite material and method for producing same
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481795A (en) * 1965-08-09 1969-12-02 Westinghouse Electric Corp Thermoelectric device including tin solder with particles of iron,cobalt or nickel
US4248905A (en) * 1980-01-21 1981-02-03 General Motors Corporation Tin-base body solder
US4358884A (en) * 1980-10-20 1982-11-16 General Motors Corporation Tin-base body solder
US4506822A (en) * 1982-03-18 1985-03-26 The United States Of America As Represented By The United States Department Of Energy Method for brazing together planar and nonplanar metal members
JPS62230493A (ja) * 1986-03-31 1987-10-09 Taruchin Kk はんだ合金
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JPH0234295A (ja) * 1988-07-19 1990-02-05 Jw Harris Co Inc ソルダーコンポジション及びその使用方法
US5094700A (en) * 1990-03-22 1992-03-10 University Of Cincinnati Solder and brazing alloys having improved properties and method of preparation
US5066544A (en) * 1990-08-27 1991-11-19 U.S. Philips Corporation Dispersion strengthened lead-tin alloy solder
US5125574A (en) * 1990-10-09 1992-06-30 Iowa State University Research Foundation Atomizing nozzle and process
JP3186178B2 (ja) * 1992-03-06 2001-07-11 田中電子工業株式会社 半導体素子用のはんだバンプ形成材料
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5429689A (en) * 1993-09-07 1995-07-04 Ford Motor Company Lead-free solder alloys
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH106075A (ja) * 1996-06-13 1998-01-13 Nippon Handa Kk 無鉛ハンダ合金
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP3600899B2 (ja) * 1996-11-05 2004-12-15 トピー工業株式会社 耐酸化特性を有する無鉛はんだ
JPH10144718A (ja) * 1996-11-14 1998-05-29 Fukuda Metal Foil & Powder Co Ltd スズ基鉛フリーハンダワイヤー及びボール
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
DE19752215A1 (de) * 1997-03-11 1998-09-17 Fraunhofer Ges Forschung Lötverbindung
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys

Also Published As

Publication number Publication date
HK1026390A1 (en) 2000-12-15
EP0985486A4 (de) 2003-01-02
CA2288817C (en) 2005-07-26
ID22854A (id) 1999-12-09
MY114845A (en) 2003-01-31
WO1999048639A1 (fr) 1999-09-30
US6180055B1 (en) 2001-01-30
CA2288817A1 (en) 1999-09-30
EP0985486B1 (de) 2004-07-21
KR100377232B1 (ko) 2003-03-26
TW411731B (en) 2000-11-11
KR20010012869A (ko) 2001-02-26
DE69918758T2 (de) 2004-11-25
ES2224609T3 (es) 2005-03-01
AU757312B2 (en) 2003-02-13
JP3152945B2 (ja) 2001-04-03
EP0985486A1 (de) 2000-03-15
JP2007203373A (ja) 2007-08-16
AU4119799A (en) 1999-10-18

Similar Documents

Publication Publication Date Title
DE69918758D1 (de) Bleifreies lot
ATE341990T1 (de) Sigmidoskop
ID29066A (id) Turunan fenilglisina
ID27423A (id) Turunan kuinolin
DE59901560D1 (de) Retrograder tibianagel
DE59902874D1 (de) Buchsenkontakt
ID23234A (id) Turunan-turunan benzosulfona
ID27484A (id) Turunan adenosina
DE59907306D1 (de) Fadenchangierung
ID27547A (id) Turunan kuinolin
ID23761A (id) Trisiklik tersubstitusi
DE59906931D1 (de) Exzenterzahnradgetriebe
DE59903966D1 (de) Exzenterzahnradgetriebe
ATE262513T1 (de) Benzoylpyridazine
ID23219A (id) Trisiklik tersubstitusi
DE59903106D1 (de) Tripode-gleichlaufdrehgelenk
DE59901046D1 (de) Methylcyclotetradec-5-en-1-one
DE59807217D1 (de) Nadellager
DE1118098T1 (de) Mehrfachflussigelektrosprühschnittstelle
DE59808995D1 (de) Endomikroskopsystem
DE19842103B4 (de) Stanznietzuführung
ID28356A (id) Turunam tiazola
NO20004740L (no) Paroksetinblandinger
DE59902088D1 (de) Achrathermer Reimager
DE59903616D1 (de) Rollenwicklerwalze

Legal Events

Date Code Title Description
8364 No opposition during term of opposition