TW528638B - Lead-free solders - Google Patents
Lead-free solders Download PDFInfo
- Publication number
- TW528638B TW528638B TW089121619A TW89121619A TW528638B TW 528638 B TW528638 B TW 528638B TW 089121619 A TW089121619 A TW 089121619A TW 89121619 A TW89121619 A TW 89121619A TW 528638 B TW528638 B TW 528638B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- free solders
- bismuth
- antimony
- indium
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/417,169 US6176947B1 (en) | 1998-12-31 | 1999-10-12 | Lead-free solders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW528638B true TW528638B (en) | 2003-04-21 |
Family
ID=23652856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089121619A TW528638B (en) | 1999-10-12 | 2000-10-12 | Lead-free solders |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN1208168C (zh) |
| HK (1) | HK1039916B (zh) |
| SG (1) | SG98429A1 (zh) |
| TW (1) | TW528638B (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7341949B2 (en) | 2003-08-21 | 2008-03-11 | Siliconware Precision Industries Co., Ltd. | Process for forming lead-free bump on electronic component |
| US7776651B2 (en) | 2003-03-31 | 2010-08-17 | Intel Corporation | Method for compensating for CTE mismatch using phase change lead-free super plastic solders |
| TWI812054B (zh) * | 2021-03-10 | 2023-08-11 | 日商千住金屬工業股份有限公司 | 焊料膏、焊接接頭、及外部電極用端子與電極之連接方法 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100351035C (zh) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | 无铅焊料 |
| CN101357423B (zh) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
| CN1803381A (zh) * | 2006-01-11 | 2006-07-19 | 黄守友 | 无铅焊料及其制备方法 |
| CN103962744B (zh) * | 2009-04-20 | 2016-05-18 | 松下知识产权经营株式会社 | 焊锡材料及电子部件接合体 |
| CN103146955B (zh) * | 2013-03-22 | 2015-01-07 | 天津百瑞杰焊接材料有限公司 | 198℃保险丝熔断芯的无铅低温合金及其制备方法 |
| JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| CN103341699A (zh) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | 一种取代锡铅钎料的Sn-In-Ag无铅钎料 |
| JP6135885B2 (ja) * | 2015-05-19 | 2017-05-31 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| JP6230737B1 (ja) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 |
| US11577343B2 (en) * | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
| CN107990708B (zh) * | 2017-11-28 | 2020-09-29 | 乐山新天源太阳能科技有限公司 | 硅片烧结炉内烘干区的传送装置 |
| CN113070606A (zh) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | 一种Sn-Ag-Cu高性能无铅焊料及其制备方法 |
| CN115476069A (zh) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料 |
| CN117139917B (zh) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
| JPH10193171A (ja) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | 半田付け物品 |
| JP3736819B2 (ja) * | 1997-01-17 | 2006-01-18 | 株式会社豊田中央研究所 | 無鉛はんだ合金 |
| JPH10314980A (ja) * | 1997-05-14 | 1998-12-02 | Sony Corp | はんだ材料 |
| US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
-
2000
- 2000-10-11 SG SG200005828A patent/SG98429A1/en unknown
- 2000-10-12 CN CN 00135326 patent/CN1208168C/zh not_active Expired - Lifetime
- 2000-10-12 TW TW089121619A patent/TW528638B/zh not_active IP Right Cessation
-
2002
- 2002-02-27 HK HK02101537.6A patent/HK1039916B/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7776651B2 (en) | 2003-03-31 | 2010-08-17 | Intel Corporation | Method for compensating for CTE mismatch using phase change lead-free super plastic solders |
| US7341949B2 (en) | 2003-08-21 | 2008-03-11 | Siliconware Precision Industries Co., Ltd. | Process for forming lead-free bump on electronic component |
| TWI812054B (zh) * | 2021-03-10 | 2023-08-11 | 日商千住金屬工業股份有限公司 | 焊料膏、焊接接頭、及外部電極用端子與電極之連接方法 |
| US11904416B2 (en) | 2021-03-10 | 2024-02-20 | Senju Metal Industry Co., Ltd. | Solder alloy, solder powder, solder paste and solder joint |
Also Published As
| Publication number | Publication date |
|---|---|
| SG98429A1 (en) | 2003-09-19 |
| CN1208168C (zh) | 2005-06-29 |
| HK1039916B (zh) | 2005-10-14 |
| CN1314229A (zh) | 2001-09-26 |
| HK1039916A1 (en) | 2002-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |