WO2006122240A3 - Tin alloy solder compositions - Google Patents

Tin alloy solder compositions Download PDF

Info

Publication number
WO2006122240A3
WO2006122240A3 PCT/US2006/018235 US2006018235W WO2006122240A3 WO 2006122240 A3 WO2006122240 A3 WO 2006122240A3 US 2006018235 W US2006018235 W US 2006018235W WO 2006122240 A3 WO2006122240 A3 WO 2006122240A3
Authority
WO
WIPO (PCT)
Prior art keywords
alloy composition
lead
tin alloy
tin
alloy solder
Prior art date
Application number
PCT/US2006/018235
Other languages
French (fr)
Other versions
WO2006122240A2 (en
Inventor
Karl F Seelig
Original Assignee
American Iron & Metal Company
Karl F Seelig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Iron & Metal Company, Karl F Seelig filed Critical American Iron & Metal Company
Priority to EP06759560A priority Critical patent/EP1880032A4/en
Priority to CA002607286A priority patent/CA2607286A1/en
Priority to MX2007013971A priority patent/MX2007013971A/en
Publication of WO2006122240A2 publication Critical patent/WO2006122240A2/en
Publication of WO2006122240A3 publication Critical patent/WO2006122240A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises about 0.01% to about 4.5% silver; about 0.01% to about 3% copper; about 0.002% to about 5.0% antimony; about 85% to about 99% tin and about 0.002% to about 1% of either nickel or cobalt. The alloy composition has a melting temperature of about 217° C, with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
PCT/US2006/018235 2005-05-11 2006-05-11 Tin alloy solder compositions WO2006122240A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP06759560A EP1880032A4 (en) 2005-05-11 2006-05-11 Tin alloy solder compositions
CA002607286A CA2607286A1 (en) 2005-05-11 2006-05-11 Tin alloy solder compositions
MX2007013971A MX2007013971A (en) 2005-05-11 2006-05-11 Tin alloy solder compositions.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67986905P 2005-05-11 2005-05-11
US60/679,869 2005-05-11

Publications (2)

Publication Number Publication Date
WO2006122240A2 WO2006122240A2 (en) 2006-11-16
WO2006122240A3 true WO2006122240A3 (en) 2007-02-01

Family

ID=37397305

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/018235 WO2006122240A2 (en) 2005-05-11 2006-05-11 Tin alloy solder compositions

Country Status (5)

Country Link
US (1) US20060263234A1 (en)
EP (1) EP1880032A4 (en)
CA (1) CA2607286A1 (en)
MX (1) MX2007013971A (en)
WO (1) WO2006122240A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051181A1 (en) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. Lead-free solder alloy
WO2009086508A1 (en) * 2008-01-03 2009-07-09 Interplex Nas, Inc. Solder wire construction
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
US9770786B2 (en) * 2010-06-01 2017-09-26 Senju Metal Industry Co., Ltd. Lead-free solder paste
JP5878290B2 (en) * 2010-12-14 2016-03-08 株式会社日本スペリア社 Lead-free solder alloy
MY186064A (en) 2015-05-05 2021-06-18 Indium Corp High reliability lead-free solder alloys for harsh environment electronics applications
CN107635716B (en) * 2015-05-05 2021-05-25 铟泰公司 High reliability lead-free solder alloys for harsh environment electronic device applications
JP6292342B1 (en) * 2017-09-20 2018-03-14 千住金属工業株式会社 Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
CN109014652A (en) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 A kind of environment-friendly type soldering tin material and its preparation process
FR3101561B1 (en) * 2019-10-06 2023-09-22 Pruvost Jean Claude Lucien Lead-free solder alloy called SIA based on Sn and Bi and Cu and Ag additives limited to 1%.
CN114227057B (en) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 Lead-free solder alloy and preparation method and application thereof
WO2024101041A1 (en) * 2022-11-07 2024-05-16 富士電機株式会社 Solder material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US6521176B2 (en) * 1994-09-29 2003-02-18 Fujitsu Limited Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5405577A (en) * 1993-04-29 1995-04-11 Seelig; Karl F. Lead-free and bismuth-free tin alloy solder composition
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US5762716A (en) * 1997-01-09 1998-06-09 American Iron & Metal Company, Inc. Methods for wiping a metal contaminated surface with a water soluble fabric
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
KR20010072364A (en) * 1999-06-11 2001-07-31 이즈하라 요조 Lead-free solder
DE19953670A1 (en) * 1999-11-08 2001-05-23 Euromat Gmbh Solder alloy
JP2004141910A (en) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd Lead-free solder alloy

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US6521176B2 (en) * 1994-09-29 2003-02-18 Fujitsu Limited Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1880032A4 *

Also Published As

Publication number Publication date
MX2007013971A (en) 2008-02-22
EP1880032A2 (en) 2008-01-23
US20060263234A1 (en) 2006-11-23
EP1880032A4 (en) 2009-03-04
CA2607286A1 (en) 2006-11-16
WO2006122240A2 (en) 2006-11-16

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